Encapsulants and Potting Compounds Datasheets

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Encapsulants and Potting Compounds Datasheets From:
Headquarters
Arnold Magnetic Technologies
United States
CHT USA Inc.
United States
DigiKey
United States
Hernon Manufacturing, Inc.
United States
MacDermid Alpha Electronics Solutions
United States
Master Bond, Inc.
Hackensack, NJ
RS Components, Ltd.
United Kingdom
TE Connectivity
United States
ACCRAbond, Inc.
Olive Branch, MS
Aremco Products, Inc.
Valley Cottage, NY
Bluestar Silicones USA Corp.
East Brunswick, NJ
Chemence Inc.
United States
Dampney Company, Inc.
Everett, MA
DuPont Electronics & Imaging
United States
Electro-Lite Corporation
Bethel, CT
Epoxies Etc...
Cranston, RI
Epoxy Technology
United States
GS Polymers, Inc.
Brea, CA
Hapco, Inc.
Hanover, MA
Henkel Corporation - Electronics
Irvine, CA
Koford Engineering, LLC
Winchester, OH
LG Chemical of America Inc.
Englewood Cliffs, NJ
Monocrystal, Inc.
Russia
Novagard Solutions
Cleveland, OH
OMEGA Engineering, Inc.
Norwalk, CT
Protavic America, Inc.
Londonderry, NH
R. S. Hughes Company, Inc.
Sunnyvale, CA
Shenzhen DeepMaterial Technologies Co., Ltd
China
Shiu Li Technology Co., Ltd
Taiwan
Techsil Limited
United Kingdom
Wacker Chemical Corp.
Adrian, MI
Allied Electronics, Inc.
Fort Worth, TX
Bulgin Components
United Kingdom
Chip Quik, Inc.
United States
Electrolube
United States
GC Electronics
United States
ITW Chemtronics
United States
ITW Devcon
United States
Loctite UK
United Kingdom
MG Chemicals
Canada
Momentive Performance Materials Inc.
United States
Raytech Gels
Cooper City, FL
T-Global Technology Co., Ltd.
Taiwan