Shenzhen DeepMaterial Technologies Co., Ltd Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6525

Name: Reactive polyurethane Moisture curing Hot Melt Adhesive
Brand: Shenzhen DeepMaterial Technologies Co., Ltd

Description

Low viscosity, suitable for bonding with extremely narrow frame.

Description

Low viscosity, suitable for bonding with extremely narrow frame.

Suppliers

Company

Product

Description

Supplier Links

Shenzhen, Guangdong, China

Reactive polyurethane Moisture curing Hot Melt Adhesive
DM-6525

Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6525

Low viscosity, suitable for bonding with extremely narrow frame.

Supplier's Site

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6525
Product Name	Reactive polyurethane Moisture curing Hot Melt Adhesive
Cure / Technology	Thermoplastic / Hot Melt; Reactive or Moisture Cured

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Hernon Manufacturing, Inc.

Specs

Cure / Technology Room Temperature Vulcanizing or Curing

Features Threadlocker or Retainer

Substrate Compatibility Metal; Metallic or non-metallic substrates

Beacon Adhesives, Inc.

Thermon, Inc

Specs

Cure / Technology Single Component

Features Thermally Conductive

Use Temperature 32 to 2200 F (0 to 1204 C)

Dexmet® Corporation, a part of PPG’s engineered materials division

Specs

Cure / Technology Two Component

Chemical System Epoxy; Silicone