BERGQUIST® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides resistance against puncture, shear and tear. It not only exhibits high thermal conductivity but also excellent thermal performance at low pressures. Therefore this product is ideal for high performance applications at low mounting pressures.
BERGQUIST GAP PAD TGP 5000, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforce
BERGQUIST® GAP PAD® TGP 5000 is a fiberglass-reinforce
Options and Configurations
Standard sheet size - 8" x 16" or custom configuration
Standard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"
Custom made configurations available upon request
|Henkel Adhesive Technologies - Aviation, Space and Rail||Henkel Corporation - Industrial|
|Product Category||Industrial Adhesives||Thermal Compounds and Thermal Interface Materials|
|Product Number||BERGQUIST GAP PAD TGP 5000||BERGQUIST GAP PAD TGP 5000|
|Product Name||BERGQUIST GAP PAD TGP 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 W/mK.||Thermal Interface Materials|
|Industry||OEM or Industrial|
|Use Temperature||-76 to 392 F (-60 to 200 C)||140 to 392 F (60 to 200 C)|