Henkel Corporation - Industrial Datasheets for Industrial Adhesives

Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more

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Product Name Notes
1-part, low modulus, flexible, odorless modified silane polymer adhesive used for elastic sealing. It cures to an elastomeric thermoset product. TEROSON® MS 939NA is a black, white or gray, 1-part,...
2-part, industrial, elastic bonding adhesive. Good resistance to fungus, UV light and weathering. High strength and short tack-free time. TEROSON® MS 9399 is a 2-part, high viscosity, thixotropic, industrial elastomeric...
AQUENCE 034-088-050 (5093) is a resin emulsion adhesive designed to bond various filter media to metal wire and chipboard. This product machines well on wheel coaters and exhibits excellent wet...
AQUENCE 034-088-223 (7348H) is an acrylic emulsion adhesive designed for general wet-bond laminating of difficult substrates. It is characterized by its excellent water resistance. All ingredients in Adhesin 45-7348H are...
AQUENCE 485 latex sealer designed for use in the RV industry to seal cutouts in porous substrates such as plywood from wicking moisture. It can be applied by brush or...
AQUENCE AV 452A known as DORUS PL 452A. Water-based pressure sensitive liquid adhesive suitable for bonding fibrous glass, jute and other types of lightweight insulation. AQUENCE® AV 452A (DORUS PL-452A)...
AQUENCE AV 5531 is Henkel's new adhesive for disposable filter assembly and other paper-to-paper laminating applications. This product exhibits high wet tack, fast speed of set, and excellent machinability and...
AQUENCE AV 7595 is a water-based, pressure sensitive adhesive designed for use in high speed lamination of flexible air duct core. It is a UL Recognized Component®. It exhibits excellent...
AQUENCE AV 7597 is a flame-retardant, water-based, pressure sensitive adhesive designed for use in high speed lamination of flexible air duct vapor barriers. It is a UL Recognized Component® and...
AQUENCE AV 7598 is a flame-retardant, water-based, pressure sensitive adhesive designed for use in high speed lamination of flexible air duct vapor barriers. It is a UL® Recognized Component and...
AQUENCE ENV 6135HUV VECTORPATCH is a resin emulsion window gum specially formulated to bond polystyrene films such as Trycite® and Dowfilm® to paper in the production of envelopes. Adhesin 56-6135HUV...
AQUENCE PL 6100BL is a synthetic rubber based contact adhesive with a soft "hand" for upholstery and furniture assembly applications. Dorus 42-6100BL is used with Dorus 92-3200™ acid catalyst in...
AQUENCE PS 7648 is a formulated pressure sensitive, acrylic emulsion adhesive that exhibits very high dry tack and peel strength values. It’s a high solids adhesive product that can be...
AQUENCE WL 5704 is a general purpose, wet-bond laminating adhesive with high wet tack and excellent adhesion to papers and foils. It is used as a facing adhesive to bond...
AQUENCE® CG 3130is a multipurpose adhesive utilized for filter assembly, glue lap and other paper-to-paper laminating applications. This product exhibits a good balance of wet tack, speed of set, ultimate...
BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material BERGQUIST® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile...
BERGQUIST GAP PAD TGP 3000M, 3 W/m-K, Low Modulus Gap Pad with exceptional thermal performance at low pressures BERGQUIST® GAP PAD TGP 3000M is a soft gap filling material specially...
Blue silicone paste gasket maker in an aerosol can, compatible with PVC materials, with a 24 hr cure time. LOCTITE® SI 5019 (known as LOCTITE SUPERFLEX BLUE RTV SILICONE ADHESIVE...
Elastomeric EVA hotmelt adhesive which is highly flexible and has a 60 sec open time for demanding substrates such as rubber and polyethylene. TECHNOMELT® 4046 is a tan-colored, high viscosity,...
Exhibits excellent adhesion to painted metals. Available in bulk containers for high volume processes.
Flame retardant, industrial, elastic bonding adhesive. Demonstrates high strength and vibration damping properties. Excellent weathering resistance. TEROSON® MS 939 FR is an industrial elastomeric bonding adhesive formulated for fire resistance.
General purpose, pressure sensitive hotmelt designed for the manufacture of pre-applied labels, tags and fluff removers. TECHNOMELT® PS 8697 is a general purpose, pressure sensitive hotmelt designed for the manufacture...
High melting thermoplastic hotmelt adhesive based on polyamide. It exhibits good chemical resistance and adhesion to a wide variety of substrates. TECHNOMELT® PA 9069 is a high melting thermoplastic hotmelt...
High performance thermoplastic hotmelt adhesive based on polyamide. This product has good adhesion to a variety of substrates. TECHNOMELT® PA 6240 is a high performance thermoplastic hotmelt adhesive based on...
High strength, high elongation, modified silane polymer adhesive paste used for elastic bonding and sealing. TEROSON® MS 5510 CL is a clear, transparent, high strength, high elongation, modified silane polymer...
Highly versatile, industrial, elastic bonding adhesive with fast skin formation. Also demonstrates high strength and excellent weathering resistance. TEROSON® MS 939 is an industrial elastomeric bonding adhesive that offers high...
Hotmelt adhesive for bonding and low pressure moulding. Suitable for a wide range of substrates with a very short open time for high speed production. TECHNOMELT® PA 6208 BLACK is...
Hotmelt adhesive used for moulding applications with good adhesion for higher temperatures such as automotive underhood. Designed to meet low pressure moulding process requirements. TECHNOMELT® PA673 is an amber-colored, high...
Hotmelt adhesive, highly sustainable and suited to metals and plastics, particularly plasticized PVC. Good resistance to oils and high temperature. TECHNOMELT® PA 6238 is an amber-colored, polyamide hotmelt adhesive formulated...
Hotmelt formulated for spray application which is suitable for bonding expanded polystyrene or urethane foams, corrugated, wood, fabrics and plastics. TECHNOMELT® 0450 hotmelt adhesive is a light yellow polyolefin formulated...
Industrial Adhesives
LOCTITE 3131, Epoxy/Acrylate, Assembly, Dual Cure Adhesive LOCTITE® 3131 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. The maximum performance of this material...
LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W...
LOCTITE 3614, Epoxy, Surface mount adhesive LOCTITE® 3614 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where...
LOCTITE 3616, Epoxy, Surface mount adhesive, Small parts bonding LOCTITE® 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited...
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited...
LOCTITE 3626M, Epoxy, Halogen free, High thermal mechanical strength, Surface mount adhesive LOCTITE® 3626M is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3629C, Epoxy, Surface mount adhesive LOCTITE® 3629C epoxy is formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed provide controlled dot...
LOCTITE 596, Silicone, Gasketing & sealing LOCTITE® 596 cures on exposure to moisture in the air to form a tough, flexible, waterproof, oil-resistant silicone rubber bond. This product resists aging,...
LOCTITE ABLESTIK 104, Epoxy, Assembly LOCTITE® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230ºC.
LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity...
LOCTITE ABLESTIK 16-1LV, Epoxy, General Assembly LOCTITE® ABLESTIK 16-1LV epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. This...
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product...
LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high...
LOCTITE ABLESTIK 2025D, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025D die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates...
LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025DSI die attach adhesive is designed for use in array packaging. Non-conductive High reliability Improved work life
LOCTITE ABLESTIK 2025JH, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2025JH die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates...
LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to...
LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
LOCTITE ABLESTIK 2035SC, Proprietary Hybrid Chemistry, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material...
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for...
LOCTITE ABLESTIK 2053S, Epoxy, Die Attach LOCTITE® ABLESTIK 2053S die attach adhesive is designed for use in array packaging. Low stress Non-conductive
LOCTITE ABLESTIK 2100A, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures...
LOCTITE ABLESTIK 2106T BIPAX, Epoxy, Assembly LOCTITE® ABLESTIK 2106T BIPAX is designed for high strength structural bonding applications. LOCTITE ABLESTIK 2106T BIPAX develops significant properties 1 hour after mixing. Two...
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily...
LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to...
LOCTITE ABLESTIK 2143D, Epoxy, Medium viscosity adhesive, Assembly LOCTITE® ABLESTIK 2143D medium viscosity adhesive is recommended for industrial bonding and sealing applications where toughness, impact resistance and superior mechanical properties...
LOCTITE ABLESTIK 2158 BIPAX, Epoxy, a Two-part Adhesive, Electrically Insulating, Assembly, NCA LOCTITE® ABLESTIK 2158 BIPAX is a two-part adhesive that develops strong, durable high-impact bonds at room temperature which...
LOCTITE ABLESTIK 2200D, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2200D electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. Low stress Snap...
LOCTITE ABLESTIK 2300, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2300 electrically conductive adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the...
LOCTITE ABLESTIK 2332-17, Solventless Epoxy, Assembly LOCTITE® ABLESTIK 2332-17 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It...
LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension...
LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses...
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds...
LOCTITE ABLESTIK 2700HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2700HT die attach adhesive is designed for Pbfree array packaging. This adhesive is ideal for small needle dispensing in SiP...
LOCTITE ABLESTIK 2815A, Acrylate, Die Attach LOCTITE® ABLESTIK 2815A die attach adhesive is designed to minimize thermal resistance between the chip and substrate. It provides improved workability for applications requiring...
LOCTITE ABLESTIK 285 CAT 11, Epoxy, Thermally conductive adhesive LOCTITE® ABLESTIK 285 CAT 11 adhesive is designed for assembly applications that require thermal management. It is also recommended for low...
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties.
LOCTITE ABLESTIK 293-1, Epoxy, General Assembly LOCTITE® ABLESTIK 293-1 is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates. One component - requires no mixing General purpose...
LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing LOCTITE® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach...
LOCTITE ABLESTIK 3119, Epoxy, Bonding LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of...
LOCTITE ABLESTIK 3280, Acrylate, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 3280 electrically conductive die attach adhesive is designed for high reliability package applications . This material offers improved JEDEC...
LOCTITE ABLESTIK 3280T, Acrylate, Die Attach LOCTITE® ABLESTIK 3280T die attach adhesive is designed for high reliability packaging applications. It offers improved JEDEC performance on packages with die sizes <100...
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290...
LOCTITE ABLESTIK 342-3.5, Epoxy, General Assembly LOCTITE® ABLESTIK 342-3.5 epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. LOCTITE...
LOCTITE ABLESTIK 342-37, Epoxy, General Assembly, Thermal shock resistant LOCTITE® ABLESTIK 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties. LOCTITE ABLESTIK 342-37 adhesive may be used...
LOCTITE ABLESTIK 369-3, Epoxy, Die Attach, Polyamine Activated Adhesive LOCTITE® ABLESTIK 369-3 polyamine activated adhesive is designed for general purpose applications. Electrically conductive Ease of use Long work life Moderate...
LOCTITE ABLESTIK 45 CLEAR, Epoxy, Assembly, Controllable Flexibility, Clear, Unfilled Adhesive LOCTITE® ABLESTIK 45 CLEAR is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can...
LOCTITE ABLESTIK 45, Epoxy, Assembly, General purpose, Adhesive LOCTITE® ABLESTIK 45 is designed as a general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to...
LOCTITE ABLESTIK 5020K, Epoxy Film, Assembly, High Purity Adhesive LOCTITE® ABLESTIK 5020K high purity adhesive is designed for substrate attach. Thermally conductive High purity
LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not...
LOCTITE ABLESTIK 550, Epoxy Film, Assembly LOCTITE® ABLESTIK 550 adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during...
LOCTITE ABLESTIK 550K, Epoxy Film, Assembly LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding High thermal conductivity Low cure temperature Suitable for an array of difficult-to-bond...
LOCTITE ABLESTIK 561, Epoxy Film, Assembly LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined...
LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It...
LOCTITE ABLESTIK 564A, Epoxy Film, Assembly LOCTITE® ABLESTIK 564A adhesive film is designed for bonding hybrid substrates into packages. In centrifuge tests, this adhesive passed 15,000 gs. Electrically Insulating High...
LOCTITE ABLESTIK 566K, Epoxy Film, Assembly LOCTITE® ABLESTIK 566K is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. This material is a low temperature cure version of...
LOCTITE ABLESTIK 566KAP, Epoxy Film, Assembly LOCTITE® ABLESTIK 566KAP is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. Extremely flexible Low temperature cure Good insulator
LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly LOCTITE® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to...
LOCTITE ABLESTIK 57C, Epoxy, Assembly LOCTITE® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the...
LOCTITE ABLESTIK 59C, Silicone, Heat cure LOCTITE® ABLESTIK 59C adhesive is designed for applications used at high temperatures which require electrical conductivity and do not need a high bond strength.
LOCTITE ABLESTIK 6200, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 6200 B-stageable adhesive is designed for use in flex or laminated based substrates. This material is ideal for chip scale...
LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive LOCTITE® ABLESTIK 6202C B-stageable adhesive is ideal for chip scale packages where tolerance and bleed need to be minimized.
LOCTITE ABLESTIK 6202C-X, Proprietary Hybrid Chemistry, Die Attach, B-stageable Adhesive LOCTITE® ABLESTIK 6202C-X B-stageable adhesive is ideal for laminate-based packages where tolerance and bleed need to be minimized. This low...
LOCTITE ABLESTIK 64C, Epoxy, Assembly LOCTITE® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea...
LOCTITE ABLESTIK 77-2LTC, Epoxy, Adhesive LOCTITE® ABLESTIK 77-2LTC adhesive is designed for attaching surface mounted devices to printed circuit boards prior to wave solder. Small, uniform dots may be dispensed...
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive...
LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive LOCTITE® ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed...
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material...
LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder...
LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured...
LOCTITE ABLESTIK 8175 is an electrically conductive adhesive for solder replacement and microelectronic interconnect applications.
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and...
LOCTITE ABLESTIK 8200T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200T electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and...
LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and...
LOCTITE ABLESTIK 8290, Epoxy, Die attach LOCTITE® ABLESTIK 8290 electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. It is recommended for die sizes <200 mils...
LOCTITE ABLESTIK 8301, Epoxy hybrid, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8301 electrically conductive die attach adhesive is designed for high reliability package applications. Electrically conductive Thermally conductive Snap...
LOCTITE ABLESTIK 8352L, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8352L electrically conductive die attach adhesive is designed for high reliability package applications. This material is suitable...
LOCTITE ABLESTIK 8352L-G, Epoxy, Die Attach LOCTITE® ABLESTIK 8352L-G die attach adhesive is designed for high reliability packaging applications. This product is particularly suitable for packages in which tight control...
LOCTITE ABLESTIK 8361J, Epoxy, Die attach LOCTITE® ABLESTIK 8361J die attach adhesive is designed for high reliability packaging applications. Electrically conductive High purity Minimal resin bleed Low condensable volatiles Excellent...
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated...
LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be...
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive Black pigmentation for blocking stray light
LOCTITE ABLESTIK 8390, Epoxy, Die attach LOCTITE® ABLESTIK 8390 die attach adhesive has been formulated for use in high throughput die attach applications. It is suitable for die sizes up...
LOCTITE ABLESTIK 8390A, Epoxy, Die attach LOCTITE® ABLESTIK 8390A die attach adhesive has been formulated for use in high throughput die attach applications. This high strength adhesive is intended for...
LOCTITE ABLESTIK 83CJ, Epoxy, Assembly LOCTITE® ABLESTIK 83CJ adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations...
LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand...
LOCTITE ABLESTIK 84-1LMINB, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMINB electrically conductive adhesive is designed for die attach applications. Electrically conductive High purity die attach adhesive Solvent-free
LOCTITE ABLESTIK 84-1LMINB1, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused...
LOCTITE ABLESTIK 84-1LMISR4, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE...
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or...
LOCTITE ABLESTIK 84-3, Epoxy, Die attach LOCTITE® ABLESTIK 84-3 adhesive is designed for medium die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand.
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound...
LOCTITE ABLESTIK 84-3MV, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3MV adhesive is designed for medium die attach applications. This adhesive is ideal for application by stamping or dispensing. Please refer to...
LOCTITE ABLESTIK 84-3MVBTI, Epoxy, Die attach LOCTITE® ABLESTIK 84-3MVBTI adhesive is designed for die attach and hybrid component attach applications. Electrically Insulating Low bleed Long work life Good dispensability
LOCTITE ABLESTIK 8601S25, Epoxy, Die Attach LOCTITE® ABLESTIK 8601S25 die attach adhesive has been formulated for use in high throughput die attach applications Snap curable Medium modulus Low outgassing Conductive...
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced...
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion...
LOCTITE ABLESTIK 958-11, Epoxy, Die attach LOCTITE® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. Non-conductive Stress absorbing
LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of...
LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach LOCTITE® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed...
LOCTITE ABLESTIK 967-1, Epoxy, Die attach LOCTITE® ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. Low temperature cure, electrically conductive paste with reduced risk to delicate...
LOCTITE ABLESTIK 970-1N1, Epoxy, High Strength, General Assembly LOCTITE® ABLESTIK 970-1N1 is a general purpose adhesive which develops high strength on a wide range of substrates General purpose Sag resistant...
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive One component Readily pourable Fast cure...
LOCTITE ABLESTIK ABL 2100A, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high...
LOCTITE ABLESTIK ABL 2288A, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK ABL 2288A die attach adhesive is designed for high reliability leadframe packaging applications. It can be used in a...
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low...
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK ABP 2288A, Proprietary Hybrid Chemistry, Die Attach, Sintering Silver Paste LOCTITE® ABLESTIK ABP 2288A die attach adhesive is designed for use in leadframe applications Low cost Use for...
LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure LOCTITE® ABLESTIK ABP 2450 die attach is formulated for use in high brightness LED manufacturing applications. This material is formulated to have...
LOCTITE ABLESTIK ABP 7000C, Epoxy, Die Attach, Dielectric Adhesive LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package...
LOCTITE ABLESTIK ABP 8035M, Silicone Hydrosilylation, Semiconductor material, Die Attach Adhesive LOCTITE® ABLESTIK ABP 8035M is a Non-conductive die attach adhesive designed for LED die attach applications. This silicone based...
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability...
LOCTITE ABLESTIK ABP 8068TA, Semi-sintering, Semiconductor, Conductive adhesive LOCTITE® ABLESTIK ABP 8068TA is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. This material’s...
LOCTITE ABLESTIK ABP 8068TB, Silver-filled, Semi-sintering, Semiconductor, Conductive adhesive LOCTITE® ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements.
LOCTITE ABLESTIK ABP 8142B3, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8142B3 non-conductive die attach adhesive is designed for MEMs package applications. Low modulus Black pigmentation for blocking light...
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8151D7 non-conductive die attach adhesive is designed for MEMs package applications. Electrically non-conductive Low modulus Low temperature cure...
LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity...
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus...
LOCTITE ABLESTIK ABP 8415, Epoxy, Die attach LOCTITE® ABLESTIK ABP 8415 adhesive is designed for die attach applications. One component Good adhesion Wire bondable Solvent-free
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast...
LOCTITE ABLESTIK ABP 8520E2, Silicone, Die attach LOCTITE® ABLESTIK ABP 8520E2 silver filled, conductive die attach adhesive is specifically designed for use in crystal oscillator manufacturing applications. Low modulus Low...
LOCTITE ABLESTIK C 805-1, Epoxy, Heat cure LOCTITE® ABLESTIK C 805-1 is the lower viscosity version of ECCOBOND C 805. Electrically conductive Thermally conductive Thixotropic Bond strength Good adhesion to...
LOCTITE ABLESTIK C850-6L, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK C850-6L electrically conductive adhesive is designed for LED die bonding and other die attach applications. Electrically conductive One component Low cure...
LOCTITE ABLESTIK C990J 316, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK C990J 316 die attach is versatile and is designed for microelectronic applications. Electrically conductive Good thermal stability Low extractable ionics...
LOCTITE ABLESTIK C990J 584, Epoxy, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK C990J 584 die attach is versatile and is designed for microelectronic applications. One-component Electrically conductive Good thermal stability...
LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique...
LOCTITE ABLESTIK CE 3511PHV, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3511PHV electrically conductive adhesive is designed for circuit assembly applications. Electrically conductive One component Fast cure at high temperatures...
LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive One component Low viscosity No bleed...
LOCTITE ABLESTIK CE 3514-1, Epoxy, Assembly, ECA LOCTITE® ABLESTIK CE 3514-1 is designed for heat sensitive applications requiring a low cure temperature. Please refer to the TDS for alternate cure...
LOCTITE ABLESTIK CE 3520-3, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3520-3 adhesive combines a high elasticity with a good adhesion on a variety of surfaces, making it suitable for...
LOCTITE ABLESTIK CE 8500, Modified epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 8500 is a solventless epoxy adhesive that combines low stress with good adhesion on nearly all surfaces. Electrically...
LOCTITE ABLESTIK CE 8500-S110, Modified Epoxy, Component Assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 8500-S110 is a solventless epoxy adhesive that combines low stress with good adhesion on nearly all...
LOCTITE ABLESTIK CT 5047-2, Epoxy-Amine, Assembly LOCTITE® ABLESTIK CT 5047-2 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics...
LOCTITE ABLESTIK E 3040, Epoxy, Assembly LOCTITE® ABLESTIK E 3040 adhesive is designed for use in automated assembly operations. One component, requires no mixing Fast gel time Low viscosity Fluorescent...
LOCTITE ABLESTIK E 3508 MOD3, Epoxy, Adhesive, Sealant, Assembly LOCTITE® ABLESTIK E 3508 MOD3 epoxy adhesive and sealant is designed for high throughput assembly operations. It is also recommended for...
LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant LOCTITE® ABLESTIK E 3517 is used in applications where a low electrical conductive sealant is required. One component, requires no mixing...
LOCTITE ABLESTIK EO 0206, Epoxy, Adhesive LOCTITE® ABLESTIK EO 0206 epoxy system is designed for use on electronic devices. One component Non-sag Low halogen content
LOCTITE ABLESTIK FDA 2 BIPAX, Epoxy, Medical LOCTITE® ABLESTIK FDA 2 BIPAX is designed for medical device applications. This material bonds offer resistance to water, weather, galvanic action, petroleum solvents,...
LOCTITE ABLESTIK FDA 2T, Epoxy, Medical LOCTITE® ABLESTIK FDA 2T is designed for medical device applications. LOCTITE ABLESTIK FDA 2T bonds offer resistance to water, weather, galvanic action, petroleum solvents,...
LOCTITE ABLESTIK FDA 8, Epoxy, Medical LOCTITE® ABLESTIK FDA 8 is designed for bonding and coating applications. LOCTITE ABLESTIK FDA 8 bonds offer resistance to water and weathering, galvanic action,...
LOCTITE ABLESTIK G 500HF, Epoxy, Assembly LOCTITE® ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. One component Sag resistant Process...
LOCTITE ABLESTIK G 757, Epoxy, Assembly LOCTITE® ABLESTIK G 757 is specially designed to bond automobile headlamp lenses to reflectors. One component Thixotropic Bonds to a wide variety of substrates...
LOCTITE ABLESTIK G 909, Epoxy, Assembly LOCTITE® ABLESTIK G 909 is designed for very high strength structural bonding especially for dissimilar substrates that will be exposed to a wide range...
LOCTITE ABLESTIK ICP 8118, Acrylate, Electrically Conductive Adhesive. LOCTITE® ABLESTIK ICP 8118 is an electrically conductive adhesive designed for applications that require a very fast cure at low temperatures. It...
LOCTITE ABLESTIK ICP 8282, Acrylate, Electrically Conductive Adhesive. LOCTITE® ABLESTIK ICP 8282 is an electrically conductive adhesive designed for applications that require high adhesive strength, flexibility, low silver and a...
LOCTITE ABLESTIK ICP 8311, Acrylate, Electrically Conductive Adhesive LOCTITE® ABLESTIK ICP 8311 is an electrically conductive adhesive designed for applications that require high adhesive strength, flexibility and a very fast...
LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required. One component Oxide filled Low...
LOCTITE ABLESTIK NCA 2200, Acrylated Epoxy, Dual Cure, Assembly LOCTITE® ABLESTIK NCA 2200 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components This product...
LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive LOCTITE® ABLESTIK NCA 2340 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This...
LOCTITE ABLESTIK NCA 2350, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK NCA 2350 is designed for use in heat sensitive devices. Fast cure at low temperature One component Good adhesion
LOCTITE ABLESTIK NCA 2360, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK NCA 2360 is designed for use in heat sensitive devices One component Fast cure at low temperature Good adhesion
LOCTITE ABLESTIK NCA 2380, Acrylated Epoxy, Assembly, Dual Cure Adhesive LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This...
LOCTITE ABLESTIK NCA 3280, Epoxy, Rapid Cure, Non-conductive Adhesive LOCTITE® ABLESTIK NCA 3280 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high...
LOCTITE ABLESTIK NCA 3285, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3285 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in...
LOCTITE ABLESTIK NCA 3710H, High Viscosity, Epoxy, Semiconductor, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3710H high viscosity epoxy adhesive is designed for use in camera module applications. It is formulated to...
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and...
LOCTITE ABLESTIK QMI3555, Silver Glass, Die Attach LOCTITE® ABLESTIK QMI3555 is formulated using a Polymodal Metal Flake distribution technology which utilizes a combination of specifically selected silver flakes that, in...
LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal...
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties.
LOCTITE ABLESTIK SF 40, Amine, Non-conductive adhesive LOCTITE® ABLESTIK SF 40 is a good choice for repairing vertical surfaces with little added weight. Please refer to the TDS for alternate...
LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking.
LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend...
LOCTITE CB 3626MHF, Epoxy, Component assembly, NCA, Surface mount adhesive LOCTITE® CB 3626MHF is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. This...
LOCTITE DSP 3803, Acrylic, Display material, Optical lamination, Single Component, UV Curable Adhesive LOCTITE® DSP 3803 is a single component UV curable adhesive, specifically designed for PSA lamination process. LOCTITE...
LOCTITE ECCOBOND BF 4, Epoxy, Die Attach LOCTITE® ECCOBOND BF 4 adhesive is designed to encapsulate, protect and provide a structural bond for optoelectronic applications. This material compliments the use...
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component Non-conductive...
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering...
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used...
LOCTITE ECCOBOND F 112, Epoxy, Assembly LOCTITE® ECCOBOND F 112 adhesive is formulated for fiber optic assembly applications. Two components - requires mixing Low viscosity Thermal shock and impact resistant...
LOCTITE ECCOBOND F 113, Epoxy, Assembly LOCTITE® ECCOBOND F 113 is an optically clear adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses and...
LOCTITE ECCOBOND F 120, Epoxy, Assembly LOCTITE® ECCOBOND F 120 adhesive is designed for high performance fiber optic and optical bonding applications. This adhesive provides outstanding chemical resistance to a...
LOCTITE ECCOBOND F 123, Epoxy, Assembly LOCTITE® ECCOBOND F 123 is formulated for terminating single or multi-channel fiber optic connectors. LOCTITE ECCOBOND F 123 bonds offer resistance to water and...
LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA LOCTITE® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its...
LOCTITE ECCOBOND F 253, Two-part, Epoxy, Assembly LOCTITE® ECCOBOND F 253 two-part epoxy is formulated to change color during the cure process to indicate the cure status. LOCTITE ECCOBOND F...
LOCTITE ECCOBOND LS 3106P, Acrylate, Lid attach, Sealant LOCTITE® ECCOBOND LS 3106P is specifically designed for bonding optical components requiring excellent water proof sealing. One component UV curable Low viscosity...
LOCTITE ECCOBOND LUX 3042M, Acrylate, Assembly, Dual Cure LOCTITE® ECCOBOND LUX 3042M dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is...
LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This...
LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant LOCTITE® ECCOBOND PH 1 is a one component, non-conductive adhesive.  It has excellent ink resistance and has good adhesion to metal substrates and...
LOCTITE ECCOBOND UV 9030, Acrylate, Adhesive and Sealant, Thixotropic, Solvent resistant LOCTITE® ECCOBOND UV 9030 is a dual cure sealant and adhesive that can be syringe dispensed. One component UV...
LOCTITE ECCOBOND UV 9052, Acrylate, Encapsulant, fast UV cure LOCTITE® ECCOBOND UV 9052 is a single component, UV light/moisture curable adhesive for ink jet applications. One component Fast UV cure...
LOCTITE SI 5421, Silicone, Bonding or Gasketing, Flexible, Formed-in-place, Electrically Conductive Adhesive LOCTITE® SI 5421 is used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures. It cures to...
LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating...
LOCTITE STYCAST EO 8019, Epoxy, Potting and Encapsulating, Resilient, Non-sag, Heat Cure Glass adhesive LOCTITE STYCAST EO 8019 epoxy, is a resilient, non-sag, heat cure glass adhesive. Non-sag properties are...
LOCTITE STYCAST ESP 4536, Epoxy, Fast-setting, Industrial Grade, Surface Mounted Devices LOCTITE® STYCAST ESP 4536 is a fast-setting, industrial grade surface mount adhesive. It is designed to set quickly when...
LOCTITE STYCAST OS 8300, two components - requires mixing, epoxy LOCTITE STYCAST OS 8300 is a two-component adhesive formulated to enhance productivity in the assembly of semiconductor, optical, fiber optic,...
Loctite® Fixmaster® Crack Filler, a two-component, natural in color, epoxy repair adhesive that is 100% solids and contains no solvents. It has excellent workability and flow. Fills cracks in concrete,...
LOCTITE® Hysol 740LV Hot Melt is an EVA-based, fast setting adhesive that is a lower viscosity version of Hysol 740 Hot Melt. It is recommended for packaging and fabric reinforcing...
LOCTITE® 0437 Hysol SprayPac Polyshot Hot Melt Adhesive is formulated for spray applications and is well suited for use on expanded polystyrene or urethane foams.
LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip...
LOCTITE® Hysol CoolMelt Hot Melt Adhesive is a flexible material designed to be applied at low temperatures. Ideal for bonding heat- sensitive parts.
Loctite® Hysol® 7805™ Hot Melt Adhesive polyamide hot melt is a high performance adhesive recommended for bonding a broad variety of difficult substrates. Its high strength and medium viscosity optimizes...
Polyamide amber hotmelt adhesive for molding applications. Bond area sets into thermoplastic condition. TECHNOMELT® PA 641 is an amber polyamide hotmelt adhesive for molding applications. With an application temperature of...
Polyamide hot melt adhesive modified with fire-retardant materials for substrates that may be exposed to extreme temperatures. TECHNOMELT® PA 7809FR is a polyamide adhesive liquid that has been modified with...
Polyamide hot melt adhesive that exhibits excellent low temperature flexibility. It is suitable for bonding plastics, metal, flexible vinyl and ABS. TECHNOMELT® PA 6211 is a clear, amber polyamide hot...
Polyamide hotmelt adhesive that is suitable for bonding difficult substrates like metal and plastics in filter, automotive and molding applications. TECHNOMELT® PA 6206 is a clear amber, polyamide hotmelt adhesive...
Polyamide hotmelt used for general assembly applications, especially for soft PVC. TECHNOMELT® PA 6239 is an amber polyamide hotmelt used for general assembly applications, especially for soft PVC. Used in...
Polyurethane reactive hot melt adhesive that is moisture-cured to form a tough, strong and virtually thermoset polymer. TECHNOMELT® PUR 508 is a polyurethane reactive hot melt adhesive that is moisture-cured...
Polyurethane sealant paste which is a non-sag, multi-purpose adhesive providing a flexible, durable and resistant elastomeric seam with good adhesion. LOCTITE® UR 3370 WH is a white, fast curing, polyurethane...
Reactive polyurethane hotmelt adhesive. It is designed for robotic dispensing and has a relatively long open time. LOCTITE® HHD 3541 is an ivory to light amber, high viscosity, reactive polyurethane...
Rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. LOCTITE® UK 3364™ is a black, rigid 2-part polyisocyanate urethane...
Silane-modified polymer hardener for use with TEROSON-MS adhesives, MS Polymers and sealants. Designed for assembly applications. TEROSON® MS 9371B is a white, thixotropic, silane-modified polymer hardener paste. The product is...
Silicone paste primarily designed for a wide variety of applications in the fiber optic industry. LOCTITE® SI 3407 is a black, silicone paste primarily designed for a wide variety of...
Sprayable or extrudable hotmelt adhesive with exceptionally long open time which forms strong bonds having good heat-resistance. TECHNOMELT® AS 3210 (known as DORUS MS 3210 HOTMELT) is an off-white sprayable...
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It...
TECHNOMELT PA 6344, Polyamide, Encapsulation TECHNOMELT® PA 6344 UV resistance, polyamide-based, thermoplastic, hot melt adhesive is designed for molding compound applications. This material adheres well to a variety of substrates...
TECHNOMELT® PA 7857 BLACK is a moldable polyamide where excellent adhesion and cold temp flexibility are important, such as in an automotive exterior. Also used extensively in white goods.
TECHNOMELT® AS 4222 is an assembly adhesive with high temperature creep resistance for the air filter industry.
TECHNOMELT® PA 2157is a polyamide hot melt adhesive. It is a unique hot melt with excellent heat resistance and low viscosity immediately above the softening point. This product is particularly...
TECHNOMELT® PA 6301 is a thermoplastic hot melt adhesive resin. It is an adhesive for heat-shrinkable components. This product will retain its flexibility at low temperatures and has good adhesion...
TECHNOMELT® PA 7808 BLACK is a moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation of heat producing...
TECHNOMELT® PA 7848 BLACK UV stability and suitable for outdoor applications, with increased hardness.
TECHNOMELT® PA 7873 is a moldable polyamide with good adhesion for higher temperature applications, such as in an automotive underhood.
TECHNOMELT® PA 7901 is a low viscosity polyamide used extensively for potting and encapsulating.
TECHNOMELT® QUICKPAC is a low cost carton sealing adhesive with a 15-second open time.
Thermoplastic hotmelt adhesive based on polyamide. This product has good adhesion to a wide range of difficult-to-bond substrates such as plastics and metals. TECHNOMELT® PA 6202 is a thermoplastic hotmelt...
UV-cured modified acrylate acrylic adhesive which has excellent adhesion to glass and metals with typical applications including terminal pin bonding. LOCTITE® 3189UV is a green, transparent, medium viscosity, UV-cured modified...
Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface...

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