Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light diffusion lenses to LEDs, and assembling image sensing equipment (including camera modules). This material is white to provide greater reflectivity.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | DM-6180 |
| Product Name | Epoxy Resin |
| Cure / Technology | Heat Curing |
