Henkel Adhesive Technologies - Aviation, Space and Rail BERGQUIST GAP PAD TGP 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 W/mK. BERGQUIST GAP PAD TGP 5000

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BERGQUIST GAP PAD TGP 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 W/mK. BERGQUIST GAP PAD TGP 5000
BERGQUIST® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides resistance against puncture, shear and tear. It not only exhibits high thermal conductivity but also excellent thermal performance at low pressures. Therefore this product is ideal for high performance applications at low mounting pressures. High thermal conductivity: 5 W/m-K Highly conformable, "S-Class" softness Natural inherent tack reduces interfacial thermal resistance

BERGQUIST® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides resistance against puncture, shear and tear. It not only exhibits high thermal conductivity but also excellent thermal performance at low pressures. Therefore this product is ideal for high performance applications at low mounting pressures.

  • High thermal conductivity: 5 W/m-K
  • Highly conformable, "S-Class" softness
  • Natural inherent tack reduces interfacial thermal resistance
Supplier's Site Datasheet
Thermal Interface Materials - BERGQUIST GAP PAD TGP 5000 - Henkel Corporation - Industrial
Rocky Hill, CT, United States
Thermal Interface Materials BERGQUIST GAP PAD TGP 5000
BERGQUIST GAP PAD TGP 5000, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforce d, Gap Filling Material BERGQUIST® GAP PAD® TGP 5000 is a fiberglass-reinforce d filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. The top side has reduced tack for ease of handling. BERGQUIST GAP PAD TGP 5000 is ideal for high-performance applications at low mounting pressures. Options and Configurations Standard sheet size - 8" x 16" or custom configuration Standard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" Custom made configurations available upon request Benefits High thermal conductivity: 5 W/m-K Highly conformable, "S-Class" softness Natural inherent tack reduces interfacial thermal resistance Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads Fiberglass reinforced for puncture, shear and tear resistance Excellent thermal performance at low pressures

BERGQUIST GAP PAD TGP 5000, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforced, Gap Filling Material

BERGQUIST® GAP PAD® TGP 5000 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. The top side has reduced tack for ease of handling. BERGQUIST GAP PAD TGP 5000 is ideal for high-performance applications at low mounting pressures.

Options and Configurations

Standard sheet size - 8" x 16" or custom configuration
Standard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"

Custom made configurations available upon request

Benefits

  • High thermal conductivity: 5 W/m-K
  • Highly conformable, "S-Class" softness
  • Natural inherent tack reduces interfacial thermal resistance
  • Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Excellent thermal performance at low pressures
Supplier's Site Datasheet

Technical Specifications

  Henkel Adhesive Technologies - Aviation, Space and Rail Henkel Corporation - Industrial
Product Category Industrial Adhesives Thermal Compounds and Thermal Interface Materials
Product Number BERGQUIST GAP PAD TGP 5000 BERGQUIST GAP PAD TGP 5000
Product Name BERGQUIST GAP PAD TGP 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 W/mK. Thermal Interface Materials
Industry OEM or Industrial
Use Temperature -76 to 392 F (-60 to 200 C) 140 to 392 F (60 to 200 C)
Chemical System Silicone
Dielectric Constant 7.5 0.0075
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