Shenzhen DeepMaterial Technologies Co., Ltd Resins And Compounds DM-6216

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Shenzhen DeepMaterial Technologies Co., Ltd

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Suppliers

Company

Product

Description

Supplier Links

Shenzhen DeepMaterial Technologies Co., Ltd

Shenzhen, Guangdong, China

Resins And Compounds
DM-6216

Resins And Compounds DM-6216

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Supplier's Site

Technical Specifications

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6216
Product Name	Resins And Compounds
Cure / Technology	Heat Curing

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