Henkel Corporation - Industrial Datasheets for Adhesive Tapes
Adhesive tapes are used to assemble materials or parts together using a sticky chemical bond. Adhesive tapes are made by coating a backing or carrier (paper, plastic film, cloth, foam or foil) with an adhesive on a web or roll coater.
Adhesive Tapes: Learn more
| Product Name | Notes |
|---|---|
| Black, 1-part, polyurethane-based, moisture curing direct glazing sealant with excellent sag resistance which cures to an elastic product. TEROSON® PU 9096 PL is a black, 1-part, polyurethane-based, moisture curing direct... | |
| Body Repair – Direct glazing adhesive, 1-component polyurethane, primerless. 2 hours safe drive-away time according to FMVSS. TEROSON® MS 9000 PL HMLC is a 1-component primerless silane-modified polymer direct glazing... | |
| Body Repair – Direct glazing adhesive, 1-component polyurethane. Safe drive-away time of 1 hour acc. to FMVSS and 4 hours acc. to European crash test standard. TEROSON® PU 8597 HMLC... | |
| Direct glazing, polyurethane adhesive with a 15 min safe drive-away time according to FMVSS. TEROSON® PU 8599 (known as TEROSTAT 8599 HMLC) is a direct glazing, polyurethane adhesive with a... | |
| LOCTITE ABLESTIK 5020, Epoxy Film, Assembly, Glass Supported Adhesive LOCTITE® ABLESTIK 5020 glass supported adhesive film is a higher purity version of ABLEFILM 550 adhesive film. It is designed for... | |
| LOCTITE ABLESTIK 5074, Epoxy Film, Assembly LOCTITE® ABLESTIK 5074 is designed for bonding materials with mismatched coefficients of thermal expansion. Flexible Reworkable Uniform bondline control Custom preforms available Bonds to... | |
| LOCTITE ABLESTIK 517, Epoxy Film, Assembly LOCTITE® ABLESTIK 517 epoxy film adhesive is developed for microelectronic applications. This adhesive is not recommended for gold plated packages. Tack-free Non-conductive Low temperature... | |
| LOCTITE ABLESTIK 539IA, Epoxy Film, Assembly, Non-conductive Adhesive LOCTITE® ABLESTIK 539IA non-conductive film adhesive is designed for assembly applications. This adhesive film may be die cut to customer specifications. Non-conductive... | |
| LOCTITE ABLESTIK 555, Epoxy Film, Assembly LOCTITE® ABLESTIK 555 adhesive is designed for use in assembly operations Long work life Moisture resistant Custom preforms available | |
| LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be... | |
| LOCTITE ABLESTIK 566, Epoxy Film, Assembly LOCTITE ABLESTIK 566 is designed for bonding materials with mismatched coefficients of thermal expansion. This material is the low temperature curing version of LOCTITE... | |
| LOCTITE ABLESTIK 5662, Epoxy Film, Assembly LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly... | |
| LOCTITE ABLESTIK 570, Epoxy Film, Assembly LOCTITE® ABLESTIK 570 is designed for substrate attach. Thermally conductive High purity | |
| LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts... | |
| LOCTITE ABLESTIK ECF 550X, Epoxy Film, Adhesive Film LOCTITE® ABLESTIK ECF 550X adhesive is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y... | |
| LOCTITE ABLESTIK ECF 561E, Rubberized Epoxy, Assembly, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK ECF 561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients... |