Henkel Adhesive Technologies - Aviation, Space and Rail BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM

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BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications - BERGQUIST GAP PAD TGP 7000ULM - Henkel Adhesive Technologies - Aviation, Space and Rail
Henkel Adhesive Technologies - Aviation, Space and Rail
Bay Point, CA, United States
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. Options and Configurations Sheet size - 8" x 8" Standard Thicknesses - 0,04, 0.06, 0.08, 0.1, 0.125 inch Thermal Conductivity: 7 W/m-K High-compliance, low compression stress Ultra low modulus

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. Options and Configurations Sheet size - 8" x 8" Standard Thicknesses - 0,04, 0.06, 0.08, 0.1, 0.125 inch

  • Thermal Conductivity: 7 W/m-K
  • High-compliance, low compression stress
  • Ultra low modulus
Supplier's Site Datasheet
Thermal Interface Materials - BERGQUIST GAP PAD TGP 7000ULM - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Rocky Hill, CT, United States
Thermal Interface Materials BERGQUIST GAP PAD TGP 7000ULM
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. Options and Configurations Sheet size - 8" x 8" Standard Thicknesses - 0,04, 0.06, 0.08, 0.1, 0.125 inch Benefits Thermal Conductivity: 7 W/m-K High-compliance, low compression stress Ultra low modulus

BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.

BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

Options and Configurations

Sheet size - 8" x 8"

Standard Thicknesses - 0,04, 0.06, 0.08, 0.1, 0.125 inch

Benefits

  • Thermal Conductivity: 7 W/m-K
  • High-compliance, low compression stress
  • Ultra low modulus
Supplier's Site Datasheet

Technical Specifications

  Henkel Adhesive Technologies - Aviation, Space and Rail Henkel Corporation - Industrial
Product Category Industrial Adhesives Encapsulants and Potting Compounds
Product Number BERGQUIST GAP PAD TGP 7000ULM BERGQUIST GAP PAD TGP 7000ULM
Product Name BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications Thermal Interface Materials
Industry OEM or Industrial
Type Thermally Conductive
Use Temperature -76 to 392 F (-60 to 200 C) 140 to 392 F (60 to 200 C)
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