Shenzhen DeepMaterial Technologies Co., Ltd UV Moisture Curing Acrylic Acid Adhesive DM-6496

Description
No flow, UV/moisture curing package, suitable for partial circuit board protection. This product has fluorescent characteristics in ultraviolet (black). It is mainly used for partial protection of WLCSP and BGA on circuit boards.
Description
No flow, UV/moisture curing package, suitable for partial circuit board protection. This product has fluorescent characteristics in ultraviolet (black). It is mainly used for partial protection of WLCSP and BGA on circuit boards.

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UV Moisture Curing Acrylic Acid Adhesive - DM-6496 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
UV Moisture Curing Acrylic Acid Adhesive
DM-6496
UV Moisture Curing Acrylic Acid Adhesive DM-6496
No flow, UV/moisture curing package, suitable for partial circuit board protection. This product has fluorescent characteristics in ultraviolet (black). It is mainly used for partial protection of WLCSP and BGA on circuit boards.

No flow, UV/moisture curing package, suitable for partial circuit board protection. This product has fluorescent characteristics in ultraviolet (black). It is mainly used for partial protection of WLCSP and BGA on circuit boards.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6496
Product Name UV Moisture Curing Acrylic Acid Adhesive
Cure / Technology UV or Radiation Cured; Reactive or Moisture Cured
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