Shenzhen DeepMaterial Technologies Co., Ltd UV Thermally Curing Adhesive + heat accelerator DM-6425

Description
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.
Description
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.

Suppliers

Company
Product
Description
Supplier Links
UV Thermally Curing Adhesive + heat accelerator - DM-6425 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
UV Thermally Curing Adhesive + heat accelerator
DM-6425
UV Thermally Curing Adhesive + heat accelerator DM-6425
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.

In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it highly resistant to vibration and impact.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6425
Product Name UV Thermally Curing Adhesive + heat accelerator
Cure / Technology Thermoplastic / Hot Melt; UV or Radiation Cured
Substrate Compatibility Ceramic, Glass; Metal
Industry Electronics
Unlock Full Specs
to access all available technical data

Similar Products

Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Light-Curable Materials, Bonding, Metal Bonding, 6-630-T -  - Dymax
Specs
Cure / Technology UV or Radiation Cured
Substrate Compatibility Ceramic, Glass; Metal; ABS; PEEK; PEI; PSU; PVC; AL; Stainless Steel; Glass
Industry automotive latch assembly, potting, and bonding glass fixtures and furniture.
View Details