Shenzhen DeepMaterial Technologies Co., Ltd Pressure sensitive rubber base Moisture curing Hot Melt Adhesive DM-6581

Description
High initial tack, high stickiness, excellent resistance to plasticization, used in film labels
Description
High initial tack, high stickiness, excellent resistance to plasticization, used in film labels

Suppliers

Company
Product
Description
Supplier Links
Pressure sensitive rubber base Moisture curing Hot Melt Adhesive - DM-6581 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Pressure sensitive rubber base Moisture curing Hot Melt Adhesive
DM-6581
Pressure sensitive rubber base Moisture curing Hot Melt Adhesive DM-6581
High initial tack, high stickiness, excellent resistance to plasticization, used in film labels

High initial tack, high stickiness, excellent resistance to plasticization, used in film labels

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6581
Product Name Pressure sensitive rubber base Moisture curing Hot Melt Adhesive
Cure / Technology Thermoplastic / Hot Melt; Contact or Pressure Sensitive Adhesives
Unlock Full Specs
to access all available technical data

Similar Products

Two Component Thermally Conductive Epoxy System - EP21TDCANHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy; Polyurethane
Composition Filled
View Details
Formulations - Applications - Bonding - Ultrabond 787 - 378730 - Hernon Manufacturing, Inc.
Specs
Cure / Technology UV or Radiation Cured
Chemical System Vinyl
Substrate Compatibility Ceramic, Glass; Metal; Plastic; Variety of substrates including glass, many plastics and most metals
View Details
SC2000FG Thermal Film 5.0W/mk - Unit - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Features Thermally Conductive
Industry Electronics
View Details