MacDermid Alpha Electronics Solutions Datasheets for Conductive Compounds
Conductive compounds provide an electrically and/or thermally conductive path between components.
Conductive Compounds: Learn more
| Product Name | Notes |
|---|---|
| Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it... | |
| Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages with metallized dies. It features exceptional thermal conductivity, low resin bleed-out, and minimal condensable organics, ensuring... | |
| Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical,... | |
| Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), purposefully engineered for high-temperature automotive applications that require... | |
| Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards. It features a high Glass Transition Temperature (Tg) and low... | |
| Product Overview ALPHA HiTech CU31-3300 is a one-component reworkable underfill that balances a moderately high Glass Transition Temperature (111 °C) with excellent reworkability to help manufacturers protect assemblies while maintaining... | |
| Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable... | |
| Product Overview ATROX CD 590-HT2 is a thermosetting electrically conductive die attach designed for substrate based as well as metal lead frame semiconductor packages. This solution combines high thermal conductivity... | |
| Product Overview ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features Thermal Conductivity... | |
| Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot... | |
| Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out. | |
| Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally demanding semiconductor die attach with good printability. | |
| Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility for stress-sensitive components. | |
| Product Overview ATROX® 800HT7A: High-performance conductive paste formulated for enhanced mechanical stability and process robustness under thermal cycling. | |
| Product Overview Electrolube® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced edge coverage, and excellent flexibility, effectively minimizing stress... | |
| Product Overview Electrolube® LGF200 is a thermally conductive, silicone-based liquid gap filler featuring a two-component, cure-in-place formulation for easy processing. With a thermal conductivity of 2 W/m-K, it delivers excellent... | |
| Product Overview Electrolube® LGF400 is a thermal interface material engineered for easy processing. This silicone-based liquid gap filler features a two-component, cure-in-place formulation. With a high thermal conductivity of 4... | |
| Product Overview Electrolube® UVFlex is a next-generation, solvent-free, UV-curable conformal coating engineered for demanding electronics applications. Its unique elasticity helps maintain coating integrity through extreme thermal cycling and harsh environmental... | |
| Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry. It offers a cost-effective solution for a wide range... | |
| Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics industry. It offers a cost-effective solution for a wide range... | |
| Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed to meet the increasing demands for efficient thermal dissipation. This compound combines ease... | |
| Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It offers excellent chemical... | |
| Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic components, or between any surfaces where thermal... | |
| Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful HTC, offering ultimate thermal conductivity along with the benefits of a non-silicone base oil. The exceptional... | |
| Product Overview HTS Silicone Heat Transfer Compound is a metal oxide-filled silicone oil, providing an extremely efficient and thermally conductive interface material that operates over a wide temperature range. Electrolube... | |
| Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube’s successful HTS, offering superior thermal conductivity and a wide temperature range through the use of... | |
| Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. The unique low-etch process provides a low-profile surface topography to optimize maximum signal integrity... | |
| Product Overview PackageBond is the proven adhesion promotion system specifically designed for the demands of panel level packaging, delivering reliability at today’s high reflow temperatures. Production proven in high volume... | |
| Product Overview SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides excellent flow characteristics, making it ideal for potting tight units or... | |
| Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach... | |
| Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000... | |
| Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety of electronic applications. It provides excellent bonding at low process temperatures and features a very low elastic modulus... | |
| Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of electronic applications, offering excellent bonding at low process temperatures and a very low elastic modulus of 60,000... | |
| Product Overview The ENVISION polymer-based system is unlike any other direct metallization process on the market today. It delivers increased board capacity along with significantly enhanced performance. | |
| Product Overview UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed for potting and encapsulation of electronics. Once cured, it has a dark blue finish and is soft... | |
| Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide... |