Henkel Corporation - Industrial Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
Potting, Encapsulating and Injection Molding Compounds -- LOCTITE 3703 Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily...
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 7000ULM BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a...
Thermal Interface Materials -- BERGQUIST SIL PAD TSP PP1200 BERGQUIST SIL PAD TSP PP1200, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PP1200 is a fiberglass-based insulator coated with a filled polyester resin. The material offers superior thermal...
Thermal Interface Materials -- BERGQUIST SIL PAD TSP PP900 BERGQUIST SIL PAD TSP PP900, Polyester-Based, Fiberglass- reinforced, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PP900 is a fiberglass-reinforced insulator coated with a filled polyester resin. BERGQUIST SIL PAD...
Thermal Interface Materials -- BERGQUIST SIL PAD TSP PPK1300 BERGQUIST SIL PAD TSP PPK1300, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PPK1300 is a composite of film coated with a polyester resin. The material offers superior thermal...
Encapsulants -- LOCTITE PE 3164 Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear...
Encapsulants -- LOCTITE ECCOBOND FP4410HF Encapsulants
Potting, Encapsulating and Injection Molding Compounds -- LOCTITE 3508NH LOCTITE 3508NH, Epoxy, Underfill LOCTITE® 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners...
Potting, Encapsulating and Injection Molding Compounds -- LOCTITE 3517M LOCTITE 3517M, Epoxy, Underfill LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications. One component - requires no...
Industrial Adhesives -- LOCTITE ABLESTIK 2033SC LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 813J01 BIPAX LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured...
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 8387BM LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive Black pigmentation for blocking stray light
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 933-1 LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion...
Industrial Adhesives -- LOCTITE ABLESTIK ABP 2036SF LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package...
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK ME 990 LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required. One component Oxide filled Low...
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK NCA 9300UV LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and...
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK UV300X LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking.
Electrically Conductive Adhesives -- LOCTITE ABLESTIK XCE 3104XL LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend...
Potting Compounds -- LOCTITE CAT 27-1 LOCTITE CAT 27-1 is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is also...
Encapsulants -- LOCTITE CAT 50-2 LOCTITE CAT 50-2, Hardener, Curing Agent LOCTITE® CAT 50-2 curing agent is recommended for the manufacture of silicone resins of the condensation type. This material should be considered a "moderate"...
Encapsulants -- LOCTITE CAT 9 UNP LOCTITE CAT 9 is a two component epoxy encapsulant designed for general potting applications. It is a flame retardant version of STYCAST 2651-40.
Encapsulants -- LOCTITE ECCOBOND DP 1006 LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component Non-conductive...
Encapsulants -- LOCTITE ECCOBOND DS 3318BL LOCTITE ECCOBOND DS 3318BL, Acrylic, Coating and Sealant LOCTITE® ECCOBOND DS 3318BL fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed...
Encapsulants -- LOCTITE ECCOBOND DS 3318BLX LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for...
Encapsulants -- LOCTITE ECCOBOND DS 3318LVT LOCTITE ECCOBOND DS 3318LVT, Acrylate, Coating and Sealant LOCTITE® ECCOBOND DS 3318LVT fast, UV curable material is specially formulated for use in applications requiring lower energy cure. Its excellent moisture...
Structural Adhesives -- LOCTITE ECCOBOND DS 6349 LOCTITE ECCOBOND DS 6349, Acrylic, Single component, UV light curable, Encapsulant LOCTITE® ECCOBOND DS 6349 is a single component, UV light curable material designed for LCD module assembly. This product...
Underfills -- LOCTITE ECCOBOND E 1172 A LOCTITE ECCOBOND E 1172 A, Void-free, Epoxy, Underfill LOCTITE® ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This...
Potting, Encapsulating and Injection Molding Compounds -- LOCTITE ECCOBOND E 1216M LOCTITE ECCOBOND E 1216M, Epoxy, Underfill LOCTITE® ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures...
Encapsulants -- LOCTITE ECCOBOND E 3230 LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used...
Encapsulants -- LOCTITE ECCOBOND EN 1350 LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive Fast cure at low temperatures Low temperature cure High temperature resistance...
Encapsulants -- LOCTITE ECCOBOND EN 3410 LOCTITE ECCOBOND EN 3410, Acrylate, Encapsulant, Coating LOCTITE® ECCOBOND EN 3410 encapsulant is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It...
Industrial Adhesives -- LOCTITE ECCOBOND EN 3707F LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate...
Encapsulants -- LOCTITE ECCOBOND EN 3838T LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides...
Encapsulants -- LOCTITE ECCOBOND EN 3839 LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top LOCTITE® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well...
Encapsulants -- LOCTITE ECCOBOND EN 3860T LOCTITE ECCOBOND EN 3860T, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3860T is a CSP/BGA encapsulant formulated to have low viscosity and good flow performance. LOCTITE ECCOBOND EN 3860T encapsulant cures quickly...
Industrial Adhesives -- LOCTITE ECCOBOND EO 1072 LOCTITE ECCOBOND EO 1072, Epoxy, Dam or Fill Encapsulant LOCTITE® ECCOBOND EO 1072 has a unique rheology that allows the same product to be used as both a dam and...
Encapsulants -- LOCTITE ECCOBOND FP0087 LOCTITE ECCOBOND FP0087, Epoxy, Encapsulation LOCTITE® ECCOBOND FP0087 yields best results when used to encapsulate a device enclosed in a cavity or potting ring, which restricts the flow of the...
Encapsulants -- LOCTITE ECCOBOND FP4323 LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is...
Encapsulants -- LOCTITE ECCOBOND FP4451 LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam LOCTITE® ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in...
Encapsulants -- LOCTITE ECCOBOND FP4460 LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top LOCTITE® ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500...
Encapsulants -- LOCTITE ECCOBOND FP4470 LOCTITE ECCOBOND FP4470, Epoxy, Encapsulant LOCTITE® ECCOBOND FP4470 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand...
Encapsulants -- LOCTITE ECCOBOND FP4530SF LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to...
Industrial Adhesives -- LOCTITE ECCOBOND LA 3032-78 LOCTITE ECCOBOND LA 3032-78, Chemically resistant, Epoxy, Encapsulant LOCTITE® ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and...
Encapsulants -- LOCTITE ECCOBOND LV4518-38 LOCTITE ECCOBOND LV4518-38, Acrylate, Sealant, Thixotropic LOCTITE® ECCOBOND LV4518-38 thixotropic, solvent resistant, UV curing sealant formulated for gold and plastic substrates such as polyester and polyetherimide. It may be syringe-dispensed...
Encapsulants -- LOCTITE ECCOBOND PH 1 LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant LOCTITE® ECCOBOND PH 1 is a one component, non-conductive adhesive.  It has excellent ink resistance and has good adhesion to metal substrates and...
Encapsulants -- LOCTITE ECCOBOND UF 3513HF LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures...
Potting, Encapsulating and Injection Molding Compounds -- LOCTITE ECCOBOND UF 3811 LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material...
Encapsulants -- LOCTITE ECCOBOND UF 3912 LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications. One component Halogen free Snap curable Fast flow High...
Encapsulants -- LOCTITE ECCOBOND UV 9030 LOCTITE ECCOBOND UV 9030, Acrylate, Adhesive and Sealant, Thixotropic, Solvent resistant LOCTITE® ECCOBOND UV 9030 is a dual cure sealant and adhesive that can be syringe dispensed. One component UV...
Encapsulants -- LOCTITE ECCOBOND UV 9052 LOCTITE ECCOBOND UV 9052, Acrylate, Encapsulant, fast UV cure LOCTITE® ECCOBOND UV 9052 is a single component, UV light/moisture curable adhesive for ink jet applications. One component Fast UV cure...
Industrial Adhesives -- LOCTITE ECCOBOND UV 9060F LOCTITE ECCOBOND UV 9060F, Acrylate, Assembly LOCTITE® ECCOBOND UV 9060F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet...
Encapsulants -- LOCTITE ECCOBOND UV 9061F LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly LOCTITE® ECCOBOND UV 9061F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet...
Encapsulants -- LOCTITE STYCAST 1264J LOCTITE STYCAST 1264J, Epoxy, Slightly Flexible, Virtually Stress Free, Encapsulant, Potting LOCTITE® STYCAST 1264J Parts AB cures slightly flexible and virtually stress free. Some darkening of the cured material will...
Encapsulants -- LOCTITE STYCAST 1265J LOCTITE STYCAST 1265J, Epoxy, Encapsulant LOCTITE® STYCAST 1265J Parts AB is designed for embedding stress sensitive components or where inspections and repairs are desired. It can be cut easily for...
Encapsulants -- LOCTITE STYCAST 1269A LOCTITE STYCAST 1269A, Epoxy, Encapsulant LOCTITE® STYCAST 1269A is a two-component crystal clear, heat cured, tough, epoxy encapsulant. This material is resistant to discoloration even after exposure to elevated temperatures...
Encapsulants -- LOCTITE STYCAST 2651 LOCTITE STYCAST 2651, Dielectric Grade, Epoxy, Encapsulant LOCTITE® STYCAST 2651 is a dielectric grade epoxy encapsulant designed for general purpose applications and has excellent adhesion to a wide variety of...
Encapsulants -- LOCTITE STYCAST 2651-40 W1 LOCTITE STYCAST 2651-40 W1, Epoxy, Potting, Encapsulant LOCTITE® STYCAST 2651-40 W1 epoxy encapsulant is designed for general purpose applications and has excellent adhesion to a wide variety of substrates. When...
Encapsulants -- LOCTITE STYCAST 2741 LOCTITE STYCAST 2741, Epoxy, Encapsulant LOCTITE® STYCAST 2741 is designed for electronic embedment and in sealing or cementing of metals, ceramics and plastics. The hardness can be adjusted by varying...
Encapsulants -- LOCTITE STYCAST 2762FT LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is...
Potting Compounds -- LOCTITE STYCAST 2850 MT LOCTITE STYCAST 2850 MT is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is...
Potting Compounds -- LOCTITE STYCAST 2850FT BL LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant LOCTITE® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations.
Encapsulants -- LOCTITE STYCAST 2850FTJ LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant LOCTITE® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is...
Encapsulants -- LOCTITE STYCAST 2850KT CAT 24LV LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended...
Encapsulants -- LOCTITE STYCAST 2851FT LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal...
Electrically Non-Conductive Adhesives -- LOCTITE STYCAST 3103 BIPAX LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating...
Encapsulants -- LOCTITE STYCAST 4640 LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low...
Encapsulants -- LOCTITE STYCAST 5952-1 LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating.
Encapsulants -- LOCTITE STYCAST E 2517 LOCTITE STYCAST E 2517, Epoxy, Encapsulant LOCTITE® STYCAST E 2517 epoxy encapsulant is formulated for use on bare chip protection in a variety of advanced packages where ease of flow...
Encapsulants -- LOCTITE STYCAST E 2534 FR CAT 9 LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not...
Encapsulants -- LOCTITE STYCAST EE 0182 LOCTITE STYCAST EE 0182(A), Two part, White, Epoxy, Encapsulant LOCTITE® STYCAST EE 0182/EB 6025 is a two part, white epoxy casting system with low abrasion and rapid gel properties. Two...
Encapsulants -- LOCTITE STYCAST EE 0182/EB 6025 LOCTITE STYCAST EE 0182/EB 6025, Two part, White, Epoxy, Encapsulant LOCTITE® STYCAST EE 0182/EB 6025 is a two part, white epoxy casting system with low abrasion and rapid gel properties.
Encapsulants -- LOCTITE STYCAST EE 4215/HD 3561 LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating LOCTITE® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly...
Encapsulants -- LOCTITE STYCAST EO 8019 LOCTITE STYCAST EO 8019, Epoxy, Potting and Encapsulating, Resilient, Non-sag, Heat Cure Glass adhesive LOCTITE STYCAST EO 8019 epoxy, is a resilient, non-sag, heat cure glass adhesive. Non-sag properties are...
Encapsulants -- LOCTITE STYCAST ES 0506 LOCTITE STYCAST ES 0506, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 0506 is a two-component, filled epoxy system designed for vacuum impregnation applications as well as for general potting and...
Encapsulants -- LOCTITE STYCAST ES 0520 LOCTITE STYCAST ES 0520, Epoxy, Encapsulating, Ignition Coil Potting LOCTITE® STYCAST ES 0520 is a two-component, filled epoxy system formulated for general potting and encapsulating applications. This material is especially...
Encapsulants -- LOCTITE STYCAST ES 0626 LOCTITE STYCAST ES 0626, Epoxy, Potting, Encapsulating LOCTITE® STYCAST ES 0626 is a two part, white epoxy casting system with low abrasion and rapid gel properties. Please refer to the...
Encapsulants -- LOCTITE STYCAST ES 2510 LOCTITE STYCAST ES 2510, Epoxy, Dielectric Grade, Encapsulant and Potting LOCTITE® STYCAST ES 2510 is a dielectric grade epoxy encapsulant designed for general purpose applications. It is suitable for potting...
Encapsulants -- LOCTITE STYCAST ES 6050 LOCTITE STYCAST ES 6050, Two part, Low Volatile, Potting and Sealing LOCTITE® STYCAST ES 6050 is a two part, low volatile sealing and potting system. Resin and hardener are of...
Encapsulants -- LOCTITE STYCAST ES 6501 LOCTITE STYCAST ES 6501, Epoxy, Encapsulation, Potting LOCTITE® STYCAST ES 6501 epoxy encapsulant is designed for general potting and encapsulation applications. Two components - requires mixing Rigid Low to medium...
Encapsulants -- LOCTITE STYCAST ESP 4536 LOCTITE STYCAST ESP 4536, Epoxy, Fast-setting, Industrial Grade, Surface Mounted Devices LOCTITE® STYCAST ESP 4536 is a fast-setting, industrial grade surface mount adhesive. It is designed to set quickly when...
Encapsulants -- LOCTITE STYCAST S 5225 LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating LOCTITE® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout...
Encapsulants -- LOCTITE STYCAST U 2500 HTR LOCTITE STYCAST U 2500 HTR, Polyurethane, Potting, Encapsulant, Low Viscosity, Excellent Wetting LOCTITE® STYCAST U 2500 HTR flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties...
Encapsulants -- LOCTITE STYCAST U 2500 TEM LOCTITE STYCAST U 2500 TEM, Flexible, Polyurethane, Encapsulant LOCTITE® STYCAST U 2500 TEM flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of...
Encapsulants -- LOCTITE STYCAST U 2516 HTR LOCTITE STYCAST U 2516 HTR, Polyurethane, Encapsulant LOCTITE® STYCAST U 2516 HTR flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of either...
Encapsulants -- LOCTITE STYCAST US 0138 LOCTITE STYCAST US 0138, Urethane, Potting and Encapsulating, Extended polybutadiene/MDI base Sealant LOCTITE® STYCAST US 0138 is an extended polybutadiene/MDI base encapsulant/sealant formulated for potting electronics or devices for protection...
Encapsulants -- LOCTITE STYCAST US 0152 LOCTITE STYCAST US 0152, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0152 is an unfilled, low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties and surface...
Encapsulants -- LOCTITE STYCAST US 0155 LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for...
Encapsulants -- LOCTITE STYCAST US 1195 LOCTITE STYCAST US 1195, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 1195 is formulated for potting electronics or devices for protection against environmental hazards. This material exhibits high hardness compared...
Encapsulants -- LOCTITE STYCAST US 5002 LOCTITE STYCAST US 5002, Potting and Encapsulating LOCTITE® STYCAST US 5002 is formulated for high speed sealing and potting applications Two components - requires mixing Unfilled Non-sag on mixing Tack-free...
Industrial Adhesives -- LOCTITE STYCAST UV 7993 LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry...
Encapsulants -- LOCTITE PE 3141 LOCTITE® 3141 Hysol Epoxy Resin, High Temperature is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. The system is formulated...
Encapsulants -- LOCTITE PE 3145 LOCTITE® 3145 Hysol Epoxy Resin, Flame Retardant is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. LOCTITE 3145/3162 and 3145/3165...
Encapsulants -- LOCTITE PE 3163 LOCTITE® 3163 Hysol Epoxy Hardener, Excellent Adhesion is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol resins. The system is formulated...
Encapsulants -- LOCTITE PE 3165 LOCTITE® 3165 Hysol Epoxy Hardener, Low Shrinkage is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol resins. LOCTITE 3145/3165 and 3145/3162...
Encapsulants -- LOCTITE ECCOBOND FP4802 LOCTITE® ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed...
Encapsulants -- LOCTITE ECCOBOND UF 8830S LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and...
Encapsulants -- LOCTITE ECCOBOND NCP 5209 LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip...
Encapsulants -- LOCTITE UK 3182 Polyurethane black hardener that when mixed with the appropriate resin forms a low-shrinkage, low-exotherm potting compound. LOCTITE® UK 3182 is a black polyurethane resin that when mixed with LOCTITE UK...
Encapsulants -- LOCTITE UK 3364 Rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. LOCTITE® UK 3364™ is a black, rigid 2-part polyisocyanate urethane...
Instant Adhesives -- SICOMET 100 Sicomet 100 is a fast curing medium-viscosity ethylcyanoacrylate for bonding a wide range of materials including plastics and rubbers.Features and Benefits: Versatile instant adhesive suitable for a wide range...
Instant Adhesives -- SICOMET 101 Sicomet 101 is a very low viscosity fast-curing ethylcyanoacrylate for bonding a wide range of materials including plastics, rubbers and metals.Features and Benefits: Versatile instant adhesive suitable for a...
Encapsulants -- TECHNOMELT AS 8998 TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It...
Encapsulants -- TECHNOMELT PA 6344 TECHNOMELT PA 6344, Polyamide, Encapsulation TECHNOMELT® PA 6344 UV resistance, polyamide-based, thermoplastic, hot melt adhesive is designed for molding compound applications. This material adheres well to a variety of substrates...
Encapsulants -- TECHNOMELT PA 638 TECHNOMELT PA 638, Polyamide, Molding compound thermoplastic TECHNOMELT® PA 638 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low...
Encapsulants -- TECHNOMELT PA 657 TECHNOMELT PA 657, Polyamide, Molding compound thermoplastic TECHNOMELT® PA 657 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low...
Potting Compounds -- LOCTITE STYCAST 2850FT Thermally conductive epoxy encapsulant recommended for encapsulation of components that require heat dissipation and thermal shock properties. LOCTITE® STYCAST 2850FT is a black, thermally conductive epoxy encapsulant recommended for encapsulation...