Henkel Corporation - Industrial Datasheets for Industrial Adhesives

Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more

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Product Name Notes
1-part, non-sag, fast cure epoxy adhesive paste. The product is ideal for bonding wires to armatures. LOCTITE® EA 3985 is a black, 1-part, non-sag, fast cure epoxy adhesive paste. The...
2-part epoxy adhesive formulated for applications where high temperature and/or high chemical resistance is required. LOCTITE® EA 9492 is a 2-part, white epoxy adhesive designed to offer both high chemical...
2-part industrial grade epoxy adhesive. It cures at room temperature to form a tough bondline with excellent resistance to peel and impact forces. LOCTITE® EA E-120HP is an amber-beige, 2-part,...
2-part structural acrylic adhesive which provides toughness and excellent adhesion to plastics, metals and composites. LOCTITE® AA V5004 is a 2-part structural acrylic adhesive. The cured product is virtually transparent...
2-part, clear amber, general purpose epoxy adhesive which cures slowly at room temperature after mixing. It develops high strength and excellent moisture resistance. LOCTITE® EA 3421 is a 2-part, clear...
2-part, general purpose, thixotropic, cyanoacrylate/epoxy hybrid adhesive with very fast fixture at room temperature. LOCTITE® HY 4090 GY is a grey, 2-part, general purpose, thixotropic, cyanoacrylate/epoxy hybrid adhesive with very...
2-part, general purpose, urethane methacrylate ester acrylic adhesive kit that is used to bond metal, wood, ferrite, ceramic and plastic materials. LOCTITE® AA 330/LOCTITE SF 7388 KIT consists of 2-parts:...
2-part, high strength, fast-fixturing acrylic methacrylate adhesive gel system designed for bonding low energy plastics without surface pretreatment. LOCTITE® AA 3035 is a pale yellow, 2-part, high strength, fast-fixturing acrylic...
2-part, industrial grade, high viscosity, room temperature-cure structural epoxy adhesive which contains DuPont's Kevlar®. LOCTITE® EA E-30UT is a dark purple, 2-part, industrial grade, high viscosity, room temperature-cure structural epoxy...
2-part, low viscosity, industrial grade epoxy adhesive. It cures at room temperature with minor shrinkage to form an ultra clear adhesive bondline. LOCTITE®EA E-30CL is a clear, colorless to slightly...
2-part, methacrylate acrylic adhesive liquid designed for structural bonding of magnets in the assembly of fractional horsepower electric motors. LOCTITE® AA 3060 is a green/blue, 2-part, thixotropic, methacrylate acrylic adhesive...
2-part, methacrylate acrylic structural adhesive paste system that forms resilient bonds and maintains its strength over a wide range of temperatures. LOCTITE® AA H4000 is a pale yellow, 2-part, non-sag,...
2-part, multi-purpose, fast-curing and non-sagging structural bonding epoxy adhesive. Good for gap filling and use on vertical surfaces to avoid run-off. LOCTITE® EA 9450 is a 2-part, translucent, non-sag, multi-purpose,...
2-part, multi-purpose, toughened, structural bonding epoxy adhesive for applications needing a long open time. Provides high peel and shear strengths. LOCTITE® EA 9466 is a 2-part, yellowish, structural bonding epoxy...
2-part, non-sag, room temperature curing methacrylate acrylic adhesive system. LOCTITE® AA H8000 is a green, 2-part, non-sag, room temperature curing methacrylate acrylic adhesive system. It has a fast fixture time...
2-part, non-sag, room temperature curing methacrylate acrylic adhesive. It is designed to have fast fixture time and excellent bond strength. LOCTITE® AA H8100 is a green, 2-part, non-sag, room temperature...
2-part, non-sag, room temperature-cure methacrylate acrylic adhesive system with fast fixture time and excellent bond strength on multiple substrates. LOCTITE® HHD 8000R is a green, 2-part, non-sag, room temperature-cure methacrylate...
2-part, non-sag, room temperature-cure methacrylate acrylic adhesive system. It has high peel and shear strength and forms resilient bonds. LOCTITE® AA H4200 is a pale yellow, 2-part, non-sag, room temperature-cure...
2-part, non-sag, room temperature-cure, 10:1 mix ratio, methacrylate acrylic adhesive system which provides handling strength within minutes. LOCTITE® AA H4100 is a pale yellow, 2-part, non-sag, room temperature-cure, 10:1 mix...
2-part, off-white epoxy formulated for oil-based applications. Shows good resistance to hydraulic fluids, fuels and chemicals. Long working life. LOCTITE® EA 9430 is a 2-part, off-white epoxy that exhibits very...
2-part, room temperature-cure methacrylate acrylic adhesive system designed for a fast fixture time and excellent bond strength on various substrates. LOCTITE® AA H8010 is a gray, 2-part, non-sag, room temperature-cure...
2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. LOCTITE® EA E-40HT is an off-white, 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive...
2-part, thick urethane repair compound liquid combining the properties of rubber and urethane to form a unique, tough and pourable system. LOCTITE® MR FLEX 80 (known as LOCTITE FIXMASTER FLEX...
2-part, thixotropic, methacrylate adhesive system that forms resilient bonds and maintains its strength over a wide range of temperatures. LOCTITE® AA H4500 is a gray, 2-part, thixotropic, methacrylate adhesive system...
2-part, thixotropic, room temperature curing methacrylate acrylic adhesive designed for structural bonding of most galvanized metals. LOCTITE® AA H8610 is an off-white, 2-part, thixotropic, room temperature curing methacrylate acrylic adhesive...
2-part, thixotropic, room temperature-cure methacrylate acrylic structural adhesive for structural bonding of most metals. LOCTITE® AA H4710 is a gray, 2-part, thixotropic, room temperature-cure methacrylate acrylic structural adhesive for structural...
2-part, toughened, thixotropic acrylic adhesive. It is non-flammable, 100% solids and has lower odor compared to other acrylic adhesives. LOCTITE® AA A-671 is a dark green, 2-part, toughened, thixotropic acrylic...
2-part, viscous, room temperature-cure methacrylate acrylic adhesive paste offering superior peel and impact strength on steel and aluminum. LOCTITE® AA H8510 is a gray, 2-part, viscous, room temperature-cure methacrylate acrylic...
2-part, viscous, thixotropic, room temperature cure, methacrylate acrylic adhesive paste offering peel and impact strength on steel and aluminum. LOCTITE® AA H8500 is a gray, 2-part, viscous, thixotropic, room temperature...
Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily...
Acrylic emulsion black adhesive for laminating applications in the HVAC air duct sector. Excellent adhesion to polyester film. KD - UL Recognized Component; high tack, water-resistance. AQUENCE® AV 7594 BLACK...
Acrylic liquid resin used for prototyping which cures with very short exposure to monochromatic light sources. LOCTITE® 3D 3840 is a clear, white, gray or black, UV light, low viscosity,...
Acrylic liquid resin used for prototyping which cures with very short exposure to monochromatic light sources. LOCTITE® 3D 3830 is a clear, white, gray or black, UV light, low viscosity,...
Acrylic off-white thread sealant for automatic dispensing applications. Can be reused up to five times. LOCTITE® DRI 503HV is an off-white, thixotropic, acrylic thread sealing adhesive liquid. This non-toxic product...
AQUENCE 034-088-050 (5093) is a resin emulsion adhesive designed to bond various filter media to metal wire and chipboard. This product machines well on wheel coaters and exhibits excellent wet...
AQUENCE 034-088-223 (7348H) is an acrylic emulsion adhesive designed for general wet-bond laminating of difficult substrates. It is characterized by its excellent water resistance. All ingredients in Adhesin 45-7348H are...
AQUENCE 485 latex sealer designed for use in the RV industry to seal cutouts in porous substrates such as plywood from wicking moisture. It can be applied by brush or...
AQUENCE AV 452A known as DORUS PL 452A. Water-based pressure sensitive liquid adhesive suitable for bonding fibrous glass, jute and other types of lightweight insulation. AQUENCE® AV 452A (DORUS PL-452A)...
AQUENCE AV 5531 is Henkel's new adhesive for disposable filter assembly and other paper-to-paper laminating applications. This product exhibits high wet tack, fast speed of set, and excellent machinability and...
AQUENCE AV 7595 is a water-based, pressure sensitive adhesive designed for use in high speed lamination of flexible air duct core. It is a UL Recognized Component®. It exhibits excellent...
AQUENCE AV 7597 is a flame-retardant, water-based, pressure sensitive adhesive designed for use in high speed lamination of flexible air duct vapor barriers. It is a UL Recognized Component® and...
AQUENCE AV 7598 is a flame-retardant, water-based, pressure sensitive adhesive designed for use in high speed lamination of flexible air duct vapor barriers. It is a UL® Recognized Component and...
AQUENCE Catalyst K 1000 is a water-based, acid catalyst used to accelerate the crosslinking of specialty emulsion adhesives to create Type I and Type II bonds. Water-resistant bonds may be...
AQUENCE CATALYST R 394A is an aromatic isocyanate EPI crosslinker, MUST protect from low temperature (>70ºF). Apply at 8-15%, pot life approximately 1 hour, depending on mix ratio and plant...
AQUENCE CD 380 is a water-based, high green strength, fast tack, high heat resistance, great mileage; for most foam applications; bonds to some metals and plastics.
AQUENCE CD 380P is a water-based, high green strength, fast tack, high heat resistance, great mileage; for most foam applications; bonds to some metals and plastics.
AQUENCE ENV 6135HUV VECTORPATCH is a resin emulsion window gum specially formulated to bond polystyrene films such as Trycite® and Dowfilm® to paper in the production of envelopes. Adhesin 56-6135HUV...
AQUENCE KL 300A is a lead one-part RF and hot press product. Fast set, high green strength out of the press with bleed-through resistance.
AQUENCE PL 6100BL is a synthetic rubber based contact adhesive with a soft "hand" for upholstery and furniture assembly applications. Dorus 42-6100BL is used with Dorus 92-3200™ acid catalyst in...
AQUENCE PS 7648 is a formulated pressure sensitive, acrylic emulsion adhesive that exhibits very high dry tack and peel strength values. It’s a high solids adhesive product that can be...
AQUENCE WL 4019 is a versatile, crosslinking adhesive designed for cold pressing, hollow core doors. Architectural doors. White, type I, water resistance with 5% catalyst addition, UL 10 C 90...
AQUENCE WL 501A is a lowest cost interior flush door product. Good mileage and adhesion. UL 10C, 90 Min. fire rated.
AQUENCE WL 5704 is a general purpose, wet-bond laminating adhesive with high wet tack and excellent adhesion to papers and foils. It is used as a facing adhesive to bond...
AQUENCE WL 8112 is a water-based wrapping adhesive for Voorwood machines. Suitable for all water-based substrate combinations.
AQUENCE® AV 7584 BLACK is a flame-retardant, water-based, pressure sensitive adhesive designed for use in high speed lamination of flexible air duct core. It is a UL Recognized Component and...
AQUENCE® AV 797 is a water-based adhesive used as a carton sealing adhesive and for difficult to bond surfaces such as foils, laquer, and coated boardstock. It is also widely...
AQUENCE® CG 3130is a multipurpose adhesive utilized for filter assembly, glue lap and other paper-to-paper laminating applications. This product exhibits a good balance of wet tack, speed of set, ultimate...
AQUENCE® PL 4100 is a high performance, heat reactivatable, one-component polyurethane adhesive for tough elastomeric bond applications. Light gray in color, this adhesive requires heat and pressure for application such...
AQUENCE® PS 9627 is a general purpose, pressure sensitive acrylic for bonding plastics. High tack and high solids offer quick processing and adhesion to many substrates.
BERGQUIST BOND PLY TBP 1400LMS-HD, Laminate Material - Silicone, High Durability, Optional Lamination Methods BERGQUIST® BOND PLY TBP 1400LMS-HD is a thermally conductive heat curable laminate material. The product consists...
BERGQUIST BOND PLY TBP 400B, Silicone-Free Formulation, High Performance Thermally Conductive Material BERGQUIST® BOND PLY TBP 400B is a thermally conductive, electrically insulating, double-sided pressure sensitive adhesive tape. The tape...
BERGQUIST BOND PLY TBP 400P, Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape BERGQUIST® BOND PLY TBP 400P is a thermally conductive, electrically insulating, double sided pressure sensitive adhesive tape.
BERGQUIST BOND PLY TBP 720LMS, Low Modulus Silicone, Heat Cured, Laminating Adhesive BERGQUIST® BOND PLY TBP 720LMS is a thermally conductive fiber reinforced heat curable laminating adhesive film. The product...
BERGQUIST BOND PLY TBP 800, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® BOND PLY TBP 800 is a thermally conductive, electrically isolation double-sided tape. BERGQUIST BOND PLY TBP 800 is...
BERGQUIST BOND-PLY TBP 850, Thermally Conductive, Fiberglass Reinforced, Pressure Sensitive Adhesive Tape BERGQUIST® BOND PLY TBP 850 is fiberglass-reinforce d pressure-sensitive adhesive tape. Henkel offers three standard thicknesses for BERGQUIST...
BERGQUIST GAP FILLER TGF 3600, Thermally Conductive, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3600 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high...
BERGQUIST GAP PAD 2202SF, Silicone-Free, High Performance Thermally Conductive, Fiberglass Carrier, Silicone Free, Polymer Pad BERGQUIST® GAP PAD® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material.
BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 1300 is a highly compliant Gap Pad material that is ideal for...
BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material BERGQUIST® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile...
BERGQUIST GAP PAD TGP 3000M, 3 W/m-K, Low Modulus Gap Pad with exceptional thermal performance at low pressures BERGQUIST® GAP PAD TGP 3000M is a soft gap filling material specially...
BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material...
BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal...
BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and...
BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has...
BERGQUIST LIQUI BOND TLB SA1000, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy...
BERGQUIST LIQUI BOND TLB SA1800, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND® TLB SA1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer.
BERGQUIST LIQUI BOND TLB SA200, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding...
BERGQUIST LIQUI BOND TLB SA3500, Thermally Conductive, Two-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA3500 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a...
BERGQUIST LIQUI FORM TLF 2000, Thermally Conductive, One-Part, Liquid Formable Material BERGQUIST® LIQUI FORM TLF 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a...
BERGQUIST LIQUI FORM TLF LF3500, Thermally Conductive, One-Part, Liquid Formable Gel Material BERGQUIST® LIQUI FORM TLF LF3500 is a high conductivity gel thermal interface material designed for demanding applications that...
BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforce d, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforce d thermal interface material featuring...
BERGQUIST SIL PAD TSP A2000, Electrically Insulating, Silicone based, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD® TSP A2000 is a silicone-based thermally conductive and electrically insulating material. It consists of...
BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K1100 is a medium performance, film-based thermally conductive insulator. The film is coated with...
BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and...
BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between...
BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between...
Black, low viscosity, rubber-toughened, 1-part, room temperature cure, instant adhesive. LOCTITE® 380 is a black, low viscosity, rubber-toughened, 1-part, room temperature cure, instant adhesive designed for close fitting parts and...
Clear, two-component, 5-minute epoxy in a convenient 1:1 mix ratio. Bonds virtually any material. It will also fill or seal cracks and rebuild worn surfaces. Sets in 5 minutes allowing...
colorless, transparent, instant light-cure universal acrylic-based adhesive. For stress-sensitive plastics with high, on-demand, curing speed. LOCTITE® AA 3301 is a transparent, colorless, light-cured, universal, acrylic-based instant adhesive, suitable for metals...
Cyanoacrylate liquid adhesive designed to provide fast room temperature fixturing. LOCTITE® 4013 is a colorless to transparent, slightly yellow, cyanoacrylate liquid adhesive designed to provide fast room temperature fixturing. It...
Cyanoacrylate/acryli c hybrid structural adhesive paste that provides toughness and excellent adhesion to metals, composites and plastics. LOCTITE® HY 4080 is a 2-part, opaque to slightly yellow, cyanoacrylate/acryli c hybrid...
Cyanoacrylate/acryli c hybrid structural adhesive providing toughness and excellent adhesion to metals, composites and plastics. LOCTITE® HY 4080 GY is a 2-part, grey, cyanoacrylate/acryli c hybrid structural adhesive providing toughness...
Designed to repair rubber, urethane, PVC and other parts quickly and durably. Unique for its exceptional handling, curing and performance properties LOCTITE® PC 7393 is an adhesive, sealant and repair...
Epoxy black 2-part adhesive for general purpose applications involving metal, plastic, or wood substrates. LOCTITE® EA 11C is a black, 2-part, epoxy, general purpose adhesive and sealant that is suitable...
Epoxy colorless/slightly yellowish adhesive for applications demanding high structural, mechanical, and electrical insulating properties. LOCTITE® EA 3336 is a colorless to slightly yellowish, 2-part, medium-viscosity, epoxy adhesive liquid for potting,...
Epoxy light white translucent adhesive for electronic component bonding applications. A set open time following activation allows component assembly. LOCTITE® EA 3355 is a translucent, light white, medium-viscosity, cationic epoxy...
Epoxy off-white 2-part adhesive for general purpose applications involving metal, plastic, or wood substrates. LOCTITE® EA 1C is an off-white, 2-part, epoxy, general purpose adhesive and sealant that can be...
Epoxy translucent 2-part adhesive for general purpose applications. Bonds most materials and is effective at filling porosities and voids. LOCTITE® EA 9131 is a translucent, 2-part, epoxy, general purpose adhesive...
Ethyl cyanoacrylate adhesive gel toughened with elastomers for impact and peel strength along with improved resistance to heat and humidity. LOCTITE® 426 is a black, ethyl cyanoacrylate adhesive gel toughened...
Ethyl cyanoacrylate gel adhesive used for bonding applications where heat resistance is required on substrates such as rubbers, plastics and metals. LOCTITE® 4205 is a colorless to slightly pale yellow,...
Ethyl cyanoacrylate/alipha tic ester adhesive designed as a fast curing, low strength adhesive for locking metal and plastics fasteners. LOCTITE® 425 is a dark blue ethyl cyanoacrylate/alipha tic ester adhesive...
Ethyl-based instant adhesive, mainly for plastics. Fast room temperature fixturing. ISO 10993 certified. LOCTITE® 4014 is a transparent, colorless, ethyl-based instant adhesive that is designed to provide fast room temperature...
Ethyl/butyl cyanoacrylate adhesive liquid for the assembly of difficult-to-bond materials. Specifically formulated to provide flexible bondlines. LOCTITE® 4851 is a clear, colorless, ethyl/butyl cyanoacrylate adhesive liquid designed for the assembly...
Extreme temperature, silicic acid, water-based repair putty that withstands environments up to 2,000 °F (1,000 °C). LOCTITE® MR 2000 is a silver gray, extreme temperature, silicic acid, water-based repair putty...
Fast, self-leveling, cyanoacrylate/epoxy hybrid liquid structural adhesive designed for high performance potting applications and structural bonding. LOCTITE® HY 4092 GY is a 2-part, grey, fast, self-leveling, cyanoacrylate/epoxy hybrid liquid structural...
Fluorescent epoxy adhesive liquid specifically designed for bonding stainless steel cannulae into hubs, syringes and lancets for needle assemblies. LOCTITE® EA 210214 is a light gray, fluorescent epoxy adhesive liquid...
Fluorescent, light-cure, acrylated urethane acrylic adhesive liquid ideal for potting applications requiring a fast and large depth of cure. LOCTITE® AA 3554 is a clear, slightly yellow with green tint,...
Fluorescent, light-cure, acrylated urethane acrylic adhesive liquid ideal for potting applications requiring a fast and large depth of cure. LOCTITE® AA 3555 is a transparent, yellow with green tint, fluorescent,...
Fluorescent, UV acrylic adhesive suited to a wide variety of applications that require fast cure, flexibility, high adhesion and autoclave resistance. LOCTITE® AA 3924 is a transparent to hazy liquid,...
Fluorescent, UV acrylic light cure adhesive liquid primarily designed for bonding plastic substrates where a flexible, tough bond is required. LOCTITE® AA 3944 is a transparent to hazy, fluorescent, UV...
Fluorescent, UV-cure, ethyl cyanoacrylate instant adhesive with photo-initiator. LOCTITE® 4311 is a light yellow-green to dark blue-green, transparent, fluorescent, UV-cure, ethyl cyanoacrylate instant adhesive with photo-initiator. The UV-cure properties facilitate...
Fluorescent, UV-cured acrylated urethane acrylic adhesive which is used for bonding plasticized PVC, TPEs and thermostat rubbers. LOCTITE® AA 3953 is a colorless to straw-colored, transparent, fluorescent, medium viscosity, UV-cured,...
General purpose, high viscosity urethane methacrylate ester acrylic adhesive that is used to bond metal, wood, ferrite, ceramic and plastic materials. LOCTITE® AA 330/LOCTITE SF 7386 KIT is a kit...
General purpose, low viscosity, ethyl cyanoacrylate adhesive suitable for applications where heat resistance is required. LOCTITE® 4203 is a colorless to slightly pale yellow, general purpose, low viscosity, ethyl cyanoacrylate...
Heat-cured structural epoxy adhesive with excellent high temperature performance and chemical resistance. LOCTITE® EA 9459 is a white to light gray, medium viscosity, self-leveling, roller-coatable, heat-cured structural epoxy adhesive with...
High transparency, low yellowing, medium viscosity light-cure acrylic-based adhesive. High, on-demand curing speed. LOCTITE® AA 3491 is a clear, low yellowing, light-cured, universal, acrylic-based instant adhesive, suited to plastics and...
High transparency, low yellowing, very high viscosity light-cure acrylic-based adhesive. High, on-demand curing speed. LOCTITE® AA 3494 is a clear, low yellowing, light-cured, universal, acrylic-based instant adhesive suited to plastics...
High-strength, high temperature adhesive designed for bonding foam, carpet, fabrics, plastics, rubber, etc. LOCTITE® MR 5426 is a high-strength, high temperature spray adhesive designed for bonding foam, carpet, fabrics, plastics,...
High-strength, pre-applied threadlocker. LOCTITE® DRI 201 ECO is a high-strength, pre-applied threadlocker. This dry-to-the touch adhesive remains an inert coating until assembly. During assembly, microcapsulates release an active ingreident which...
Highly flexible ethyl and octyl cyanoacrylate instant adhesive designed for the assembly of flexible medical devices. LOCTITE® 4902 is a colorless, clear, highly flexible ethyl and octyl cyanoacrylate instant adhesive...
Highly flexible, ethyl and octyl cyanoacrylate adhesive liquid for the assembly of flexible medical devices. LOCTITE® 4903 is a clear, colorless, highly flexible, ethyl and octyl cyanoacrylate adhesive liquid for...
Hysol US5501 (formerly LOCTITE® 821200R C) is a 100% solids, mineral filled, urethane adhesive that is very low in volatile components and is flame retardant. This material is designed to...
Industrial Adhesives
Instant Adhesive - 2-component. Multi-purpose. High gap-filling capacity (5mm). For professional repairs. LOCTITE® 3090 is a 2-component, fast curing, gap filling adhesive with excellent bonding characteristics, making it suitable for...
Instant Adhesive - general purpose. Low viscosity. Ideal for use on porous substrates. LOCTITE® 401 is an instant adhesive designed for the assembly of difficult-to-bond materials requiring uniform stress distribution...
Instant Adhesive - general-purpose gel. Non-drip. Ideal for overhead applications. LOCTITE® 454 is an instant adhesive designed for the assembly of difficult-to-bond materials which require uniform stress distribution and high...
Instant Adhesive - low viscosity. Ideal for bonding of plastics and elastomeric materials where very fast fixturing is required. LOCTITE® 406 is an instant adhesive designed especially for the fast...
Instant Adhesive - toughened. Ideal for bonding metal to metal, to rubber or magnets. Good resistance in humid environments. Fast curing. LOCTITE® 480 is an instant adhesive designed for the...
Isopropanol amine solvent-based liquid cyanoacrylate activator used where increased cure speed of LOCTITE cyanoacrylate adhesives is required. LOCTITE® SF 713 is a colorless to slightly amber, transparent, isopropanol amine solvent-based...
Isopropanol amine solvent-based liquid cyanoacrylate activator used where increased cure speed of LOCTITE cyanoacrylate adhesives is required. LOCTITE® SF 712 is a transparent, isopropanol amine solvent-based liquid cyanoacrylate activator used...
Light-cure acrylic-based adhesive. Strong and tough, it is well suited to bonding plastics and metals. Low yellowing effect in sunlight. LOCTITE® AA 3525 is a clear, light-cured, acrylic-based adhesive that...
Light-cure, high viscosity acrylic-based adhesive for stress-sensitive plastics. Depth of cure >13 mm. Qualified for medical applications. Rapid fixturing. LOCTITE® AA 3926 is a high viscosity, acrylic-based light-cured adhesive that...
Light-cure, low viscosity acrylic-based adhesive. Well suited to bonding stress-sensitive plastics. Offers rapid 3 secs fixturing time. LOCTITE® AA 3921 is a light-cured, acrylic-based adhesive formulated to provide flexible bonds...
Liquid activator used where increased cure speed of LOCTITE anaerobic structural products is required. LOCTITE® SF 7075 is an amber, transparent, liquid activator used where increased cure speed of LOCTITE...
LOCTITE 3131, Epoxy/Acrylate, Assembly, Dual Cure Adhesive LOCTITE® 3131 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. The maximum performance of this material...
LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W...
LOCTITE 3614, Epoxy, Surface mount adhesive LOCTITE® 3614 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where...
LOCTITE 3616, Epoxy, Surface mount adhesive, Small parts bonding LOCTITE® 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited...
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited...
LOCTITE 3626M, Epoxy, Halogen free, High thermal mechanical strength, Surface mount adhesive LOCTITE® 3626M is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3629C, Epoxy, Surface mount adhesive LOCTITE® 3629C epoxy is formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed provide controlled dot...
LOCTITE 596, Silicone, Gasketing & sealing LOCTITE® 596 cures on exposure to moisture in the air to form a tough, flexible, waterproof, oil-resistant silicone rubber bond. This product resists aging,...
LOCTITE ABLESTIK 104, Epoxy, Assembly LOCTITE® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230ºC.
LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity...
LOCTITE ABLESTIK 16-1LV, Epoxy, General Assembly LOCTITE® ABLESTIK 16-1LV epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. This...
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product...
LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high...
LOCTITE ABLESTIK 2025D, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025D die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates...
LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025DSI die attach adhesive is designed for use in array packaging. Non-conductive High reliability Improved work life
LOCTITE ABLESTIK 2025JH, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2025JH die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates...
LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to...
LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
LOCTITE ABLESTIK 2035SC, Proprietary Hybrid Chemistry, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material...
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for...
LOCTITE ABLESTIK 2053S, Epoxy, Die Attach LOCTITE® ABLESTIK 2053S die attach adhesive is designed for use in array packaging. Low stress Non-conductive
LOCTITE ABLESTIK 2100A, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures...
LOCTITE ABLESTIK 2106T BIPAX, Epoxy, Assembly LOCTITE® ABLESTIK 2106T BIPAX is designed for high strength structural bonding applications. LOCTITE ABLESTIK 2106T BIPAX develops significant properties 1 hour after mixing. Two...
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily...
LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to...
LOCTITE ABLESTIK 2143D, Epoxy, Medium viscosity adhesive, Assembly LOCTITE® ABLESTIK 2143D medium viscosity adhesive is recommended for industrial bonding and sealing applications where toughness, impact resistance and superior mechanical properties...
LOCTITE ABLESTIK 2158 BIPAX, Epoxy, a Two-part Adhesive, Electrically Insulating, Assembly, NCA LOCTITE® ABLESTIK 2158 BIPAX is a two-part adhesive that develops strong, durable high-impact bonds at room temperature which...
LOCTITE ABLESTIK 2200D, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2200D electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. Low stress Snap...
LOCTITE ABLESTIK 2300, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2300 electrically conductive adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the...
LOCTITE ABLESTIK 2332-17, Solventless Epoxy, Assembly LOCTITE® ABLESTIK 2332-17 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It...
LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension...
LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses...
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds...
LOCTITE ABLESTIK 2700HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2700HT die attach adhesive is designed for Pbfree array packaging. This adhesive is ideal for small needle dispensing in SiP...
LOCTITE ABLESTIK 2815A, Acrylate, Die Attach LOCTITE® ABLESTIK 2815A die attach adhesive is designed to minimize thermal resistance between the chip and substrate. It provides improved workability for applications requiring...
LOCTITE ABLESTIK 285 CAT 11, Epoxy, Thermally conductive adhesive LOCTITE® ABLESTIK 285 CAT 11 adhesive is designed for assembly applications that require thermal management. It is also recommended for low...
LOCTITE ABLESTIK 2902, Epoxy, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2902 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. LOCTITE...
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties.
LOCTITE ABLESTIK 293-1, Epoxy, General Assembly LOCTITE® ABLESTIK 293-1 is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates. One component - requires no mixing General purpose...
LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing LOCTITE® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach...
LOCTITE ABLESTIK 3119, Epoxy, Bonding LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of...
LOCTITE ABLESTIK 3280, Acrylate, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 3280 electrically conductive die attach adhesive is designed for high reliability package applications . This material offers improved JEDEC...
LOCTITE ABLESTIK 3280T, Acrylate, Die Attach LOCTITE® ABLESTIK 3280T die attach adhesive is designed for high reliability packaging applications. It offers improved JEDEC performance on packages with die sizes <100...
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290...
LOCTITE ABLESTIK 342-3.5, Epoxy, General Assembly LOCTITE® ABLESTIK 342-3.5 epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. LOCTITE...
LOCTITE ABLESTIK 342-37, Epoxy, General Assembly, Thermal shock resistant LOCTITE® ABLESTIK 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties. LOCTITE ABLESTIK 342-37 adhesive may be used...
LOCTITE ABLESTIK 369-3, Epoxy, Die Attach, Polyamine Activated Adhesive LOCTITE® ABLESTIK 369-3 polyamine activated adhesive is designed for general purpose applications. Electrically conductive Ease of use Long work life Moderate...
LOCTITE ABLESTIK 45 CLEAR, Epoxy, Assembly, Controllable Flexibility, Clear, Unfilled Adhesive LOCTITE® ABLESTIK 45 CLEAR is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can...
LOCTITE ABLESTIK 45, Epoxy, Assembly, General purpose, Adhesive LOCTITE® ABLESTIK 45 is designed as a general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to...
LOCTITE ABLESTIK 5020K, Epoxy Film, Assembly, High Purity Adhesive LOCTITE® ABLESTIK 5020K high purity adhesive is designed for substrate attach. Thermally conductive High purity
LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not...
LOCTITE ABLESTIK 550, Epoxy Film, Assembly LOCTITE® ABLESTIK 550 adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during...
LOCTITE ABLESTIK 550K, Epoxy Film, Assembly LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding High thermal conductivity Low cure temperature Suitable for an array of difficult-to-bond...
LOCTITE ABLESTIK 561, Epoxy Film, Assembly LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined...
LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It...
LOCTITE ABLESTIK 564A, Epoxy Film, Assembly LOCTITE® ABLESTIK 564A adhesive film is designed for bonding hybrid substrates into packages. In centrifuge tests, this adhesive passed 15,000 gs. Electrically Insulating High...
LOCTITE ABLESTIK 566K, Epoxy Film, Assembly LOCTITE® ABLESTIK 566K is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. This material is a low temperature cure version of...
LOCTITE ABLESTIK 566KAP, Epoxy Film, Assembly LOCTITE® ABLESTIK 566KAP is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. Extremely flexible Low temperature cure Good insulator
LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly LOCTITE® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to...
LOCTITE ABLESTIK 57C, Epoxy, Assembly LOCTITE® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the...
LOCTITE ABLESTIK 59C CAT 59, Silicone, Assembly LOCTITE® ABLESTIK 59C CAT 59 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures...
LOCTITE ABLESTIK 59C, Silicone, Heat cure LOCTITE® ABLESTIK 59C adhesive is designed for applications used at high temperatures which require electrical conductivity and do not need a high bond strength.
LOCTITE ABLESTIK 6200, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 6200 B-stageable adhesive is designed for use in flex or laminated based substrates. This material is ideal for chip scale...
LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive LOCTITE® ABLESTIK 6202C B-stageable adhesive is ideal for chip scale packages where tolerance and bleed need to be minimized.
LOCTITE ABLESTIK 6202C-X, Proprietary Hybrid Chemistry, Die Attach, B-stageable Adhesive LOCTITE® ABLESTIK 6202C-X B-stageable adhesive is ideal for laminate-based packages where tolerance and bleed need to be minimized. This low...
LOCTITE ABLESTIK 64C, Epoxy, Assembly LOCTITE® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea...
LOCTITE ABLESTIK 77-2LTC, Epoxy, Adhesive LOCTITE® ABLESTIK 77-2LTC adhesive is designed for attaching surface mounted devices to printed circuit boards prior to wave solder. Small, uniform dots may be dispensed...
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive...
LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive LOCTITE® ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed...
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material...
LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder...
LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured...
LOCTITE ABLESTIK 816H01, Epoxy, Component assembly, Non-conductive adhesive LOCTITE® ABLESTIK 816H01 adhesive is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This...
LOCTITE ABLESTIK 8175 is an electrically conductive adhesive for solder replacement and microelectronic interconnect applications.
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and...
LOCTITE ABLESTIK 8200T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200T electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and...
LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and...
LOCTITE ABLESTIK 8290, Epoxy, Die attach LOCTITE® ABLESTIK 8290 electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. It is recommended for die sizes <200 mils...
LOCTITE ABLESTIK 8301, Epoxy hybrid, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8301 electrically conductive die attach adhesive is designed for high reliability package applications. Electrically conductive Thermally conductive Snap...
LOCTITE ABLESTIK 8352L, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8352L electrically conductive die attach adhesive is designed for high reliability package applications. This material is suitable...
LOCTITE ABLESTIK 8352L-G, Epoxy, Die Attach LOCTITE® ABLESTIK 8352L-G die attach adhesive is designed for high reliability packaging applications. This product is particularly suitable for packages in which tight control...
LOCTITE ABLESTIK 8361J, Epoxy, Die attach LOCTITE® ABLESTIK 8361J die attach adhesive is designed for high reliability packaging applications. Electrically conductive High purity Minimal resin bleed Low condensable volatiles Excellent...
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated...
LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be...
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive Black pigmentation for blocking stray light
LOCTITE ABLESTIK 8390, Epoxy, Die attach LOCTITE® ABLESTIK 8390 die attach adhesive has been formulated for use in high throughput die attach applications. It is suitable for die sizes up...
LOCTITE ABLESTIK 8390A, Epoxy, Die attach LOCTITE® ABLESTIK 8390A die attach adhesive has been formulated for use in high throughput die attach applications. This high strength adhesive is intended for...
LOCTITE ABLESTIK 83CJ, Epoxy, Assembly LOCTITE® ABLESTIK 83CJ adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations...
LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand...
LOCTITE ABLESTIK 84-1LMINB, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMINB electrically conductive adhesive is designed for die attach applications. Electrically conductive High purity die attach adhesive Solvent-free
LOCTITE ABLESTIK 84-1LMINB1, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused...
LOCTITE ABLESTIK 84-1LMISR4, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE...
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or...
LOCTITE ABLESTIK 84-3, Epoxy, Die attach LOCTITE® ABLESTIK 84-3 adhesive is designed for medium die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand.
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound...
LOCTITE ABLESTIK 84-3MV, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3MV adhesive is designed for medium die attach applications. This adhesive is ideal for application by stamping or dispensing. Please refer to...
LOCTITE ABLESTIK 84-3MVBTI, Epoxy, Die attach LOCTITE® ABLESTIK 84-3MVBTI adhesive is designed for die attach and hybrid component attach applications. Electrically Insulating Low bleed Long work life Good dispensability
LOCTITE ABLESTIK 8601S25, Epoxy, Die Attach LOCTITE® ABLESTIK 8601S25 die attach adhesive has been formulated for use in high throughput die attach applications Snap curable Medium modulus Low outgassing Conductive...
LOCTITE ABLESTIK 8700K, Epoxy, Die attach LOCTITE ABLESTIK 8700K adhesive provides excellent adhesion to thin film and thick film gold surfaces. This adhesive retains its dispensed height after cure, without...
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced...
LOCTITE ABLESTIK 8900NC, Epoxy, Die Attach LOCTITE® ABLESTIK 8900NC die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on die size,...
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion...
LOCTITE ABLESTIK 958-11, Epoxy, Die attach LOCTITE® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. Non-conductive Stress absorbing
LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of...
LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach LOCTITE® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed...
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated...
LOCTITE ABLESTIK 967-1, Epoxy, Die attach LOCTITE® ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. Low temperature cure, electrically conductive paste with reduced risk to delicate...
LOCTITE ABLESTIK 970-1N1, Epoxy, High Strength, General Assembly LOCTITE® ABLESTIK 970-1N1 is a general purpose adhesive which develops high strength on a wide range of substrates General purpose Sag resistant...
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive One component Readily pourable Fast cure...
LOCTITE ABLESTIK ABL 2100A, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high...
LOCTITE ABLESTIK ABL 2288A, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK ABL 2288A die attach adhesive is designed for high reliability leadframe packaging applications. It can be used in a...
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low...
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK ABP 2100AC, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able towithstand the high reflow...
LOCTITE ABLESTIK ABP 2288A, Proprietary Hybrid Chemistry, Die Attach, Sintering Silver Paste LOCTITE® ABLESTIK ABP 2288A die attach adhesive is designed for use in leadframe applications Low cost Use for...
LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure LOCTITE® ABLESTIK ABP 2450 die attach is formulated for use in high brightness LED manufacturing applications. This material is formulated to have...
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package...
LOCTITE ABLESTIK ABP 7000C, Epoxy, Die Attach, Dielectric Adhesive LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package...
LOCTITE ABLESTIK ABP 8035, Silicone, Die Attach LOCTITE® ABLESTIK ABP 8035 adhesive is designed to provide excellent adhesion specially at wirebonding temperature, minimizing failure rate at assembly. This adhesive is...
LOCTITE ABLESTIK ABP 8035M, Silicone Hydrosilylation, Semiconductor material, Die Attach Adhesive LOCTITE® ABLESTIK ABP 8035M is a Non-conductive die attach adhesive designed for LED die attach applications. This silicone based...
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and...
LOCTITE ABLESTIK ABP 8038, Acrylate, Die attach LOCTITE® ABLESTIK ABP 8038 die attach adhesive is designed for high reliability leadframe packaging applications. This adhesive is formulated to eliminate silver migration...
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as...
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as...
LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment...
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability...
LOCTITE ABLESTIK ABP 8068TA, Semi-sintering, Semiconductor, Conductive adhesive LOCTITE® ABLESTIK ABP 8068TA is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. This material’s...
LOCTITE ABLESTIK ABP 8068TB, Silver-filled, Semi-sintering, Semiconductor, Conductive adhesive LOCTITE® ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements.
LOCTITE ABLESTIK ABP 8142B3, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8142B3 non-conductive die attach adhesive is designed for MEMs package applications. Low modulus Black pigmentation for blocking light...
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8151D7 non-conductive die attach adhesive is designed for MEMs package applications. Electrically non-conductive Low modulus Low temperature cure...
LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity...
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus...
LOCTITE ABLESTIK ABP 8415, Epoxy, Die attach LOCTITE® ABLESTIK ABP 8415 adhesive is designed for die attach applications. One component Good adhesion Wire bondable Solvent-free
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast...
LOCTITE ABLESTIK ABP 8520E2, Silicone, Die attach LOCTITE® ABLESTIK ABP 8520E2 silver filled, conductive die attach adhesive is specifically designed for use in crystal oscillator manufacturing applications. Low modulus Low...
LOCTITE ABLESTIK ATB 120U, Rubberized Epoxy, Die Attach LOCTITE® ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
LOCTITE ABLESTIK ATB F125E, Epoxy Film, Die Attach LOCTITE® ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal. Excellent workability High...
LOCTITE ABLESTIK C 805-1, Epoxy, Heat cure LOCTITE® ABLESTIK C 805-1 is the lower viscosity version of ECCOBOND C 805. Electrically conductive Thermally conductive Thixotropic Bond strength Good adhesion to...
LOCTITE ABLESTIK C850-6L, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK C850-6L electrically conductive adhesive is designed for LED die bonding and other die attach applications. Electrically conductive One component Low cure...
LOCTITE ABLESTIK C990J 316, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK C990J 316 die attach is versatile and is designed for microelectronic applications. Electrically conductive Good thermal stability Low extractable ionics...
LOCTITE ABLESTIK C990J 584, Epoxy, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK C990J 584 die attach is versatile and is designed for microelectronic applications. One-component Electrically conductive Good thermal stability...
LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique...
LOCTITE ABLESTIK CE 3511PHV, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3511PHV electrically conductive adhesive is designed for circuit assembly applications. Electrically conductive One component Fast cure at high temperatures...
LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive One component Low viscosity No bleed...
LOCTITE ABLESTIK CE 3514-1, Epoxy, Assembly, ECA LOCTITE® ABLESTIK CE 3514-1 is designed for heat sensitive applications requiring a low cure temperature. Please refer to the TDS for alternate cure...
LOCTITE ABLESTIK CE 3520-3, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3520-3 adhesive combines a high elasticity with a good adhesion on a variety of surfaces, making it suitable for...
LOCTITE ABLESTIK CE 8500, Modified epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 8500 is a solventless epoxy adhesive that combines low stress with good adhesion on nearly all surfaces. Electrically...
LOCTITE ABLESTIK CE 8500-S110, Modified Epoxy, Component Assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 8500-S110 is a solventless epoxy adhesive that combines low stress with good adhesion on nearly all...
LOCTITE ABLESTIK CE3850 one component electrically conductive adhesive is desgined for circuit assembly applications It is specifically recommended for mounting low cost tin (Sn) and nickel (Ni) finished components onto...
LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF...
LOCTITE ABLESTIK CT 5047-2, Epoxy-Amine, Assembly LOCTITE® ABLESTIK CT 5047-2 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics...
LOCTITE ABLESTIK E 3040, Epoxy, Assembly LOCTITE® ABLESTIK E 3040 adhesive is designed for use in automated assembly operations. One component, requires no mixing Fast gel time Low viscosity Fluorescent...
LOCTITE ABLESTIK E 3508 MOD3, Epoxy, Adhesive, Sealant, Assembly LOCTITE® ABLESTIK E 3508 MOD3 epoxy adhesive and sealant is designed for high throughput assembly operations. It is also recommended for...
LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant LOCTITE® ABLESTIK E 3517 is used in applications where a low electrical conductive sealant is required. One component, requires no mixing...
LOCTITE ABLESTIK ECF 561, Epoxy Film, Adhesive Film LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable
LOCTITE ABLESTIK ECF 564AHF, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 564AHF adhesive film is designed for use in hybrid packages where outgassing and ionic contamination must be kept to a...
LOCTITE ABLESTIK ECF 568, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 568 high purity adhesive is designed for substrate attach. This material is a low temperature cure version of ABLEFILM 550...
LOCTITE ABLESTIK EO 0206, Epoxy, Adhesive LOCTITE® ABLESTIK EO 0206 epoxy system is designed for use on electronic devices. One component Non-sag Low halogen content
LOCTITE ABLESTIK FDA 2 BIPAX, Epoxy, Medical LOCTITE® ABLESTIK FDA 2 BIPAX is designed for medical device applications. This material bonds offer resistance to water, weather, galvanic action, petroleum solvents,...
LOCTITE ABLESTIK FDA 2T, Epoxy, Medical LOCTITE® ABLESTIK FDA 2T is designed for medical device applications. LOCTITE ABLESTIK FDA 2T bonds offer resistance to water, weather, galvanic action, petroleum solvents,...
LOCTITE ABLESTIK FDA 8, Epoxy, Medical LOCTITE® ABLESTIK FDA 8 is designed for bonding and coating applications. LOCTITE ABLESTIK FDA 8 bonds offer resistance to water and weathering, galvanic action,...
LOCTITE ABLESTIK FS 849-T, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a...
LOCTITE ABLESTIK G 500HF, Epoxy, Assembly LOCTITE® ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. One component Sag resistant Process...
LOCTITE ABLESTIK G 757, Epoxy, Assembly LOCTITE® ABLESTIK G 757 is specially designed to bond automobile headlamp lenses to reflectors. One component Thixotropic Bonds to a wide variety of substrates...
LOCTITE ABLESTIK G 909, Epoxy, Assembly LOCTITE® ABLESTIK G 909 is designed for very high strength structural bonding especially for dissimilar substrates that will be exposed to a wide range...
LOCTITE ABLESTIK ICP 8118, Acrylate, Electrically Conductive Adhesive. LOCTITE® ABLESTIK ICP 8118 is an electrically conductive adhesive designed for applications that require a very fast cure at low temperatures. It...
LOCTITE ABLESTIK ICP 8282, Acrylate, Electrically Conductive Adhesive. LOCTITE® ABLESTIK ICP 8282 is an electrically conductive adhesive designed for applications that require high adhesive strength, flexibility, low silver and a...
LOCTITE ABLESTIK ICP 8311, Acrylate, Electrically Conductive Adhesive LOCTITE® ABLESTIK ICP 8311 is an electrically conductive adhesive designed for applications that require high adhesive strength, flexibility and a very fast...
LOCTITE ABLESTIK MA 2, Epoxy, Die attach LOCTITE® ABLESTIK MA 2 adhesive is designed for bonding piezo crystals to stainless steel suspensions in the manufacturing of microactutated head gimbal assemblies.
LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required. One component Oxide filled Low...
LOCTITE ABLESTIK NCA 2200, Acrylated Epoxy, Dual Cure, Assembly LOCTITE® ABLESTIK NCA 2200 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components This product...
LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive LOCTITE® ABLESTIK NCA 2340 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This...
LOCTITE ABLESTIK NCA 2350, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK NCA 2350 is designed for use in heat sensitive devices. Fast cure at low temperature One component Good adhesion
LOCTITE ABLESTIK NCA 2360, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK NCA 2360 is designed for use in heat sensitive devices One component Fast cure at low temperature Good adhesion
LOCTITE ABLESTIK NCA 2380, Acrylated Epoxy, Assembly, Dual Cure Adhesive LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This...
LOCTITE ABLESTIK NCA 3280, Epoxy, Rapid Cure, Non-conductive Adhesive LOCTITE® ABLESTIK NCA 3280 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high...
LOCTITE ABLESTIK NCA 3285, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3285 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in...
LOCTITE ABLESTIK NCA 3710H, High Viscosity, Epoxy, Semiconductor, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3710H high viscosity epoxy adhesive is designed for use in camera module applications. It is formulated to...
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and...
LOCTITE ABLESTIK QMI2569, Silver Glass, Semiconductor, Conductive Adhesive LOCTITE® ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal...
LOCTITE ABLESTIK QMI3555, Silver Glass, Die Attach LOCTITE® ABLESTIK QMI3555 is formulated using a Polymodal Metal Flake distribution technology which utilizes a combination of specifically selected silver flakes that, in...
LOCTITE ABLESTIK QMI505MT, Rubberized epoxy, Die attach LOCTITE® ABLESTIK QMI505MT die attach paste is designed for attachment of integrated circuits and components to advanced metal and ceramic surfaces. A package...
LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal...
LOCTITE ABLESTIK QMI519, BMI/Acrylate, Die attach LOCTITE® ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed...
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes.
LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line...
LOCTITE ABLESTIK QMI529HT-2A1, BMI/Acrylate, Die attach LOCTITE® ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this...
LOCTITE ABLESTIK QMI529HT-LV, BMI Hybrid, Die Attach, Conductive Adhesive LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally...
LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates,...
LOCTITE ABLESTIK QMI536NB, Bismaleimide Resin, Die Attach, Low Bleed Non-conductive, PTFE-filled Paste LOCTITE® ABLESTIK QMI536NB is a low bleed non conductive, PTFE-filled paste designed for stacked die applications which require...
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties.
LOCTITE ABLESTIK QMI546, BMI, Die attach LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product...
LOCTITE ABLESTIK S3869, Silicone Epoxy Resin, Die Attach, Thermosetting, Dielectric Adhesive LOCTITE® ABLESTIK S3869 is a thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong...
LOCTITE ABLESTIK SF 40, Amine, Non-conductive adhesive LOCTITE® ABLESTIK SF 40 is a good choice for repairing vertical surfaces with little added weight. Please refer to the TDS for alternate...
LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity.
LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking.
LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend...
LOCTITE ABLESTIK XCE 3111, Epoxy Hybrid, One Component, Electrically Conductive Adhesive LOCTITE® ABLESTIK XCE 3111 one component adhesive is designed for die strap to antenna attach of RFID inlay applications.
LOCTITE CB 3626MHF, Epoxy, Component assembly, NCA, Surface mount adhesive LOCTITE® CB 3626MHF is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. This...
LOCTITE DRI 202 ECO Threadlocker is a medium strength, general purpose preapplied threadlocking adhesive and sealent, which provides excellent resistance to vibration loosening on any threaded fastener. The adhesive is...
LOCTITE DRI 203 ECO Threadlocker is a low strength, preapplied threadlocking adhesive and sealant, which provides excellent resistance to vibration loosening on any threaded fastener.
LOCTITE DRI 204 Threadlocker is a preapplied threadlocking adhesive provides excellent resistance to vibration loosening on any threaded fastener including nuts. Designed for plated and stainless steel fasteners. High dried adhesion,...
LOCTITE DSP 3803, Acrylic, Display material, Optical lamination, Single Component, UV Curable Adhesive LOCTITE® DSP 3803 is a single component UV curable adhesive, specifically designed for PSA lamination process. LOCTITE...
LOCTITE DSP 3806, Acrylic, Silver-filled, Conductive, Die attach LOCTITE® DSP 3806 silver filled, conductive die attach adhesive is specifically designed for use in crystal oscillator manufacturing applications. Low modulus Low...
LOCTITE EA 9360 AERO ● Available in dual cartridge packaging ● High peel strength ● Excellent static stress durability ● >225°F (107°C) service ● Easy mixing two component system ●
LOCTITE EA 9364FR AERO is a two-component flame retardant toughened paste adhesive, with excellent mechanical performance. It contains no halogenated resins common in many other flame retardant products.
LOCTITE EA 9380 AERO ● Low temp curing two-part adhesive ● Meter mixable ● High strength, toughness and high temp resistance ● Prebond humidity resistant
LOCTITE EA 9658 AERO ● Increased toughness with high temperature performance ● Designed for composite, metal or honeycomb ● State of the art flow control to minimize hole blockage and...
LOCTITE EA 9695 AERO ● X-ray Opaque ● Excellent Environmental Resistance ● Reticulatable ● Good Pre and Post Bond Moisture Resistance ● Low Flow ● Allows 250°F/121°C or 350°F/177°C Cure...
LOCTITE EA 9820 AERO is an intermediate density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350 °F (177 °C). It...
LOCTITE EA 9825 AERO is a low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350 °F (177 °C). It may...
LOCTITE ECCOBOND 3781UV, Acrylate, Device Assembly, Structural Bonding LOCTITE® 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature...
LOCTITE ECCOBOND BF 4, Epoxy, Die Attach LOCTITE® ECCOBOND BF 4 adhesive is designed to encapsulate, protect and provide a structural bond for optoelectronic applications. This material compliments the use...
LOCTITE ECCOBOND DP 1005, Die Attach Epoxy LOCTITE® ECCOBOND DP 1005 jet dispensable die attach adhesive is designed for bonding low energy plastic on metal substrates. Chemical resistant Jet dispensable...
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component Non-conductive...
LOCTITE ECCOBOND DS 6349, Acrylic, Single component, UV light curable, Encapsulant LOCTITE® ECCOBOND DS 6349 is a single component, UV light curable material designed for LCD module assembly. This product...
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering...
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used...
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate...
LOCTITE ECCOBOND EO 1072, Epoxy, Dam or Fill Encapsulant LOCTITE® ECCOBOND EO 1072 has a unique rheology that allows the same product to be used as both a dam and...
LOCTITE ECCOBOND F 112, Epoxy, Assembly LOCTITE® ECCOBOND F 112 adhesive is formulated for fiber optic assembly applications. Two components - requires mixing Low viscosity Thermal shock and impact resistant...
LOCTITE ECCOBOND F 113, Epoxy, Assembly LOCTITE® ECCOBOND F 113 is an optically clear adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses and...
LOCTITE ECCOBOND F 120, Epoxy, Assembly LOCTITE® ECCOBOND F 120 adhesive is designed for high performance fiber optic and optical bonding applications. This adhesive provides outstanding chemical resistance to a...
LOCTITE ECCOBOND F 123, Epoxy, Assembly LOCTITE® ECCOBOND F 123 is formulated for terminating single or multi-channel fiber optic connectors. LOCTITE ECCOBOND F 123 bonds offer resistance to water and...
LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA LOCTITE® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its...
LOCTITE ECCOBOND F 253, Two-part, Epoxy, Assembly LOCTITE® ECCOBOND F 253 two-part epoxy is formulated to change color during the cure process to indicate the cure status. LOCTITE ECCOBOND F...
LOCTITE ECCOBOND LA 3032-78, Chemically resistant, Epoxy, Encapsulant LOCTITE® ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and...
LOCTITE ECCOBOND LS 3106P, Acrylate, Lid attach, Sealant LOCTITE® ECCOBOND LS 3106P is specifically designed for bonding optical components requiring excellent water proof sealing. One component UV curable Low viscosity...
LOCTITE ECCOBOND LUX 3042M, Acrylate, Assembly, Dual Cure LOCTITE® ECCOBOND LUX 3042M dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is...
LOCTITE ECCOBOND LUX 4047, Acrylate, Assembly, Photocurable Adhesive LOCTITE® ECCOBOND LUX 4047 photocurable adhesive is designed for high throughput optoelectronic assembly operations. This adhesive cures in seconds when exposed to...
LOCTITE ECCOBOND LUX A4043T, Acrylate, Optoelectronic, Photocurable Adhesive LOCTITE® ECCOBOND LUX A4043T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices. Single...
LOCTITE ECCOBOND LUX A4083T , Acrylate, Assembly, Photocurable Adhesive LOCTITE® ECCOBOND LUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices.
LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This...
LOCTITE ECCOBOND LUX OGR146TUV, Acrylate, Assembly, Photocurable Adhesive LOCTITE® ECCOBOND LUX OGR146TUV photocurable adhesive is designed for high throughput assembly operations. This product also contains a secondary thermal cure mechanism...
LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant LOCTITE® ECCOBOND PH 1 is a one component, non-conductive adhesive.  It has excellent ink resistance and has good adhesion to metal substrates and...
LOCTITE ECCOBOND UV 4003, Epoxy, Opto/Photonics, UV Cure Adhesive LOCTITE® ECCOBOND UV 4003 UV cure adhesive is designed for high throughput assembly operations. One component UV curable
LOCTITE ECCOBOND UV 9030, Acrylate, Adhesive and Sealant, Thixotropic, Solvent resistant LOCTITE® ECCOBOND UV 9030 is a dual cure sealant and adhesive that can be syringe dispensed. One component UV...
LOCTITE ECCOBOND UV 9052, Acrylate, Encapsulant, fast UV cure LOCTITE® ECCOBOND UV 9052 is a single component, UV light/moisture curable adhesive for ink jet applications. One component Fast UV cure...
LOCTITE ECCOBOND UV 9060F, Acrylate, Assembly LOCTITE® ECCOBOND UV 9060F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet...
LOCTITE EF 9890 AERO is an expanding modified epoxy film that cures at 250 °F / 121 °C. Commonly used for abradable seals, which require high abrasion and corrosion resistance.
LOCTITE EF 9899CF AERO is a medium density low exotherm expanding syntactic film suitable for core filling applications. Its typical cured density range is 18 - 35 pcf (0.29 -...
LOCTITE HHD 3542, Polyurethane Hot Melt, Reactive, Long open time, Solidification and Moisture LOCTITE® HHD 3542 is a reactive hot-melt adhesive based on polyurethane prepolymers. It is designed for robotic...
LOCTITE HHD 4042, Epoxy/Acrylate, Device assembly, Structural adhesive LOCTITE® HHD 4042 dual cure adhesive is designed for use in the assembly of electronic components. This product is formulated to initially...
LOCTITE HHD 8150R, Acrylic, Bonding LOCTITE® HHD 8150R is a two component, halogen- and phthalate-free methacrylate adhesive system designed for laptop cover and hand held device bonding. It has been...
LOCTITE HHD 9393 BK, One component, MS Polymer, Good adhesion without primer, Flexible substrate, Device assembly, Elastomeric adhesive LOCTITE® HHD 9393 BK is one component silane modified polymers, which has...
LOCTITE HHD 9393 GR, One component, MS Polymer, Good adhesion without primer, Flexible substrate, Device assembly, Elastomeric adhesive LOCTITE® HHD 9393 GR is one component silane modified polymers, which has...
LOCTITE NC-OO, Halogen-free, No-clean desoldering wick LOCTITE® NC-OO WICK is designed for static-free desoldering applications and repair of PC boards, without the need for subsequent clean-up. It is formulated using...
Loctite® 3101™ is an acrylic, low modulus, high viscosity, UV/visible light cureable adhesive designed for reliable bonding of metals, glass and some thermoplastics and used for diverse bonding, tacking and sealing...
LOCTITE® 3104is an acrylic,high strength, low viscosity, UV/visible light cure adhesive. Primarily designed for bonding rigid and flexible PVC to polycarbonate. The product has shown excellent adhesion to a wide...
LOCTITE® 3105 is an acrylichigh strength, low viscosity, UV/visible light cure adhesive. Primarily designed for bonding rigid and flexible PVC to polycarbonate. Enables easy assembly of components with close-fitting tolerances.
LOCTITE® ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability. Non-conductive Fast cure Thin bondline Excellent gap filling...
LOCTITE® ABLESTIK ATB 125 adhesive film is formulated for use in wafer lamination proceses. It combines process ease with the proven reliability of a hybrid chemistry-based die attach material. Excellent...
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can...
LOCTITE® DRI 205™ Threadlocker is a high strength, preapplied threadlocking adhesive, which provides excellent resistance to vibration loosening on any threaded fastener. It provides a low/controlled on torque assembly and...
LOCTITE® DRI MICROCAPS P2 for preapplied threadlockers contains small microcapsules, excellent for all size fasteners, especially fine threads.
LOCTITE® DRI STS™ Pre-applied Threadlocker / Thread Sealant is a medium strength, preapplied threadlocker and sealant for fasteners with straight threads. This fast cure adhesive is activated during assembly and cures to...
LOCTITE® Fixmaster 4 Minute Epoxy. Cartridge-based, general purpose, two-part epoxy. Ideal for emergency repairs or where fast cure time is required. Sets in 5 minutes. Requires hand held dispenser P/N...
Loctite® Fixmaster® Crack Filler, a two-component, natural in color, epoxy repair adhesive that is 100% solids and contains no solvents. It has excellent workability and flow. Fills cracks in concrete,...
LOCTITE® Hysol 740LV Hot Melt is an EVA-based, fast setting adhesive that is a lower viscosity version of Hysol 740 Hot Melt. It is recommended for packaging and fabric reinforcing...
Loctite® Klean 'N Prime™ Anaerobic Activator is a solvent based primer that features very long on-part life. Use to speed the cure of all Loctite anaerobic products and ensure proper...
LOCTITE® MR Flex 80 Putty Pourable Repair Compound isa trowelable, two-part urethane for rebuilding and repairing rubber parts and linings, providing impact, abrasion, and corrosion-resistant protection.
LOCTITE® Power Grab Industrial Construction Adhesive is a single-component, off-white, heavy duty, high strength, construction grade adhesive for interior and exterior repairs or building projects. Typical Applications: Bonds to most...
Loctite® QuickTite® Gel is a multi-purpose gel instant adhesive for Automotive Aftermarket repairs. A premium instant adhesive that is fast acting and provides a stronger, longer lasting bond on a variety...
LOCTITE® 3092 is a two-component, rapid curecyanoacrylate adhesive for bonding a variety of plastics (except PE, PP and PTFE), rubber and porous materials (wood, paper, leather). Under normal conditions, once...
LOCTITE® 3107 is an acrylic,flexible, low viscosity, fluorescing, UV/Visible light cure adhesive for difficult-to-bond plastics including plasticized PVC. Very rapid cure.
LOCTITE® A-6750 Structural Adhesive is a twostep acrylic,toughened adhesive that combines ease of use with a high level of performance. This adhesive is nonflammable, 100% solids, and has a lower...
LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental...
LOCTITE® E-119HP Hysol Epoxy Adhesive is a one-component, heat cure epoxy adhesive exhibits very low wicking during cure when exposed to elevated cure temperatures. A thixotropic, non-sag, beige paste that...
Loctite® E-50CR™ Hysol® Epoxy Adhesive is a flowable, two-component, extended room temperature curing multi-surface structural adhesive with excellent chemical resistance properties. Black, 50-minute work life. Loctite E-50CR Hysol is the...
LOCTITE® E-7570 Epoxy Adhesive is low temperature resistant, multi-surface structural adhesive. A one-component, heat cure epoxy, exhibiting excellent low temperature impact resistance.
LOCTITE® E-910 Epoxy Adhesive is a one-component, heat-cure epoxy can be cured at low temperatures, making it ideal for bonding most plastics.
LOCTITE® EA 9309NA AERO is a toughened adhesive ideal for bonding metal, wood, plastics and glass. Bonds are flexible and resist water, salt spray and most common fluids. Its outstanding...
LOCTITE® EA 9377 AERO is a moldable plastic shim, excellent microcracking resistance under thermal cycling. High compressive strength.
LOCTITE® EA 9394 AERO is a thixotropic adhesive with structural properties to 177C / 350F. Volumetric mix ratio 4:1. LOCTITE EA 9394 AEROis also used as a liquid shim.
LOCTITE® EA 9696 AEROis a moisture resistant, toughened 121C / 250F service, modified epoxy film. Qualified to BMS 5-101 and BMS 5-129.
LOCTITE® EA 9895 AERO is a pre-impregnated polyester peel ply product supplied in film form, specially designed to cure at 177C (350F). Compatible with state-of-the-art composite prepreg resin systems.It has...
LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip...
LOCTITE® EF 562SFR AERO is an expanding foam core splicing adhesive supplied as a film for core splicing and closeout of honeycomb panels. Fire retardant structural adhesive. May be cured...
Loctite® H6051™ Speedbonder™ Structural Adhesive is a white UV resistant adhesive ideal for bonding gel-coated surfaces. Excellent non-sagging properties.
LOCTITE® H8110 Speedbonder Structural Adhesive isa two part acrylic and afast fixture version of H8000. Itis an excellent structural metal bonder especially for aluminum. The product fixtures in 5-10 minutes...
Loctite® Hysol® 7805™ Hot Melt Adhesive polyamide hot melt is a high performance adhesive recommended for bonding a broad variety of difficult substrates. Its high strength and medium viscosity optimizes...
Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions...
LOCTITE® M-31CL Hysol Medical Device Epoxy Structural Adhesive is an ultra clear, low viscosity adhesive that bonds glass, ceramic, metal, and many rigid plastics. Ideal for applications where optical clarity...
Loctite® OM4101™ is a halogen free primer designed to improve adhesion in plastic overmolding processes used in hand held devices like mobile phones, tablets, & laptops. This product is only...
Loctite® OM4501™ is a halogen free primer designed to improve adhesion in plastic overmolding processes used in hand held devices like mobile phones, tablets, & laptops. This product is only...
Loctite® OM8200™ is a halogen free primer designed to improve adhesion in plastic overmolding processes used in hand held devices like mobile phones, tablets, & laptops. This product is only...
Loctite® QuickTite® Instant Adhesive is a general purpose, surface insensitive instant adhesive gel featuring an innovative, precision flow control applicator. Allows for pinpoint control of the exact amount and placement...
Loctite® QuickTite® is a multi-purpose liquid instant adhesive for Automotive Aftermaket repairs. A premium instant adhesive that is faster acting and provides a stronger, longer lasting bond on a variety...
LOCTITE® SF FM Etch Agent Activator is for conveyor belt repair.
LOCTITE® Superflex Equipment Green RTV Silicone Adhesive / Sealant cures to a tough, flexible rubber. Makes reliable formed-in-place gaskets that resist shrinking, cracking, and migrating. Coats pre-cut gaskets to increase...
Low viscosity ethyl-based instant adhesive. ISO 10993 certified. colorless and transparent. LOCTITE® 4061 is a transparent, colorless, low viscosity, ethyl-based instant adhesive that is particularly suitable for plastics and rubbers.
Low viscosity light cure acrylic adhesive designed for applications where a fast curing, highly flexible adhesive is required. Loctite® AA 3951 is a colorless to straw low viscosity light cure...
Low viscosity, ethyl-based instant adhesive. Well suited to absorbent surfaces. ISO 10993 certified. LOCTITE® 4011 is a low viscosity, ethyl-based instant adhesive for the assembly of difficult-to-bond materials which require...
Low viscosity, liquid ethyl cyanoacrylate adhesive designed for bonding of plastics and elastomeric materials where very fast fixturing is required. LOCTITE® 404 is a transparent, colorless to straw colored, low...
Low viscosity, modified acrylate acrylic adhesive which cures in seconds upon exposure to UV radiation of 365nm to form an impact resistant bond. LOCTITE® AA 3492 is a transparent, low...
Low viscosity, modified acrylate acrylic adhesive which cures in seconds upon exposure to UV radiation of 365nm to form an impact resistant bond. LOCTITE® AA 3493 (known as LOCTITE AA...
Low viscosity, plasticized ethyl cyanoacrylate adhesive designed for temporary bonding applications of metals and glass. LOCTITE® 412 is a colorless, transparent, low viscosity, plasticized ethyl cyanoacrylate adhesive designed for temporary...
Macroplast UR-8340RD , Red colored, high strength, thermoset liquid moisture cure adhesive for panel lamination. Slow cure speed.
Medium strength, medium viscosity thixotropic threadlocking adhesive for metal thread sizes up to M36. LOCTITE® 242 is a medium strength, medium viscosity, methacrylate-based threadlocking adhesive offering general purpose qualities. The...
Medium to high strength pre-applied threadlocker. LOCTITE® EA 2045 KIT20LBEN is a high strength, high dried adhesion, fast cure, preapplied threadlocking adhesive with temperature performance up to 400°F. Provides excellent...
Medium/high strength, thixotropic methacrylate-based threadlocking adhesive which fluoresces under UV light to allow monitoring. LOCTITE® 262 is a red, general purpose, medium to high strength, thixotropic methacrylate-based adhesive. Steel fixture...
Methacrylate acrylic adhesive paste designed for locking and sealing metal pipes and fittings which is particularly suitable for stainless steel. LOCTITE® 5802 is an off-white to peach-colored methacrylate acrylic adhesive...
Modified acrylic ester adhesive liquid typical applications include bonding dissimilar materials such as metals, glass or ceramics. LOCTITE® AA 312 is a clear, amber, modified acrylic ester adhesive liquid typical...
Modified acrylic structural adhesive liquid which may be used where very fast assembly is required. LOCTITE® AA 392 is a beige to dark amber, translucent, modified acrylic structural adhesive liquid...
Neoprene solvent-based contact cement gel used for all types of weather-stripping, porous and non-porous surfaces and general purpose bonding. LOCTITE® MR 5412 is a yellow, neoprene solvent-based contact cement gel...
Off-white to light yellow 2-part hybrid adhesive with a high viscosity/non-drip for use in structural bonding. High humidity and vibration resistance. LOCTITE® HY 4090 has a high viscosity and is...
Off-white, 2-part, epoxy adhesive which cures at room temperature to form a tough bondline providing high peel resistance and high shear strengths. LOCTITE® EA M-21HP is an off-white, 2-part, epoxy...
Optical bonding UV curing acrylic for Displays. Part of Henkel's Liquid Optically Clear Adhesives (LOCAs) line of products.
Pale-yellow, general purpose structural bonder which is ideal for bonding dissimilar substrates like PVC, phenolic and acrylic compounds. LOCTITE® AA 330 is a no-mix, pale-yellow, general purpose structural bonder which...
Perfluocarbon-based activator that increases the cure speed of LOCTITE instant adhesive. Non-flammable and non-combustible. LOCTITE® SF 7109 is a perfluocarbon-based activator that increases the cure speed of LOCTITE instant adhesive.
Polyurethane resin and isocyanate compound kit which cures to a tough, resilient adhesive. LOCTITE® PC 7350 is a 2-part, black, 100% solid, room temperature-curing polyurethane resin and isocyanate compound kit...
Reactive monomer-based, solvent-free dimethacrylate ester surface primer paste for LOCTITE anaerobic adhesives and sealants supplied in stick form. LOCTITE® SF 7088 is a turquoise, reactive monomer-based, solvent-free dimethacrylate ester surface...
Reactive polyurethane hotmelt adhesive. It is designed for robotic dispensing and has a relatively long open time. LOCTITE® HHD 3541 is an ivory to light amber, high viscosity, reactive polyurethane...
Red, high strength, high viscosity methacrylate-based threadlocking adhesive, suited to large threads. Fluoresces to allow monitoring. LOCTITE® 277 is a red, high strength, high viscosity, methacrylate-based threadlocking adhesive. It has...
Red, high strength, medium viscosity, methacrylate-based threadlocking adhesive with high temperature resistance. LOCTITE® 272 is a red, medium viscosity, methacrylate-based threadlocking adhesive with high strength. With a fixture time on...
Room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive with a medium working life. LOCTITE® EA E-40FL is a gray, opaque, room temperature-cure, toughened, medium viscosity, industrial grade structural...
Solvent-free, light cure, modified acrylic ester adhesive liquid designed for tacking, bonding, encapsulating, coating and sealing. LOCTITE® AA 3751 is an amber to yellow, transparent, solvent-free, light cure, modified acrylic...
Thick urethane rubber and belt repair kit which contains all the materials needed to make a durable repair to conveyor belts and other rubber parts. LOCTITE® MR 5023 is a...
This product is formulated to provide fixturing strength within 20 to 25 minutes and when fully cured forms a resilient bond that maintain its strength over a wide range of...
Thixotropic acrylic methacrylate ester liquid adhesive designed for the bonding of cylindrical fitting parts. LOCTITE® 6001 is a rose beige to off-white thixotropic acrylic methacrylate ester liquid adhesive designed for...
Thixotropic, heat-cured, industrial grade structural epoxy adhesive paste with tough, strong bonds with excellent peel resistance and impact strength. LOCTITE® EA E-214HP is a light gray, thixotropic, heat-cured, industrial grade...
Thixotropic, methacrylate ester acrylic thread sealant liquid designed for threaded fittings commonly found in hydraulic and pneumatic systems. LOCTITE® 5452 is a purple, thixotropic, methacrylate ester acrylic thread sealant liquid...
Thixotropic, modified acrylic structural adhesive liquid designed primarily for securing permanent magnets in motor magnet bonding applications LOCTITE® AA 332 is a light yellow to dark amber, opaque, thixotropic, modified...
Thixotropic, moisture-cured, non-silicone, oxime-free, polyacrylate based adhesive/sealant designed for flange sealing and formed-in-place gaskets. LOCTITE® AA 5810A is a black, thixotropic, moisture-cured, non-silicone, oxime-free, polyacrylate based adhesive/sealant paste. It is...
Threadlocking Adhesive - high strength. Permanent locking. White material safety data sheet, no labelling. Suitable for all metal threaded assemblies. LOCTITE® 2700 is a high-strength threadlocker for maximum efficacy in...
Threadlocking Adhesive - low strength. Easy disassembly. Suitable for all metal threaded assemblies. LOCTITE® 222 is a low-strength threadlocker that allows the adjustment of screws including countersunk head screws and...
Threadlocking Adhesive - medium strength. General purpose. Suitable for all metal threaded assemblies. LOCTITE® 243 is a general purpose threadlocker of medium bond strength. This threadlocker secures and seal bolts,...
Threadlocking Adhesive - medium strength. Non-drip. Easy-to-use stick. Suitable for all metal threaded assemblies. LOCTITE® 248 is a general purpose threadlocker with medium bond strength. This product is available in...
Threadlocking Adhesive - medium strength. White material safety data sheet, no labelling. Suitable for all metal threaded assemblies. LOCTITE® 2400 is a medium threadlocker formulated to secure and seal bolts,...
Threadlocking adhesive - medium/ high strength. Ideal for locking preassembled fasteners. LOCTITE® 290 is a liquid medium/high-strength threadlocker designed for the locking and sealing of threaded fasteners. Because of its...
To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing...
Toughened, medium-viscosity, room temperature cure, industrial grade epoxy adhesive with extended work life. LOCTITE® EA E-60HP is an off-white, toughened, medium-viscosity, room temperature cure, industrial grade epoxy adhesive with extended...
Toughened, modified acrylic adhesive paste with medium viscosity. This adhesive is designed for bonding metal substrates. LOCTITE® AA 331 is a light yellow to sand yellow, toughened, modified acrylic adhesive...
Toughened, room temperature-cure methacrylate adhesive paste kit which is used in the portable devices market. LOCTITE® AA HF8075LV is a 2-part, blue, toughened, room temperature-cure methacrylate adhesive paste kit. It...
Translucent, colorless, 1-part, high viscosity, moisture-cured, ethyl cyanoacrylate adhesive gel adhesive. LOCTITE® 499 is a translucent, colorless, 1-part, high viscosity, moisture-cured, ethyl cyanoacrylate adhesive gel. It is a general-purpose adhesive...
Translucent, colorless, 1-part, medium viscosity, UV light-cured, acrylated urethane acrylic liquid adhesive LOCTITE® AA 3108 is a translucent, colorless, 1-part, medium viscosity, UV light-cured, acrylated urethane acrylic liquid adhesive. It...
Translucent, pale straw to amber, 1-part, medium viscosity, UV/visible light-cured, liquid modified acrylic adhesive. LOCTITE® AA 3526 is a translucent, pale straw to amber, 1-part, medium viscosity, UV/visible light-cured, liquid...
Transparent to slightly hazy, 1-part, medium viscosity, thixotropic, UV/visible light-cured, acrylated urethane liquid adhesive. LOCTITE® AA 3201 is a transparent to slightly hazy, 1-part, medium viscosity, thixotropic, UV/visible light-cured, acrylated...
Transparent, amber, UV light-cure acrylic adhesive formulated for fast surface cure. Ideal for plastics and also used for metals and ceramics. LOCTITE® AA 3011 LC is a transparent, light-amber, UV...
Transparent, cloudy colorless to pale yellow cyanoacrylate/acryli c hybrid gel adhesive that provides a fast fixture at room temperature. LOCTITE® HY 4070 is a 2-part, transparent, cloudy colorless to pale...
Transparent, colorless alkoxyethyl-based instant adhesive (cyanoacrylate) which cures very quickly when confined between two close-fitting surfaces. LOCTITE® 408 is a transparent, colorless, low odor, low bloom, alkoxyethyl-based instant adhesive (cyanoacrylate)...
Transparent, colorless ethyl-based instant adhesive gel with a fixture time of 20 - 60 secs. LOCTITE® 409 is a transparent, colorless, ethyl-based instant gel adhesive suitable for plastics and polyolefins...
Transparent, colorless to light yellow, 1-part, very low viscosity, alkoxyethyl-based cyanoacrylate adhesive. LOCTITE® 4081 is a transparent, colorless to light yellow, 1-part, very low viscosity, moisture-cured, alkoxyethyl-based cyanoacrylate adhesive. It...
Transparent, colorless, 1-part, high viscosity, general-purpose ethyl cyanoacrylate liquid instant adhesive. LOCTITE® 4161 is a transparent, colorless, 1-part, high viscosity, moisture-cured, general-purpose ethyl cyanoacrylate liquid instant adhesive. It is suitable...
Transparent, colorless, ethyl-based instant adhesive which has a low viscosity. Suitable for plastics, rubbers and metals. LOCTITE® 414 is a colorless to straw-colored, transparent, general purpose ethyl-based cyanoacrylate liquid instant...
Transparent, colorless, high viscosity, flexible ethyl-based instant adhesive resistant to high temperatures and humidity, good impact resistance. LOCTITE® 4204 is a transparent, colorless, high viscosity, general purpose ethyl-based instant adhesive.
Transparent, colorless, methyl-based instant adhesive which has a high viscosity. Well suited to metals and suitable for rubbers and plastic. LOCTITE® 415 is a transparent, colorless, high viscosity, methyl-based instant...
Transparent, colorless, toughened humidity-cured ethyl-based instant adhesive. Well suited to plastics, rubbers, metals and porous/acidic surfaces. LOCTITE® 435 is a colorless, toughened, ethyl-based instant adhesive. It has a fixture time...
Transparent, colorless, very low viscosity, sulfenamide-based, liquid cyanoacrylate cure activator containing n-Heptane. LOCTITE® SF 7113 is a transparent, colorless, very low viscosity, sulfenamide-based, liquid cyanoacrylate cure activator containing n-Heptane which...
Transparent, light amber, light-cure acrylic-based instant adhesive. High humidity and chemical resistance. High, on-demand curing speed. LOCTITE® AA 3345 is a transparent, light amber, light-cured, universal, acrylic-based instant adhesive, well...
Transparent, light yellow UV/visible light-cure acrylic adhesive, ideal for stress-sensitive plastics and metals; also suited to glass and ceramics. LOCTITE® AA 3106 is a transparent, light yellow, UV/Vis light-cured acrylic...
Transparent, pale green, UV/Vis light-cure cyanoacrylate adhesive which also cures in the presence of surface moisture. Ideal for plastics. LOCTITE® 4305 is a transparent, pale green, cyanoacrylate cured by exposure...
Transparent, yellowish, light-cure acrylic-based instant adhesive. For stress sensitive-plastics with high, on-demand curing speed. ISO 10993 qualified. LOCTITE® AA 3321 is a transparent, light yellow, light-cured, universal, acrylic-based instant adhesive,...
UV, liquid acrylic adhesive for a wide variety of applications that require fast cure, flexibility, high adhesion and autoclave resistance. LOCTITE® AA 3933 is a transparent to slightly hazy, UV...
UV-cured modified acrylate acrylic adhesive which has excellent adhesion to glass and metals with typical applications including terminal pin bonding. LOCTITE® 3189UV is a green, transparent, medium viscosity, UV-cured modified...
UV/Light cure acrylic adhesive for medical bonding applications where fluorescent properties of substrates interfere with the detection of adhesives. LOCTITE® AA 3979 is a translucent to hazy yellow gel, 1-part,...
Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface...
Water-based, pressure sensitive adhesive LOCTITE® AA 40-514A™ is a water-based, pressure sensitive adhesive suitable for bonding fibrous glass, jute, and other types of lightweight insulation to ductwork and to housings...
White to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified...
Yellow to amber, no-mix, medium viscosity (thixotropic) structural and magnet bonder which is activated with LOCTITE SF 7649. LOCTITE® AA 326 is a yellow to amber, no-mix, medium viscosity (thixotropic)...
Yellow-opaque, high viscosity, no-mix structural bonder which has high temperature resistance, good impact resistance and good humidity resistance. LOCTITE® AA 3342 is a yellow-opaque, high viscosity, no-mix structural bonder which...

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