Umicore Metal Deposition Solutions ARGUNA® CF Fine Silver Electrolyte ARGUNA® CF Fine Silver Electrolyte

Description
The fine silver high-speed electrolyte ARGUNA® CF is a fine silver electrolyte for the fast deposition of satin to semi-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® CF is used in high-speed equipment for the selective deposition of fine silver (flow and spray lines, jet plating, spot plating). Maximum applicable current density and plating efficiency mainly depend on the electrolyte agitation at the parts, i. e. on the flow velocity in the plant. High flow velocities allow the application of high current densities, high plating speeds can be reached in this way. For making up a new electrolyte, no free cyanide is required. Immersion silver plating can be effectively inhibited with ARGUNA® Pre-dip 600, which can be used in the production process prior to the silver electrolyte or it can be directly added to the electrolyte. Advantages High-speed electrolyte for the selective deposition of fine silver No free cyanide in a new makeup For reel-to-reel plating using flow or spray technologies Semi-bright coatings Very good bonding, soldering and adhesive properties Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications
  • ARGUNA® CF Fine Silver Electrolyte - ARGUNA® CF Fine Silver Electrolyte - Umicore Metal Deposition Solutions
    Umicore Metal Deposition Solutions
Description
The fine silver high-speed electrolyte ARGUNA® CF is a fine silver electrolyte for the fast deposition of satin to semi-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® CF is used in high-speed equipment for the selective deposition of fine silver (flow and spray lines, jet plating, spot plating). Maximum applicable current density and plating efficiency mainly depend on the electrolyte agitation at the parts, i. e. on the flow velocity in the plant. High flow velocities allow the application of high current densities, high plating speeds can be reached in this way. For making up a new electrolyte, no free cyanide is required. Immersion silver plating can be effectively inhibited with ARGUNA® Pre-dip 600, which can be used in the production process prior to the silver electrolyte or it can be directly added to the electrolyte. Advantages High-speed electrolyte for the selective deposition of fine silver No free cyanide in a new makeup For reel-to-reel plating using flow or spray technologies Semi-bright coatings Very good bonding, soldering and adhesive properties Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications

Suppliers

Company
Product
Description
Supplier Links
ARGUNA® CF Fine Silver Electrolyte - ARGUNA® CF Fine Silver Electrolyte - Umicore Metal Deposition Solutions
Umicore Metal Deposition Solutions
Schwaebisch Gmuend, Germany
ARGUNA® CF Fine Silver Electrolyte
ARGUNA® CF Fine Silver Electrolyte
ARGUNA® CF Fine Silver Electrolyte ARGUNA® CF Fine Silver Electrolyte
The fine silver high-speed electrolyte ARGUNA® CF is a fine silver electrolyte for the fast deposition of satin to semi-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® CF is used in high-speed equipment for the selective deposition of fine silver (flow and spray lines, jet plating, spot plating). Maximum applicable current density and plating efficiency mainly depend on the electrolyte agitation at the parts, i. e. on the flow velocity in the plant. High flow velocities allow the application of high current densities, high plating speeds can be reached in this way. For making up a new electrolyte, no free cyanide is required. Immersion silver plating can be effectively inhibited with ARGUNA® Pre-dip 600, which can be used in the production process prior to the silver electrolyte or it can be directly added to the electrolyte. Advantages High-speed electrolyte for the selective deposition of fine silver No free cyanide in a new makeup For reel-to-reel plating using flow or spray technologies Semi-bright coatings Very good bonding, soldering and adhesive properties Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications

The fine silver high-speed electrolyte

ARGUNA® CF is a fine silver electrolyte for the fast deposition of satin to semi-bright coatings with excellent bonding, soldering and adhesive properties.
ARGUNA® CF is used in high-speed equipment for the selective deposition of fine silver (flow and spray lines, jet plating, spot plating). Maximum applicable current density and plating efficiency mainly depend on the electrolyte agitation at the parts, i. e. on the flow velocity in the plant. High flow velocities allow the application of high current densities, high plating speeds can be reached in this way. For making up a new electrolyte, no free cyanide is required. Immersion silver plating can be effectively inhibited with ARGUNA® Pre-dip 600, which can be used in the production process prior to the silver electrolyte or it can be directly added to the electrolyte.

Advantages

  • High-speed electrolyte for the selective deposition of fine silver
  • No free cyanide in a new makeup
  • For reel-to-reel plating using flow or spray technologies
  • Semi-bright coatings
  • Very good bonding, soldering and adhesive properties

Applications

  • Contact surface for semiconductors and electrical components
  • Leadframe packaging for soldering, bonding and adhesive applications
Supplier's Site
Umicore Materials
Raleigh, NC, USA
ARGUNA® CF Fine Silver Electrolyte
ARGUNA® CF Fine Silver Electrolyte
ARGUNA® CF Fine Silver Electrolyte ARGUNA® CF Fine Silver Electrolyte
The fine silver high-speed electrolyte ARGUNA® CF is a fine silver electrolyte for the fast deposition of satin to semi-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® CF is used in high-speed equipment for the selective deposition of fine silver (flow and spray lines, jet plating, spot plating). Maximum applicable current density and plating efficiency mainly depend on the electrolyte agitation at the parts, i. e. on the flow velocity in the plant. High flow velocities allow the application of high current densities, high plating speeds can be reached in this way. For making up a new electrolyte, no free cyanide is required. Immersion silver plating can be effectively inhibited with ARGUNA® Pre-dip 600, which can be used in the production process prior to the silver electrolyte or it can be directly added to the electrolyte. Advantages High-speed electrolyte for the selective deposition of fine silver No free cyanide in a new makeup For reel-to-reel plating using flow or spray technologies Semi-bright coatings Very good bonding, soldering and adhesive properties Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications

The fine silver high-speed electrolyte

ARGUNA® CF is a fine silver electrolyte for the fast deposition of satin to semi-bright coatings with excellent bonding, soldering and adhesive properties.
ARGUNA® CF is used in high-speed equipment for the selective deposition of fine silver (flow and spray lines, jet plating, spot plating). Maximum applicable current density and plating efficiency mainly depend on the electrolyte agitation at the parts, i. e. on the flow velocity in the plant. High flow velocities allow the application of high current densities, high plating speeds can be reached in this way. For making up a new electrolyte, no free cyanide is required. Immersion silver plating can be effectively inhibited with ARGUNA® Pre-dip 600, which can be used in the production process prior to the silver electrolyte or it can be directly added to the electrolyte.

Advantages

  • High-speed electrolyte for the selective deposition of fine silver
  • No free cyanide in a new makeup
  • For reel-to-reel plating using flow or spray technologies
  • Semi-bright coatings
  • Very good bonding, soldering and adhesive properties

Applications

  • Contact surface for semiconductors and electrical components
  • Leadframe packaging for soldering, bonding and adhesive applications

Technical Specifications

  Umicore Metal Deposition Solutions Umicore Materials
Product Category Electrolytes Electrolytes
Product Number ARGUNA® CF Fine Silver Electrolyte ARGUNA® CF Fine Silver Electrolyte
Product Name ARGUNA® CF Fine Silver Electrolyte ARGUNA® CF Fine Silver Electrolyte
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