Shenzhen DeepMaterial Technologies Co., Ltd Resins And Compounds DM-6258

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Shenzhen DeepMaterial Technologies Co., Ltd

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

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Company

Product

Description

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Shenzhen DeepMaterial Technologies Co., Ltd

Shenzhen, Guangdong, China

Resins And Compounds
DM-6258

Resins And Compounds DM-6258

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Supplier's Site

Technical Specifications

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6258
Product Name	Resins And Compounds
Cure / Technology	Heat Curing

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