MacDermid Alpha Electronics Solutions Datasheets for Industrial Adhesives
Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more
| Product Name | Notes |
|---|---|
| Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it... | |
| Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages with metallized dies. It features exceptional thermal conductivity, low resin bleed-out, and minimal condensable organics, ensuring... | |
| Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical,... | |
| Product Overview A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed for temporary bonding applications, most typically associated with... | |
| Product Overview A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and... | |
| Product Overview ALPHA HiTech AD13-9692B exhibits high adhesion strength between Liquid Crystal Polymer (LCP) and magnet surfaces, resulting in excellent drop impact performance when tested on camera module housing and... | |
| Product Overview ALPHA HiTech EN21-4210F has a high hardness property, making it ideal for assembling components that require excellent reinforcement strength. The ALPHA HiTech EN21-4210 is a non-reworkable encapsulant product... | |
| Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product recommended for customers requiring a screen-printable adhesive. | |
| Product Overview ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger chip coating. It is halogen-free and complies with the Restriction of Hazardous Substances (RoHS) Directive 2015/863/EU. | |
| Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable... | |
| Product Overview ATROX CD 590-HT2 is a thermosetting electrically conductive die attach designed for substrate based as well as metal lead frame semiconductor packages. This solution combines high thermal conductivity... | |
| Product Overview ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features Thermal Conductivity... | |
| Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot... | |
| Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out. | |
| Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow characteristics in automated die attach systems. | |
| Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally demanding semiconductor die attach with good printability. | |
| Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility for stress-sensitive components. | |
| Product Overview ATROX® 800HT7A: High-performance conductive paste formulated for enhanced mechanical stability and process robustness under thermal cycling. | |
| Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. The unique low-etch process provides a low-profile surface topography to optimize maximum signal integrity... | |
| Product Overview MultiBond 500 is a first-generation, low-etch oxide alternative designed for laser direct drill pretreatment and reliable innerlayer adhesion in multilayer circuit boards, specifically for Semi-Additive Process (SAP) and... | |
| Product Overview MultiBond MP is a uniquely formulated copper conversion coating for multilayer Printed Circuit Boards (PCBs), combining micro-roughening with an embedded organic coating. Designed for use in high-throughput, automated... | |
| Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach... | |
| Product Overview STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000... | |
| Product Overview STAYSTIK 482 Thermoplastic Adhesive Film is designed for a range of electronic applications and delivers excellent bonding performance. Suitable for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety of electronic applications. It provides excellent bonding at low process temperatures and features a very low elastic modulus... | |
| Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring resistance to high-temperature excursions. It is suitable for die attach in solder-sealed, hermetic packages and delivers low Residual... | |
| Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of electronic applications, offering excellent bonding at low process temperatures and a very low elastic modulus of 60,000... | |
| Product Overview The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask, dry film, and liquid photoresist adhesion on copper. By eliminating pumice and brush scrubbing, MultiPrep 200... |