Henkel Corporation - Industrial Datasheets for Leveling and Filling Compounds
Leveling and filling compounds are used to level surfaces, fill cavities, and shim or set machinery. They often have filling and sealing properties.
Leveling and Filling Compounds: Learn more
| Product Name | Notes |
|---|---|
| 2-part dimethacrylate ester repair kit with a 1-part release agent which is used for repairing stripped threaded assemblies in a variety of metals and wood. LOCTITE® PC 3967 (known as... | |
| 2-part epoxy metal repair compound heavily reinforced with aluminum powder. Its ideal for repairing non-structural defects in aluminum castings. LOCTITE® PC 7254 is a gray, 2-part epoxy metal repair compound... | |
| 2-part industrial grade epoxy adhesive. It cures at room temperature to form a tough bondline with excellent resistance to peel and impact forces. LOCTITE® EA E-120HP is an amber-beige, 2-part,... | |
| 2-part, grey, non-sagging, steel reinforced epoxy repair putty that cures to a metal-like finish and can be machined, drilled, tapped or filed. LOCTITE® EA 3471 is a 2-part, grey, non-sagging... | |
| 2-part, rapid curing, polyurethane joint filler. It is a self-leveling, 100% solids, low viscosity, flexible system. LOCTITE® PC 6231 is a gray, 2-part, rapid curing, polyurethane joint filler. It is... | |
| 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. LOCTITE® EA E-40HT is an off-white, 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive... | |
| 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. LOCTITE® PC 3466 (known as LOCTITE FIXMASTER ALUMINUM LIQUID) is a gray, 2-part, room temperature-cure, pourable epoxy system heavily... | |
| 2-part, thick aggregate-filled liquid epoxy system designed for grouting up to 6 in (150 mm) deep, including self-leveling applications. LOCTITE® PC 9626 is a black, 2-part, thick aggregate-filled liquid epoxy... | |
| 2-part, unique, steel-filled epoxy repair compound that is fast to mix and apply. Once hardened, it can be machined, drilled, tapped or filed. LOCTITE® PC 3965 (known as LOCTITE FIXMASTER... | |
| 2-part, yellowish, polyurethane-based casting resin, NSF approved, formulated especially for spiral wound filters (RO) and application to dry substrates. Two component polyurethane adhesive. Macroplast® UK 178A with 178B is a... | |
| Aggregate-filled liquid epoxy system designed for grouting up to 18 in (46 cm) deep, including self-leveling applications under rails and sole plates. LOCTITE® PC 9422 is a red, 2-part, thick,... | |
| Alkoxy silicone liquid for potting that will cure at room temperature or at elevated temperatures. LOCTITE® SI 5620 is a clear, 2-part, alkoxy silicone liquid for potting that will cure... | |
| An anaerobic sealant specifically designed for sealing and retaining engine cup plugs. | |
| BERGQUIST GAP FILLER TGF 1000, Thermally conductive vibration dampening, Two-component, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1000 is a thermally conductive, liquid gap filling material. It is supplied... | |
| BERGQUIST GAP FILLER TGF 1000SR, Thermally conductive vibration dampening, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1000SR is a two-part, thermally conductive, liquid gap filling material that features... | |
| BERGQUIST GAP FILLER TGF 1100SF, Thermally Conductive, Silicone-Free, Two-part, Low Modulus, Liquid Gap Filling Material BERGQUIST® GAP FILLER TGF 1100SF is the thermal solution for silicone-sensitive applications. The material is... | |
| BERGQUIST GAP FILLER TGF 1400SL, Thermally conductive, Silicone based, Two-part, Low Viscosity, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone based, liquid gap... | |
| BERGQUIST GAP FILLER TGF 1450, Two part, High performance, Thermally conductive liquid gap filling material BERGQUIST® GAP FILLER TGF 1450 is a high performance thermally conductive liquid gap filling material... | |
| BERGQUIST GAP FILLER TGF 1500, Two-part, High performance, Thermally conductive vibration dampening, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive liquid gap... | |
| BERGQUIST GAP FILLER TGF 1500LVO, Thermally conductive, Two-part, High performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1500LVO is a two-part, high performance, thermally conductive, liquid gap filling material. | |
| BERGQUIST GAP FILLER TGF 2000, Thermally Conductive, High Performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 2000 is a high performance, thermally conductive liquid gap filling material supplied as... | |
| BERGQUIST GAP FILLER TGF 3010APS, a 2 part, 3.0 W/m-K, Silicone Free Gap Filler with High Dispense Rate. BERGQUIST® GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable... | |
| BERGQUIST GAP FILLER TGF 3500LVO, Thermally Conductive, Low Outgassing, Two-part Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3500LVO is a two-part, high thermal conductivity, liquid gap filling material. This... | |
| BERGQUIST GAP FILLER TGF 3600, Thermally Conductive, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3600 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high... | |
| BERGQUIST GAP FILLER TGF 4000, Thermally Conductive, Two-part, High Performance, Liquid, Gap Filler Material BERGQUIST® GAP FILLER TGF 4000 is a two-part, high performance, thermally conductive, liquid gap filling material. | |
| BERGQUIST GAP PAD 2202SF, Silicone-Free, High Performance Thermally Conductive, Fiberglass Carrier, Silicone Free, Polymer Pad BERGQUIST® GAP PAD® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. | |
| BERGQUIST GAP PAD TGP 1000VOUS, Ultra Conformable, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure... | |
| BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum... | |
| BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 1300 is a highly compliant Gap Pad material that is ideal for... | |
| BERGQUIST GAP PAD TGP 1300U, Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material BERGQUIST® GAP PAD TGP 1300U is a robust, highly compliant product that is ideal for both... | |
| BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material BERGQUIST® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile... | |
| BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains... | |
| BERGQUIST GAP PAD TGP 1500R, Thermally Conductive, Reinforced Gap Filling Material BERGQUIST® GAP PAD TGP 1500R has the same highly conformable, low-modulus polymer as the standard GAP PAD TGP 1500. | |
| BERGQUIST GAP PAD TGP 2000, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications that require a mid to high... | |
| BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforce d gap filling... | |
| BERGQUIST GAP PAD TGP 3000M, 3 W/m-K, Low Modulus Gap Pad with exceptional thermal performance at low pressures BERGQUIST® GAP PAD TGP 3000M is a soft gap filling material specially... | |
| BERGQUIST GAP PAD TGP 3004SF, High Performance, Thermally Conductive Material With Silicone-Free, Polymer Pad BERGQUIST® GAP PAD TGP 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST... | |
| BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material... | |
| BERGQUIST GAP PAD TGP 5000, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforce d, Gap Filling Material BERGQUIST® GAP PAD® TGP 5000 is a fiberglass-reinforce d filler and polymer featuring... | |
| BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a... | |
| BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat... | |
| BERGQUIST GAP PAD TGP A2600, Thermally Conductive, Filled-polymer Laminate, Electrically Isolating, Reinforced Gap Filling Material BERGQUIST® GAP PAD® TGP A2600 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing... | |
| BERGQUIST GAP PAD TGP EMI1000, Thermally Conductive, Conformable EMI Absorbing Material BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and... | |
| BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator... | |
| BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal... | |
| BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and... | |
| BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and... | |
| BERGQUIST HI FLOW THF 1400P, Electrically Insulating, High Performance, Thermally Conductive Phase Change Material BERGQUIST® HI FLOW® THF 1400P is a thermally conductive phase change material featuring a natural tack... | |
| BERGQUIST HI FLOW THF 1500P, Electrically Insulating, High Performance, Thermally Conductive Phase Change Material BERGQUIST® HI FLOW THF 1500P is a thermally conductive phase change material, reinforced with a polyimide... | |
| BERGQUIST HI FLOW THF 1600G, Fiberglass-Reinforce d, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1600G consists of a thermally conductive 55°C phase change compound coated on a fiberglass... | |
| BERGQUIST HI FLOW THF 1600P, Electrically Insulating, Thermally Conductive Phase Change Material BERGQUIST® HI FLOW THF 1600P consists of a thermally conductive 55°C phase change compound coated on a thermally... | |
| BERGQUIST HI FLOW THF 3000UT, Tacky, High Performance, Un-Reinforced Phase Change TIM BERGQUIST® HI FLOW THF 3000UT is a naturally tacky, thermally conductive phase change material which is supplied in... | |
| BERGQUIST HI FLOW THF 700FT, Reworkable, Pressure Sensitive Phase Change Material BERGQUIST® HI FLOW THF 700FT reworkable thermal interface material provides a low thermal resistance path between hot components such... | |
| BERGQUIST HI FLOW THF 900, Phase Change Coated Aluminum BERGQUIST® HI FLOW® THF 900 is a phase change material coated on both sides of an aluminum substrate. It is designed... | |
| BERGQUIST LIQUI BOND TLB SA200, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding... | |
| BERGQUIST SIL PAD TSP 1416, a highly thermally conductive, electrically insulating silicone elastomeric material BERGQUIST® SIL PAD TSP 1416 is a highly thermally conductive, electrically insulating silicone elastomeric material. Excellent... | |
| BERGQUIST SIL PAD TSP 1500, Electrically Insulating, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1500 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the... | |
| BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforce d, Silicone-based Insulator The true workhorse of the SIL PAD product family, BERGQUIST® SIL PAD TSP 1600S thermally conductive insulation material, is designed for... | |
| BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforce d, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforce d thermal interface material featuring... | |
| BERGQUIST SIL PAD TSP 1800ST, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material BERGQUIST® SIL PAD TSP 1800ST is a fiberglass reinforced thermal interface material that is naturally tacky on... | |
| BERGQUIST SIL PAD TSP 900, The Original Fiberglass-reinforce d, Silicone Based Insulator BERGQUIST® SIL PAD TSP 900 is a composite of silicone rubber and fiberglass. The material is flame retardant... | |
| BERGQUIST SIL PAD TSP A2000, Electrically Insulating, Silicone based, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD® TSP A2000 is a silicone-based thermally conductive and electrically insulating material. It consists of... | |
| BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K1100 is a medium performance, film-based thermally conductive insulator. The film is coated with... | |
| BERGQUIST SIL PAD TSP K1300, High Performance, Film reinforced, Silicone based Insulator BERGQUIST®SIL PAD TSP K1300 is a high performance insulator. It combines special film with a filled silicone rubber. | |
| BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and... | |
| BERGQUIST SIL PAD TSP PP1200, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PP1200 is a fiberglass-based insulator coated with a filled polyester resin. The material offers superior thermal... | |
| BERGQUIST SIL PAD TSP PP900, Polyester-Based, Fiberglass- reinforced, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PP900 is a fiberglass-reinforce d insulator coated with a filled polyester resin. BERGQUIST SIL... | |
| BERGQUIST SIL PAD TSP PPK1300, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PPK1300 is a composite of film coated with a polyester resin. The material offers superior thermal... | |
| Composite fabric used in combination with resins, LOCTITE PC 7210 or LOCTITE PC 7211, as a composite repair system to repair and protect metal pipes. LOCTITE® PC 5085 is a... | |
| Fluorescent, methacrylate ester acrylic, wax-like, semi-solid retaining compound self-feeding stick designed for bonding of cylindrical fitting parts. LOCTITE® 668 is a green, fluorescent, methacrylate ester acrylic, wax-like, semi-solid retaining compound... | |
| Gasket sealant paste with resin, isopropanol and fillers. It remains pliable and flexible and seals flanges, threaded connections and fasteners. LOCTITE® NS 5109 (known as LOCTITE GASKET MAKER HIGH TEMPERATURE)... | |
| Green, high strength, slow curing methacrylate retaining compound for close fitting press fit and loose fitting slip fit applications. LOCTITE® 675 is a green, very low viscosity, high strength, slow... | |
| High lubricity thread sealant for locking and sealing metal pipes and small fittings with fine threads. LOCTITE® 545 is a pipe thread sealant designed for locking and sealing of metal... | |
| High strength methacrylate ester acrylic retaining compound designed for the bonding of cylindrical fitting parts. LOCTITE® 609 is a green, high strength methacrylate ester acrylic retaining compound designed for the... | |
| High strength, methacrylate ester acrylic liquid designed for the bonding of cylindrical fitting parts, particularly where low viscosity is required. LOCTITE® 680 is a green, high strength, methacrylate ester acrylic... | |
| Highly filled quartz epoxy system designed for restoring old concrete or for the maximum protection of new concrete. LOCTITE® PC 7204 High Performance Quartz is a highly filled quartz epoxy... | |
| Hysol US5501 (formerly LOCTITE® 821200R C) is a 100% solids, mineral filled, urethane adhesive that is very low in volatile components and is flame retardant. This material is designed to... | |
| known as NORTH AMERICA - NORDBAK HP CRUSHER BACKING, is a 2-part epoxy system for backing wear metal. LOCTITE® PC 9020 (known as NORTH AMERICA - NORDBAK HP CRUSHER BACKING)... | |
| LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's | |
| LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique... | |
| LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend... | |
| LOCTITE CAT 27-1 is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is also... | |
| LOCTITE ECCOBOND E 1172 A, Void-free, Epoxy, Underfill LOCTITE® ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This... | |
| LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. Low viscosity Fast flow Excellent wettability Excellent adhesion Ideal for high... | |
| LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change... | |
| LOCTITE ECCOBOND UF 3808, Epoxy, Underfill LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material... | |
| LOCTITE ECCOBOND UF 3810, Epoxy, Underfill LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to... | |
| LOCTITE STYCAST 2850 MT is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is... | |
| LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant LOCTITE® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. | |
| LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and... | |
| LOCTITE STYCAST US 2350, Urethane, High Speed Sealing, Potting and Encapsulating LOCTITE® STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot... | |
| LOCTITE STYCAST US 5529, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 5529 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is... | |
| LOCTITE STYCAST US 5544, Potting and Encapsulating LOCTITE® STYCAST US 5544 is a fast gelling, flexible, flame retardant, mineral-filled, polyurethane compound. It is a fast-setting potting compound which is low... | |
| LOCTITE TCF 2000 AF, Phase Change, Thermal Management LOCTITE® TCF 2000 AF phase-change thermal interface material is suitable for use between a heat sink and a variety of heat generating... | |
| Loctite® Bearing Mount Stick - High Temperature, a revolutionary method to bond non-threaded, cylindrical metal assemblies, this unique wax-like stick works just like Loctite Bearing Mount liquids to secure parts,... | |
| Loctite® Fixmaster® Crack Filler, a two-component, natural in color, epoxy repair adhesive that is 100% solids and contains no solvents. It has excellent workability and flow. Fills cracks in concrete,... | |
| LOCTITE® SI 5640 is a 2K self-leveling silicone potting solution with a V-O rating and an improved adhesion to plastics, while it maintains adhesive properties under 85C / 85% RH... | |
| LOCTITE® Fixmaster Fast Set Grout is a self-leveling, non-shrinking grout for installing machinery and setting anchor bolts. Cures quickly and can be poured up to 1" thick. Compression strength and... | |
| Loctite® Fixmaster® Instant Belt Repair, a single-component, heat-curing material for fast, temporary belt repairs. Requires no priming. Equipment can be operated in 30 minutes. | |
| Loctite® Fixmaster® Self Leveling Flooring Epoxy, Resin is a high gloss, seamless, hygienic surface. High chemical resistance, extremely hard wearing and durable. | |
| Loctite® Fixmaster® Wet Surface Repair Putty. Use this unique, trowelable epoxy to repair and rebuild wet, even underwater surfaces. Bonds to most metals, concrete, and some plastics. | |
| Metal Rebuilding Material | |
| Methacrylate ester acrylic retaining compound. Its lubricating properties facilitate assembly when heavy interference or high torque values are used. LOCTITE® 232 is a brown, opaque, methacrylate ester acrylic retaining compound. | |
| Non-toxic, non-flammable leak detection aerosol for the emergency repair of pressurized gas and compressed air systems. LOCTITE® SF 7100 is a leak detection product for emergency repairs on pressurized gas... | |
| Retaining Compound - high strength. Gap filling. For repair of worn-out seats, keys, splines, bearings or tapers without remachining. LOCTITE® 660 is designed for the bonding of cylindrical fitting parts,... | |
| Retaining Compound - high strength. General purpose. Fast curing. LOCTITE® 638 is designed for the bonding of cylindrical fitting parts, particularly where bond gaps can approach 0.25 mm. The product... | |
| Retaining Compound - high strength. High temperature resistance. LOCTITE® 620 is designed for the bonding of cylindrical fitting parts. The product cures when confined in the absence of air between... | |
| Retaining Compound - high strength. Ideal for bearings. For use on close-fitting cylindrical parts. High oil tolerance. LOCTITE® 603 is a high-strength retaining compound. Designed for the bonding of cylindrical... | |
| Retaining Compound - medium strength. If disassembly is required. Ideal for parts that need subsequent dismantling. LOCTITE® 641 is designed for the bonding of cylindrical fitting parts, particularly where disassembly... | |
| Retaining compound which is typically used for holding gears and sprockets onto gearbox shafts and rotors on electric motor shafts. LOCTITE® 648 is a green, fluorescent, low viscosity, high strength,... | |
| Self-fusing silicone rubber wrap for temporary repairs on flexible hoses and pipes. Resistant to UV light, salt water, fuels and acids. LOCTITE® SI 5075 is a non-sticky, self-fusing, multi-purpose wrap... | |
| TEROSON® RB 477 ANTI-FLUTTER is a heat curing, solvent-free, metal-to-metal mastic adhesive that exhibits excellent strength and corrosion resistance at temperature extremes or after extensive aging and weathering. Anti-flutter. Subaru... | |
| Thermally conductive epoxy encapsulant recommended for encapsulation of components that require heat dissipation and thermal shock properties. LOCTITE® STYCAST 2850FT is a black, thermally conductive epoxy encapsulant recommended for encapsulation... | |
| Thixotropic acrylic methacrylate ester liquid adhesive designed for the bonding of cylindrical fitting parts. LOCTITE® 6001 is a rose beige to off-white thixotropic acrylic methacrylate ester liquid adhesive designed for... | |
| Thixotropic, methacrylate ester acrylic thread sealant liquid designed for threaded fittings commonly found in hydraulic and pneumatic systems. LOCTITE® 5452 is a purple, thixotropic, methacrylate ester acrylic thread sealant liquid... | |
| Thread sealant liquid with polymeric material, fillers and isopropyl alcohol, designed for sealing threaded plastic pipes, pipe fittings and flanges. LOCTITE® MR 5438 (known as LOCTITE NO MORE LEAKS) is... | |
| To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing... | |
| Transparent, 2-part silicone potting compound offering quick curing performance. Highly flexible and resistant to thermal and mechanical shock. LOCTITE® SI 5623 is a transparent, 2-part, alkoxy silicone, potting compound liquid... | |
| Underfills | |
| Urethane liquid designed to thoroughly clean rubber, urethane or metal surfaces before priming. LOCTITE® SF 8220 (known as LOCTITE FIXMASTER FLEX CLEANER) is a colorless, urethane liquid designed to thoroughly... | |
| UV-cured alkoxy silicone used for gasketing and sealing that requires a rapid-curing, post-applied sealant that facilitates immediate on-part inspection. LOCTITE® SI 5089 is a straw-colored, medium viscosity, fluorescent UV-cured alkoxy... |