Shenzhen DeepMaterial Technologies Co., Ltd UV Thermally Curing Adhesive + heat accelerator DM-6425

Description
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.
Description
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.

Suppliers

Company
Product
Description
Supplier Links
UV Thermally Curing Adhesive + heat accelerator - DM-6425 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
UV Thermally Curing Adhesive + heat accelerator
DM-6425
UV Thermally Curing Adhesive + heat accelerator DM-6425
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.

In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6425
Product Name UV Thermally Curing Adhesive + heat accelerator
Cure / Technology Thermoplastic / Hot Melt; UV or Radiation Cured
Substrate Compatibility Ceramic, Glass; Metal
Industry Electronics
Unlock Full Specs
to access all available technical data

Similar Products

Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
Felt Glue -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
Specs
Substrate Compatibility Felt to: Felt, Chenille Stems, Feathers, Glitter, Pom Poms, Trims, Pipe Cleaners and more.
View Details
Dymax Ultra Light-Weld® 9-20269 UV Curing Adhesive Clear 1 L Bottle - 9-20269 1 LITER BOTTLE - Ellsworth Adhesives
Specs
Cure / Technology Single Component
Viscosity 25000 to 200000 cP
Tensile (Break) 2600 psi (17926 KPa)
View Details
1-Part, General Purpose, RTV Silicone Adhesive Sealant - AS1821 - CHT USA Inc.
Specs
Cure / Technology Single Component; Acetone
Chemical System Silicone
Features Sealant
View Details