Henkel Corporation - Industrial Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. LOCTITE® PC 3466 (known as LOCTITE FIXMASTER ALUMINUM LIQUID) is a gray, 2-part, room temperature-cure, pourable epoxy system heavily... | |
| BERGQUIST GAP FILLER TGF 1000, Thermally conductive vibration dampening, Two-component, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1000 is a thermally conductive, liquid gap filling material. It is supplied... | |
| BERGQUIST GAP FILLER TGF 1000SR, Thermally conductive vibration dampening, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1000SR is a two-part, thermally conductive, liquid gap filling material that features... | |
| BERGQUIST GAP FILLER TGF 1100SF, Thermally Conductive, Silicone-Free, Two-part, Low Modulus, Liquid Gap Filling Material BERGQUIST® GAP FILLER TGF 1100SF is the thermal solution for silicone-sensitive applications. The material is... | |
| BERGQUIST GAP FILLER TGF 1400SL, Thermally conductive, Silicone based, Two-part, Low Viscosity, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone based, liquid gap... | |
| BERGQUIST GAP FILLER TGF 1450, Two part, High performance, Thermally conductive liquid gap filling material BERGQUIST® GAP FILLER TGF 1450 is a high performance thermally conductive liquid gap filling material... | |
| BERGQUIST GAP FILLER TGF 1500, Two-part, High performance, Thermally conductive vibration dampening, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive liquid gap... | |
| BERGQUIST GAP FILLER TGF 1500LVO, Thermally conductive, Two-part, High performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1500LVO is a two-part, high performance, thermally conductive, liquid gap filling material. | |
| BERGQUIST GAP FILLER TGF 2000, Thermally Conductive, High Performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 2000 is a high performance, thermally conductive liquid gap filling material supplied as... | |
| BERGQUIST GAP FILLER TGF 3010APS, a 2 part, 3.0 W/m-K, Silicone Free Gap Filler with High Dispense Rate. BERGQUIST® GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable... | |
| BERGQUIST GAP FILLER TGF 3500LVO, Thermally Conductive, Low Outgassing, Two-part Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3500LVO is a two-part, high thermal conductivity, liquid gap filling material. This... | |
| BERGQUIST GAP FILLER TGF 3600, Thermally Conductive, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3600 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high... | |
| BERGQUIST GAP FILLER TGF 4000, Thermally Conductive, Two-part, High Performance, Liquid, Gap Filler Material BERGQUIST® GAP FILLER TGF 4000 is a two-part, high performance, thermally conductive, liquid gap filling material. | |
| BERGQUIST GAP PAD 2202SF, Silicone-Free, High Performance Thermally Conductive, Fiberglass Carrier, Silicone Free, Polymer Pad BERGQUIST® GAP PAD® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. | |
| BERGQUIST GAP PAD TGP 1000VOUS, Ultra Conformable, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure... | |
| BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum... | |
| BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 1300 is a highly compliant Gap Pad material that is ideal for... | |
| BERGQUIST GAP PAD TGP 1300U, Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material BERGQUIST® GAP PAD TGP 1300U is a robust, highly compliant product that is ideal for both... | |
| BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material BERGQUIST® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile... | |
| BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains... | |
| BERGQUIST GAP PAD TGP 1500R, Thermally Conductive, Reinforced Gap Filling Material BERGQUIST® GAP PAD TGP 1500R has the same highly conformable, low-modulus polymer as the standard GAP PAD TGP 1500. | |
| BERGQUIST GAP PAD TGP 2000, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications that require a mid to high... | |
| BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforce d gap filling... | |
| BERGQUIST GAP PAD TGP 3000M, 3 W/m-K, Low Modulus Gap Pad with exceptional thermal performance at low pressures BERGQUIST® GAP PAD TGP 3000M is a soft gap filling material specially... | |
| BERGQUIST GAP PAD TGP 3004SF, High Performance, Thermally Conductive Material With Silicone-Free, Polymer Pad BERGQUIST® GAP PAD TGP 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST... | |
| BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material... | |
| BERGQUIST GAP PAD TGP 5000, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforce d, Gap Filling Material BERGQUIST® GAP PAD® TGP 5000 is a fiberglass-reinforce d filler and polymer featuring... | |
| BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a... | |
| BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat... | |
| BERGQUIST GAP PAD TGP A2600, Thermally Conductive, Filled-polymer Laminate, Electrically Isolating, Reinforced Gap Filling Material BERGQUIST® GAP PAD® TGP A2600 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing... | |
| BERGQUIST GAP PAD TGP EMI1000, Thermally Conductive, Conformable EMI Absorbing Material BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and... | |
| BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator... | |
| BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal... | |
| BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and... | |
| BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and... | |
| BERGQUIST HI FLOW THF 1600G, Fiberglass-Reinforce d, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1600G consists of a thermally conductive 55°C phase change compound coated on a fiberglass... | |
| BERGQUIST HI FLOW THF 1600P, Electrically Insulating, Thermally Conductive Phase Change Material BERGQUIST® HI FLOW THF 1600P consists of a thermally conductive 55°C phase change compound coated on a thermally... | |
| BERGQUIST HI FLOW THF 3000UT, Tacky, High Performance, Un-Reinforced Phase Change TIM BERGQUIST® HI FLOW THF 3000UT is a naturally tacky, thermally conductive phase change material which is supplied in... | |
| BERGQUIST HI FLOW THF 700FT, Reworkable, Pressure Sensitive Phase Change Material BERGQUIST® HI FLOW THF 700FT reworkable thermal interface material provides a low thermal resistance path between hot components such... | |
| BERGQUIST HI FLOW THF 900, Phase Change Coated Aluminum BERGQUIST® HI FLOW® THF 900 is a phase change material coated on both sides of an aluminum substrate. It is designed... | |
| BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has... | |
| BERGQUIST LIQUI BOND TLB SA1800, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND® TLB SA1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. | |
| BERGQUIST LIQUI BOND TLB SA200, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding... | |
| BERGQUIST LIQUI BOND TLB SA3500, Thermally Conductive, Two-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA3500 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a... | |
| BERGQUIST LIQUI FORM TLF 2000, Thermally Conductive, One-Part, Liquid Formable Material BERGQUIST® LIQUI FORM TLF 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a... | |
| BERGQUIST LIQUI FORM TLF LF3500, Thermally Conductive, One-Part, Liquid Formable Gel Material BERGQUIST® LIQUI FORM TLF LF3500 is a high conductivity gel thermal interface material designed for demanding applications that... | |
| BERGQUIST SIL PAD TSP 1416, a highly thermally conductive, electrically insulating silicone elastomeric material BERGQUIST® SIL PAD TSP 1416 is a highly thermally conductive, electrically insulating silicone elastomeric material. Excellent... | |
| BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforce d, Silicone-based Insulator The true workhorse of the SIL PAD product family, BERGQUIST® SIL PAD TSP 1600S thermally conductive insulation material, is designed for... | |
| BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforce d, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforce d thermal interface material featuring... | |
| BERGQUIST SIL PAD TSP 1800ST, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material BERGQUIST® SIL PAD TSP 1800ST is a fiberglass reinforced thermal interface material that is naturally tacky on... | |
| BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and... | |
| BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between... | |
| BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between... | |
| Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear... | |
| LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity... | |
| LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high... | |
| LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension... | |
| LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses... | |
| LOCTITE ABLESTIK 2700HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2700HT die attach adhesive is designed for Pbfree array packaging. This adhesive is ideal for small needle dispensing in SiP... | |
| LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not... | |
| LOCTITE ABLESTIK 550K, Epoxy Film, Assembly LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding High thermal conductivity Low cure temperature Suitable for an array of difficult-to-bond... | |
| LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It... | |
| LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive... | |
| LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material... | |
| LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured... | |
| LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or... | |
| LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced... | |
| LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and... | |
| LOCTITE ABLESTIK ABP 8038, Acrylate, Die attach LOCTITE® ABLESTIK ABP 8038 die attach adhesive is designed for high reliability leadframe packaging applications. This adhesive is formulated to eliminate silver migration... | |
| LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment... | |
| LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability... | |
| LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity... | |
| LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF... | |
| LOCTITE ABLESTIK FS 849-T, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a... | |
| LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. | |
| LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is... | |
| LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant LOCTITE® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. | |
| LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant LOCTITE® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is... | |
| LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended... | |
| LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal... | |
| LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. | |
| LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not... | |
| LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating LOCTITE® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly... | |
| LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulatin g compound. This material was designed... | |
| LOCTITE TCF 1000, Phase Change, Thermal Management LOCTITE® TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of heat... | |
| LOCTITE TCF 2000 AF, Phase Change, Thermal Management LOCTITE® TCF 2000 AF phase-change thermal interface material is suitable for use between a heat sink and a variety of heat generating... | |
| LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental... | |
| White to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified... |