Henkel Corporation - Industrial Thermal Interface Materials BERGQUIST SIL PAD TSP K900

BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. BERGQUIST SIL PAD TSP K900 combines the thermal transfer properties of well-known Sil-Pad rubber with the physical properties of a film. BERGQUIST SIL PAD TSP K900 is a durable insulator that withstands high voltages and requires no thermal grease to transfer heat. BERGQUIST SIL PAD TSP K900 is available in customized shapes and sizes. Options and Configurations Configuration - 12" x 12" sheets, 12" x 250 rolls or custom configuration Adhesive - Adhesive one side, no adhesive Standard thickness - 0.006" Custom made configurations available upon request Benefits Thermal impedance: 0.48°C-in2/W (@50 psi) Withstands high voltages High dielectric strength Very durable Less sensitive to clamping pressure because of its smooth surface finish