Henkel Corporation - Industrial Datasheets for Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more

Product Name Notes
Metal Rebuilding Material 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. LOCTITE® PC 3466 (known as LOCTITE FIXMASTER ALUMINUM LIQUID) is a gray, 2-part, room temperature-cure, pourable epoxy system heavily...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 1000, Thermally conductive vibration dampening, Two-component, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1000 is a thermally conductive, liquid gap filling material. It is supplied...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 1000SR, Thermally conductive vibration dampening, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1000SR is a two-part, thermally conductive, liquid gap filling material that features...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 1100SF, Thermally Conductive, Silicone-Free, Two-part, Low Modulus, Liquid Gap Filling Material BERGQUIST® GAP FILLER TGF 1100SF is the thermal solution for silicone-sensitive applications. The material is...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 1400SL, Thermally conductive, Silicone based, Two-part, Low Viscosity, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone based, liquid gap...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 1450, Two part, High performance, Thermally conductive liquid gap filling material BERGQUIST® GAP FILLER TGF 1450 is a high performance thermally conductive liquid gap filling material...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 1500, Two-part, High performance, Thermally conductive vibration dampening, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive liquid gap...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 1500LVO, Thermally conductive, Two-part, High performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1500LVO is a two-part, high performance, thermally conductive, liquid gap filling material.
Thermal Interface Materials BERGQUIST GAP FILLER TGF 2000, Thermally Conductive, High Performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 2000 is a high performance, thermally conductive liquid gap filling material supplied as...
Thermal Gap Fillers BERGQUIST GAP FILLER TGF 3010APS, a 2 part, 3.0 W/m-K, Silicone Free Gap Filler with High Dispense Rate. BERGQUIST® GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 3500LVO, Thermally Conductive, Low Outgassing, Two-part Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3500LVO is a two-part, high thermal conductivity, liquid gap filling material. This...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 3600, Thermally Conductive, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3600 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high...
Thermal Interface Materials BERGQUIST GAP FILLER TGF 4000, Thermally Conductive, Two-part, High Performance, Liquid, Gap Filler Material BERGQUIST® GAP FILLER TGF 4000 is a two-part, high performance, thermally conductive, liquid gap filling material.
Thermal Interface Materials BERGQUIST GAP PAD 2202SF, Silicone-Free, High Performance Thermally Conductive, Fiberglass Carrier, Silicone Free, Polymer Pad BERGQUIST® GAP PAD® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material.
Thermal Interface Materials BERGQUIST GAP PAD TGP 1000VOUS, Ultra Conformable, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure...
Thermal Interface Materials BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum...
Thermal Interface Materials BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 1300 is a highly compliant Gap Pad material that is ideal for...
Thermal Interface Materials BERGQUIST GAP PAD TGP 1300U, Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material BERGQUIST® GAP PAD TGP 1300U is a robust, highly compliant product that is ideal for both...
BERGQUIST GAP PAD TGP 1350 BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material BERGQUIST® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component...
Thermal Interface Materials BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains...
Thermal Interface Materials BERGQUIST GAP PAD TGP 1500R, Thermally Conductive, Reinforced Gap Filling Material BERGQUIST® GAP PAD TGP 1500R has the same highly conformable, low-modulus polymer as the standard GAP PAD TGP 1500.
Thermal Interface Materials BERGQUIST GAP PAD TGP 2000, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications that require a mid to high...
Thermal Interface Materials BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material,...
BERGQUIST GAP PAD TGP 3000M BERGQUIST GAP PAD TGP 3000M, 3 W/m-K, Low Modulus Gap Pad with exceptional thermal performance at low pressures BERGQUIST® GAP PAD TGP 3000M is a soft gap filling material specially...
Thermal Interface Materials BERGQUIST GAP PAD TGP 3004SF, High Performance, Thermally Conductive Material With Silicone-Free, Polymer Pad BERGQUIST® GAP PAD TGP 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST...
Thermal Interface Materials BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material...
Thermal Interface Materials BERGQUIST GAP PAD TGP 5000, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforced, Gap Filling Material BERGQUIST® GAP PAD® TGP 5000 is a fiberglass-reinforced filler and polymer featuring a high...
Thermal Interface Materials BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a...
Thermal Interface Materials BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat...
Thermal Interface Materials BERGQUIST GAP PAD TGP A2600, Thermally Conductive, Filled-polymer Laminate, Electrically Isolating, Reinforced Gap Filling Material BERGQUIST® GAP PAD® TGP A2600 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing...
Thermal Interface Materials BERGQUIST GAP PAD TGP EMI1000, Thermally Conductive, Conformable EMI Absorbing Material BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and...
Thermal Interface Materials BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator...
Thermal Interface Materials BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal...
Phase Change Materials BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and...
Phase Change Materials BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and...
Phase Change Materials BERGQUIST HI FLOW THF 1600G, Fiberglass-Reinforced, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1600G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web.
Phase Change Materials BERGQUIST HI FLOW THF 1600P, Electrically Insulating, Thermally Conductive Phase Change Material BERGQUIST® HI FLOW THF 1600P consists of a thermally conductive 55°C phase change compound coated on a thermally...
Phase Change Materials BERGQUIST HI FLOW THF 3000UT, Tacky, High Performance, Un-Reinforced Phase Change TIM BERGQUIST® HI FLOW THF 3000UT is a naturally tacky, thermally conductive phase change material which is supplied in...
Phase Change Materials BERGQUIST HI FLOW THF 700FT, Reworkable, Pressure Sensitive Phase Change Material BERGQUIST® HI FLOW THF 700FT reworkable thermal interface material provides a low thermal resistance path between hot components such...
Phase Change Materials BERGQUIST HI FLOW THF 900, Phase Change Coated Aluminum BERGQUIST® HI FLOW® THF 900 is a phase change material coated on both sides of an aluminum substrate. It is designed...
Thermally Conductive Adhesives BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has...
Thermally Conductive Adhesives BERGQUIST LIQUI BOND TLB SA1800, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND® TLB SA1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer.
Thermal Interface Materials BERGQUIST LIQUI BOND TLB SA200, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding...
Thermally Conductive Adhesives BERGQUIST LIQUI BOND TLB SA3500, Thermally Conductive, Two-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA3500 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a...
Thermally Conductive Adhesives BERGQUIST LIQUI FORM TLF 6000 thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of...
Thermally Conductive Adhesives BERGQUIST LIQUI FORM TLF LF3500, Thermally Conductive, One-Part, Liquid Formable Gel Material BERGQUIST® LIQUI FORM TLF LF3500 is a high conductivity gel thermal interface material designed for demanding applications that...
Thermally Conductive Adhesives BERGQUIST LIQUI FORM TLF 2000, Thermally Conductive, One-Part, Liquid Formable Material BERGQUIST® LIQUI FORM TLF 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between...
Thermal Interface Materials BERGQUIST SIL PAD TSP 1416, a highly thermally conductive, electrically insulating silicone elastomeric material BERGQUIST® SIL PAD TSP 1416 is a highly thermally conductive, electrically insulating silicone elastomeric material. Excellent...
Thermal Interface Materials BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforced, Silicone-based Insulator The true workhorse of the SIL PAD product family, BERGQUIST® SIL PAD TSP 1600S thermally conductive insulation material, is designed for a...
Thermal Interface Materials BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforced, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforced thermal interface material featuring a smooth,...
Thermal Interface Materials BERGQUIST SIL PAD TSP 1800ST, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material BERGQUIST® SIL PAD TSP 1800ST is a fiberglass reinforced thermal interface material that is naturally tacky on...
Thermal Interface Materials BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and...
Thermally Conductive Adhesives BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between...
Thermally Conductive Adhesives BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between...
LOCTITE 315 Blue, self-shimming thermally conductive, 1-part, highly viscous, modified acrylic adhesive paste for bonding electrical components to heat sinks. LOCTITE® 315 is a blue, 1-part, self-shimming, thermally conductive, highly viscous, modified...
Encapsulants Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear...
Electrically Non-Conductive Adhesives LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity...
Die Attach Adhesives LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high...
Industrial Adhesives LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension...
Industrial Adhesives LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses...
Industrial Adhesives LOCTITE ABLESTIK 2700HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2700HT die attach adhesive is designed for Pbfree array packaging. This adhesive is ideal for small needle dispensing in SiP...
Industrial Adhesives LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not...
Industrial Adhesives LOCTITE ABLESTIK 550K, Epoxy Film, Assembly LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding High thermal conductivity Low cure temperature Suitable for an array of difficult-to-bond...
Industrial Adhesives LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It...
Electrically Non-Conductive Adhesives LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive...
Industrial Adhesives LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material...
Electrically Non-Conductive Adhesives LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured...
Die Attach Adhesives LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or...
Electrically Non-Conductive Adhesives LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced...
Industrial Adhesives LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and...
Industrial Adhesives LOCTITE ABLESTIK ABP 8038, Acrylate, Die attach LOCTITE® ABLESTIK ABP 8038 die attach adhesive is designed for high reliability leadframe packaging applications. This adhesive is formulated to eliminate silver migration...
Industrial Adhesives LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment...
Electrically Conductive Adhesives LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability...
Electrically Non-Conductive Adhesives LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity...
Industrial Adhesives LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF...
Industrial Adhesives LOCTITE ABLESTIK FS 849-T, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a...
Industrial Adhesives LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity.
Encapsulants LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is...
Potting Compounds LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant LOCTITE® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations.
Encapsulants LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant LOCTITE® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is...
Encapsulants LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended...
Encapsulants LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal...
Encapsulants LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating.
Encapsulants LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not...
Encapsulants LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating LOCTITE® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly...
Encapsulants LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for...
Industrial Adhesives LOCTITE TCF 1000, Phase Change, Thermal Management LOCTITE® TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of heat...
Phase Change Materials LOCTITE TCF 2000 AF, Phase Change, Thermal Management LOCTITE® TCF 2000 AF phase-change thermal interface material is suitable for use between a heat sink and a variety of heat generating...
Industrial Adhesives LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental...
Structural Adhesives White to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified...