Shenzhen DeepMaterial Technologies Co., Ltd Resins And Compounds DM-6216

Name: Resins And Compounds
Brand: Shenzhen DeepMaterial Technologies Co., Ltd

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Suppliers

Company

Product

Description

Supplier Links

Shenzhen, Guangdong, China

Resins And Compounds
DM-6216

Resins And Compounds DM-6216

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Supplier's Site

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6216
Product Name	Resins And Compounds
Cure / Technology	Heat Curing

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Thermon, Inc

Specs

Cure / Technology Single Component

Features Thermally Conductive

Use Temperature 32 to 2200 F (0 to 1204 C)

Ellsworth Adhesives

Specs

Cure / Technology Two Component

Chemical System Epoxy

Substrate Compatibility Metal; Paper or Paperboard; Plastic

Kayaku Advanced Materials, Inc.

TE Connectivity

Specs

Chemical System Epoxy