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Henkel Corporation - Industrial Datasheets for Adhesive Tapes

Adhesive tapes are used to assemble materials or parts together using a sticky chemical bond. Adhesive tapes are made by coating a backing or carrier (paper, plastic film, cloth, foam or foil) with an adhesive on a web or roll coater.
Adhesive Tapes: Learn more

Product Name Notes
Black, 1-part, polyurethane-based, moisture curing direct glazing sealant with excellent sag resistance which cures to an elastic product. TEROSON® PU 9096 PL is a black, 1-part, polyurethane-based, moisture curing direct...
Body Repair – Direct glazing adhesive, 1-component polyurethane, primerless. 2 hours safe drive-away time according to FMVSS. TEROSON® MS 9000 PL HMLC is a 1-component primerless silane-modified polymer direct glazing...
Body Repair – Direct glazing adhesive, 1-component polyurethane. Safe drive-away time of 1 hour acc. to FMVSS and 4 hours acc. to European crash test standard. TEROSON® PU 8597 HMLC...
Direct glazing, polyurethane adhesive with a 15 min safe drive-away time according to FMVSS. TEROSON® PU 8599 (known as TEROSTAT 8599 HMLC) is a direct glazing, polyurethane adhesive with a...
LOCTITE ABLESTIK 5020, Epoxy Film, Assembly, Glass Supported Adhesive LOCTITE® ABLESTIK 5020 glass supported adhesive film is a higher purity version of ABLEFILM 550 adhesive film. It is designed for...
LOCTITE ABLESTIK 5074, Epoxy Film, Assembly LOCTITE® ABLESTIK 5074 is designed for bonding materials with mismatched coefficients of thermal expansion. Flexible Reworkable Uniform bondline control Custom preforms available Bonds to...
LOCTITE ABLESTIK 517, Epoxy Film, Assembly LOCTITE® ABLESTIK 517 epoxy film adhesive is developed for microelectronic applications. This adhesive is not recommended for gold plated packages. Tack-free Non-conductive Low temperature...
LOCTITE ABLESTIK 539IA, Epoxy Film, Assembly, Non-conductive Adhesive LOCTITE® ABLESTIK 539IA non-conductive film adhesive is designed for assembly applications. This adhesive film may be die cut to customer specifications. Non-conductive...
LOCTITE ABLESTIK 555, Epoxy Film, Assembly LOCTITE® ABLESTIK 555 adhesive is designed for use in assembly operations Long work life Moisture resistant Custom preforms available
LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be...
LOCTITE ABLESTIK 566, Epoxy Film, Assembly LOCTITE ABLESTIK 566 is designed for bonding materials with mismatched coefficients of thermal expansion. This material is the low temperature curing version of LOCTITE...
LOCTITE ABLESTIK 5662, Epoxy Film, Assembly LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly...
LOCTITE ABLESTIK 570, Epoxy Film, Assembly LOCTITE® ABLESTIK 570 is designed for substrate attach. Thermally conductive High purity
LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts...
LOCTITE ABLESTIK ECF 550X, Epoxy Film, Adhesive Film LOCTITE® ABLESTIK ECF 550X adhesive is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y...
LOCTITE ABLESTIK ECF 561E, Rubberized Epoxy, Assembly, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK ECF 561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients...