Shenzhen DeepMaterial Technologies Co., Ltd Resins And Compounds DM-6216

Description
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
  • Resins And Compounds - DM-6216 - Shenzhen DeepMaterial Technologies Co., Ltd
    Shenzhen DeepMaterial Technologies Co., Ltd
Description
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Suppliers

Company
Product
Description
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Resins And Compounds - DM-6216 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Resins And Compounds
DM-6216
Resins And Compounds DM-6216
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6216
Product Name Resins And Compounds
Cure / Technology Heat Curing
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