Umicore Metal Deposition Solutions Datasheets for Electrolytes
Electrolytes are electrically-conductive materials that are used in batteries, fuel cells, capacitors, and biochemical systems. They typically exist as ionic solutions, or as molten salts or solids.
Electrolytes: Learn more
| Product Name | Notes |
|---|---|
| Abrasion-resistant and crack-free dark layers RHODUNA® 471 Black gives jewelry a high-end anthracite to black finish. The level of darkness can be adjusted. The electrolyte is easy to use and... | |
| Abrasion-resistant platinum-rhodium layers for sparkling jewelry With the strongly acidic alloy electrolyte PLATUNA®-Alloy RH, smooth, bright and crack-free platinum-rhodium coatings can be deposited up to a layer thickness of 0.5... | |
| Acidic electrolyte for high speed installations Indium 9100 is used for the deposition of pure indium coatings in high-speed systems. The electrolyte is easy to use. Indium 9100 has been... | |
| Additives for acid copper via filling Thru-cup® EVF-N is a new additive system for electrolytic acid copper plating on PCB. It is used in panel and pattern plating technology for... | |
| Al 99.98% Ø6x13mm 5kg - 0481947 | |
| Alkaline-cyanide gold alloy electrolyte – gold-saving AURUNA® 570 is an alkaline-cyanide alloy electrolyte for depositing green-yellow gold coatings. The gold-silver alloy has a fineness of approx. 18 carats. The coatings... | |
| Alternative to electroless nickel With NIPHOS® nickel-phosphorus alloy layers with high phosphorus content can be plated electrolytically in barrel-, rack- or reel-to-reel lines. Compared to electroless nickel layers containing a... | |
| Ammonia-free and chloride-free PALLUNA® ACF-800 is a newly developed neutral pure palladium electrolyte, which has a wide operating range and can be plated directly on nickel, copper or copper alloys. | |
| ARGUNA®-Alloy 1 for demanding requirements This silver-palladium alloy is designed for use at high temperatures. Combining with the maintenance of a lower coefficient of friction and a high degree of... | |
| Arsenic-free electrolyte for fine gold hollow jewellery AURUNA® 5500 EF is particularly suitable for electroforming. The electrolyte is free of arsenic and produces hard, semi-bright, thick gold layers. It is... | |
| Barrel and rack plating electrolyte for functional applications MIRALLOY® has been offering nickel-free plating for the connector, clothing and fashion jewellery industries for more than 30 years. You can benefit... | |
| Bright and white coatings for electrical contacts For wearables and cell phones, sales arguments such as a long service life and compatibility with fast charging devices are becoming increasingly crucial. | |
| Brilliant white rhodium electrolyte for decorative applications RHODUNA® J1 deposits brilliant white, very light and bright surface finishes. This makes the electrolyte ideal for use in decorative applications, such as... | |
| Brilliant-white and ultra-bright rhodium coatings RHODUNA® Diamond Bright deposits brilliant-white, ultra-bright coatings of previously unattained lightness and brilliance. It is additionally characterized by high covering speed and excellent throwing power. | |
| Bring the day the elegance of night Attractive, appealing and elegant. This is as true for the night as well as for precious metals. Surface finishing with RHODUNA®-Alloy Black 1... | |
| Coating material Barium fluoride Purity 99.8% Form Granulate Dimensions 0.7 - 3.5 mm Quantity 500 g HazardPictogram GHS07 Statement Warning Theoretical density at 20°C in g/cm³ 4.9 Melting point in... | |
| Coating material Lanthanum fluoride Purity 99.9% Form Granulate Dimensions 0.7 - 3.5 mm Quantity 500 g HazardPictogram GHS07 Statement Warning Theoretical density at 20°C in g/cm³ 6.0 Melting point in... | |
| Coating system for connectors With NIPHOS® 965 nickel-phosphorus alloy layers can be deposited in reel-to-reel electroplating systems or other high speed systems. In comparison to high-phosphorus containing electroless nickel layers,... | |
| Cost-saving electrolyte for brilliant jewelry With the strongly acidic alloy electrolyte PLATUNA®-Alloy RU, smooth, shiny and crack-free platinum-ruthenium coatings can be deposited up to a layer thickness of 0.5 μm. | |
| Dark ruthenium coatings without strike gold plating RUTHUNA® 490 Black is a neutral electrolyte for brightness retaining, dark grey to anthracite coatings. The black ruthenium electrolyte is easy to operate... | |
| Electrolyte for abrasion-resistant, low-corrosion hard gold layers AURUNA® 530 is a weakly acidic hard gold electrolyte with high current efficiency. Its essential property is its high resistance to abrasion and... | |
| Electrolyte for bright white pure silver layers The silver electrolyte ARGUNA® 629 deposits shiny, bright white coatings and is excellently suited for both technical and decorative applications. The electrolyte exhibits... | |
| Electrolyte for fine gold hollow jewellery AURUNA® 556 EF-24 is particularly suitable for electroforming. The electrolyte produces hard, semi-bright, thick gold layers. It is mainly used to produce high quality... | |
| Electrolytic process for the deposition of Nickel-phosphorus With NIPHOS® nickel-phosphorus alloy layers in barrel-, rack- and reel-to-reel lines can be plated electrolytically. The electrolytes are free from halides and contain,... | |
| Excellent Layer Thickness Distribution AURUNA® 526 is a weakly acidic gold-cobalt electrolyte with very good throwing power and layer thickness distribution, especially on hollow parts. This makes the electrolyte perfect... | |
| Extraordinarily abrasion-resistant coatings – saving platinum PLATUNA®-Alloy 1 is used for depositing smooth, ultra-bright and extraordinarily abrasion-resistant platinum-ruthenium alloy coatings. The acidic electrolyte is used for decorative applications and guarantees... | |
| For black decorative coatings - ideal as a perfect final finish RUTHUNA® 479 Black is the perfect final finish for dark to black surfaces for decorative applications. The black ruthenium... | |
| For bright, brilliant white coatings without blue cast ARGUNA® 621 deposits bright, very light white coatings without blue cast with simple bath maintenance. The silver electrolyte is suitable for decorative... | |
| For brilliant coatings The silver electrolyte ARGUNA® 635 is used for the deposition of bright silver coatings for technical and decorative applications. Despite a low alloy content, a high hardness... | |
| For Depositing Uniformly Bright Coatings AURUNA® 5400 the weakly acidic electrolyte deposits yellow, uniform bright hard gold coatings. The newly balanced brightener system of the electrolyte enables the operation in... | |
| For deposition of fine silver layers ARGUNA® 3230 is an alkaline, cyanide-free silver electrolyte for the deposition of technically functional silver layers. The layers are also suitable for decorative applications. | |
| For deposition of wear-resistant silver layers with high hardness ARGUNA® 3430 is an alkaline, cyanide-free electrolyte for the deposition of technically functional silver layers. The electrolyte does not contain any... | |
| For hard and wear resistant coatings PALLUNA® 4700 is a chloride-free, ammonia-reduced high-speed electrolyte for the deposition of a semi-bright to bright palladium-nickel alloy in reel-to-reel lines (selective dipping, jet... | |
| For high-speed deposition in reel-to-reel equipment PALLUNA® 468 is a weakly ammoniacal high-speed electrolyte for depositing palladium-nickel alloys in reel-to-reel equipment (selective dipping, jet plating, brush plating) and in reel-to-reel... | |
| For more than 30 years used worldwide for hollow jewellery The gold-silver electrolyte AURUNA® 568 EF-18 stands for decades of Umicore experience in electroforming with mandrels made of wax and... | |
| For noble silver hollow jewellery ARGUNA® 621 EF is a silver electrolyte, especially to produce noble hollow jewellery. A layer with high thickness can be deposited on mandrels made conductive. | |
| For the adhesive direct gold-plating of stainless steel and nickel AURUNA® 311 For Technical Applications is a strongly acidic alloy electrolyte for the adhesive direct gold-plating of stainless steel. It... | |
| For the adhesive direct gold-plating of stainless steel and nickel AURUNA® 311 is a strongly acidic alloy electrolyte for the adhesive direct gold-plating of stainless steel. It is preferably used... | |
| For the Deposition of Silver Layers with High Hardness ARGUNA® 630 is an alkaline cyanide hard silver electrolyte for (electro) technical applications. The additives increase the wear resistance compared to... | |
| Gold alloy electrolyte free of nickel and cobalt AURUNA® 215 is a colour gold alloy electrolyte for decorative applications, preferably for parts coming into contact with the skin such as... | |
| Gold-saving gold-copper coatings for decorative and technical applications AURUNA® 504 is an alkaline electrolyte for the deposition of red gold-copper alloy coatings with a caratage of 16 - 18 carat. | |
| High speed electrolyte for hard gold plating AURUNA® 8400 is used for the deposition of hard gold coatings in special high-speed equipment. The electrolyte is weakly acidic, citrate-free and has... | |
| High-speed deposition for reel-to-reel plating The new palladium nickel electrolyte PALLUNA® ACF-100 has all the technical advantages of other electrolytes - but without the smell of ammonia. The deposited layers... | |
| High-speed electrolyte for hard gold coatings AURUNA® 8100 is used for depositing hard gold coatings in special high-speed equipment. The weakly acidic high-speed electrolyte has a wide operating range with... | |
| High-Speed Electrolyte for Hard Gold Deposition AURUNA® 7000 is used for depositing hard gold coatings in special high-speed equipment. The weakly acidic electrolyte has a wide operating range with easy... | |
| High-speed electrolyte for reel-to-reel plating The ARGUNA® ET-S silver electrolyte is an alkaline-cyanide process specifically developed for use in high-speed equipment for reel-to-reel silver plating (using flow or spray technologies). | |
| Immersion gold electrolyte for ENIG Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the... | |
| Indium Electrolyte for High-Speed-Plating Indium is a silver white, soft metal with excellent thermal conductivity. It is used for reflow soldering, low temperature soldering and as thermal interface material. Indium... | |
| Irresistible – Rhodium with the allure of platinum Rhodium creates a brilliant white surface on decorative products. Platinum has enjoyed an incredibly stable price for a number of years, and... | |
| Lowest internal stresses reduce the tendency to crack NIPHOS® 964 is an acidic electrolyte for the deposition of nickel-phosphorus alloy coatings in rack or barrel operation. By modifying the makeup... | |
| Meets the new requirements for wearables and mobile phones Ease of use, attractive design and strong performance have always been the main arguments for buying wearables and mobile phones. But... | |
| Neutral high-speed electrolyte for selective gold-plating AURUNA® 559 is used for the very fast deposition of semi-bright to satin fine gold coatings with excellent bonding and soldering properties. The neutral... | |
| Neutral pure palladium electrolyte less sensitive to cyanide PALLUNA® 458 is a neutral pure palladium electrolyte (pH-value 7.0) without free ammonia. It deposits bright, light white coatings low in pores. | |
| Neutral, cadmium-free electrolyte for red layers AURUNA® 502 is a neutral, cadmium-free gold copper electrolyte working without free cyanide. The red surfaces are bright, very hard and abrasion-resistant. AURUNA® 502... | |
| Neutral, cadmium-free electrolyte for red layers AURUNA® 503 is a neutral, cadmium-free gold-copper electrolyte for the deposition of bright red surfaces. It works without free cyanide. AURUNA® 503 is especially... | |
| New standard for plug contacts in high-voltage applications Our silver-graphite dispersion electrolyte ARGUNA® C-100 is specially developed for connector contacts used in high-voltage applications (e.g. high-power charging / HPC). A... | |
| Nickel-free, fast-depositing weakly acidic electrolyte AURUNA® 5300 is a hard gold electrolyte free of nickel and cobalt with high plating speed for decorative and technical applications. The weakly acidic electrolyte... | |
| PALLUNA® ACF-200 Palladium-Nickel Electrolyte PALLUNA® ACF-200 is operated without ammonia, thus avoiding offensive smells caused by pungent ammonia gases. Since no chloride is used in the electrolyte, the lifetime of... | |
| Pen rhodium plating for abrasion resistant and bright coatings With RHODUNA® 271, targeted, partial rhodium plating is possible with a pen plating unit. In this process, small surface elements of... | |
| Pen rhodium plating for black bright coatings With RHODUNA® 275 PEN, selective rhodium plating is possible with a pen plating unit. Small surface elements of components are rhodium-plated using direct... | |
| Proven electrolyte with new color scheme AURUNA® 215 Pale is a colour gold alloy electrolyte for decorative applications, preferably for parts coming into contact with the skin such as jewelry... | |
| PT ONE - Unique RHODUNA® PT ONE is unique in our product portfolio in many ways. Like its big brother RHODUNA® PT, the ONE variant is an economical alternative for... | |
| PT PEN: Pen variant for targeted, partial rhodium plating Rhodium creates a brilliant white surface on decorative products. Platinum has enjoyed an incredibly stable price for a number of years,... | |
| Pure gold coatings with very good bonding and soldering properties AURUNA® 5100 is a neutral fine gold electrolyte for depositing matt, lemon-yellow coatings. It's specifically developed for applications requiring excellent... | |
| Pure palladium electrolyte with excellent bonding and solderability PALLUNA® 452 is a weakly ammoniacal electrolyte for the deposition of palladium in continuous systems and rack plating. It is used especially... | |
| Pure platinum electrolyte without yellow tint The strongly acidic PLATUNA® PT platinum electrolyte is used to deposit smooth, crack-free platinum coatings up to a layer thickness of 5 μm. The... | |
| Rose gold layers for fine jewelry AURUNA® 500 LC is a neutral electrolyte for depositing red 18 carat gold-copper coatings. The electrolyte works with low gold content, has a stable... | |
| Semi autocatalytic gold electrolyte Gobright® TWX-40 is a special gold electrolyte specifically designed for plating on electroless palladium deposits. The electrolyte is able to deposit uniform gold layers up to... | |
| Specifications Type Liner Material Boron Nitride Can be used in Al Fits ESV Volume 9 ccm | |
| Sustainable palladium substitute with significant price advantages The ruthenium electrolytes RUTHUNA® 491, 492 and 493 are neutral electrolytes from which decorative gray ruthenium coatings can be deposited. The electrolytes are... | |
| The fine silver high-speed electrolyte ARGUNA® CF is a fine silver electrolyte for the fast deposition of satin to semi-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® CF... | |
| The first pure white electrolytic rhodium alloy RHODUNA®-Alloy is the first alloy electrolyte in the world combining the high-quality metals rhodium and ruthenium. The basic materials of the new coating... | |
| The intermediate layer as the perfect diffusion barrier for jewelry PALLUNA® 459 deposits brillant, bright and extremely low-pore pure palladium layers. It can be used as pre-palladium, as a diffusion... | |
| The new bright silver high-speed electrolyte ARGUNA® 4500 is a fine silver electrolyte for the fast deposition of ultra-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® 4500 is... | |
| Very bright and white platinum coatings with PLATUNA® N1 The strongly acidic platinum electrolyte PLATUNA® N1 is used for the deposition of uniform, bright platinum coatings of light color up... |