Shenzhen DeepMaterial Technologies Co., Ltd Pressure sensitive rubber base Moisture curing Hot Melt Adhesive DM-6582

Description
Suitable for all kinds of low temperature applications above -25°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold storage labels
Description
Suitable for all kinds of low temperature applications above -25°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold storage labels

Suppliers

Company
Product
Description
Supplier Links
Pressure sensitive rubber base Moisture curing Hot Melt Adhesive - DM-6582 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Pressure sensitive rubber base Moisture curing Hot Melt Adhesive
DM-6582
Pressure sensitive rubber base Moisture curing Hot Melt Adhesive DM-6582
Suitable for all kinds of low temperature applications above -25°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold storage labels

Suitable for all kinds of low temperature applications above -25°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold storage labels

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6582
Product Name Pressure sensitive rubber base Moisture curing Hot Melt Adhesive
Cure / Technology Thermoplastic / Hot Melt; Contact or Pressure Sensitive Adhesives
Unlock Full Specs
to access all available technical data

Similar Products

Thermally silicone pad for AI - SF1200 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature -58 to 257 F (-50 to 125 C)
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details
Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
Light-Curable Materials, Metal Bonding, 6-621-VT -  - Dymax
Specs
Cure / Technology UV or Radiation Cured
Substrate Compatibility Metal; ABS; EP; PA; Phenolic plastic; CER; AL; CU; GL; CRS; Stainless Steel
Industry coil winding, metal-to-glass bonding, as well as potting.
View Details