Shenzhen DeepMaterial Technologies Co., Ltd Resins And Compounds DM-6258

Name: Resins And Compounds
Brand: Shenzhen DeepMaterial Technologies Co., Ltd

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Description

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Suppliers

Company

Product

Description

Supplier Links

Shenzhen, Guangdong, China

Resins And Compounds
DM-6258

Resins And Compounds DM-6258

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

Supplier's Site

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6258
Product Name	Resins And Compounds
Cure / Technology	Heat Curing

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Beijing Grish Hitech Co., Ltd.

Specs

Cure / Technology Thermoset; Two Component

Chemical System Epoxy

Type / Form Liquid

RS Components, Ltd.

Specs

Industry General Purpose

ELANTAS North America LLC

Specs

Cure / Technology Two Component

Chemical System Epoxy

Features Sealant

Beacon Adhesives, Inc.