Shenzhen DeepMaterial Technologies Co., Ltd Resins And Compounds DM-6258

Name: Resins And Compounds
Brand: Shenzhen DeepMaterial Technologies Co., Ltd

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Suppliers

Company

Product

Description

Supplier Links

Shenzhen, Guangdong, China

Resins And Compounds
DM-6258

Resins And Compounds DM-6258

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Supplier's Site

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6258
Product Name	Resins And Compounds
Cure / Technology	Heat Curing

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