Henkel Corporation - Electronics Conformal EMI Shielding Material LOCTITE ABLESTIK EMI 8880S


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Conformal EMI Shielding Material LOCTITE ABLESTIK EMI 8880S
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation. As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied at the package level. Typical Packaging Structure and Solutions Henkel has developed innovative material technologies that provide effective protection at the package level with compartmental shielding and conformal shielding using simple and scalable processes. Conformal Shielding Materials The thinly spray-coated material provides uniform coverage on top and sidewalls, clean edges without backside contamination, and excellent adhesion to mold compound with excellent Shielding Effectiveness (SE). Furthermore, this technology is simple allowing easy production scalability and design flexibility with minimal cost of ownership using spray-coating compared to other costly methods such as PVD/sputtering. Advantages of Spraying with Henkel Material Key Requirements PVD/Sputtering Spraying (with Henkel) Footprint Large Small Total Cost of Ownership Extremely high Up to 60% lower Throughput (UPH) Moderate Up to 400% higher Required CAPEX Extremely high Up to 90% lower Process Flow Complex Simple Deployment Scalability Low High Required Coating Thickness 3~6 um 3~6 um Laser Mark Visibility Good Good Coating Uniformity Good Good Coating Structure Multi-Layer Single or Multi-Layer Top:Sidewall Thickness Ratio 1:0.4~0.5 1:0.5~0.6 Henkel Material vs. Conventional Conductive Ink Key Requirements Conventional Material Henkel Material Spray Technology Compatibility Agnostic Agnostic Bulk Shielding Effectiveness Poor (50 dB) Excellent (90 dB) Volume Resistivity 1x10 -4 ohm-cm 7.9 x10 -6 ohm-cm Coating Uniformity Moderate Good Fine Atomization Poor Excellent Required Coating Thickness 10~20 um 3~6 um Capable Coating Thickness 10~30 um 3~30 um Silver Settlement During Spray Yes No Adhesion to EMC 5B 5B
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Technical Specifications

  Henkel Corporation - Electronics
Product Category Encapsulants and Potting Compounds
Product Name Conformal EMI Shielding Material
Industry Electronics
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