MacDermid Alpha Electronics Solutions Datasheets for Industrial Adhesives
Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more
| Product Name | Notes |
|---|---|
| A one-component epoxy system designed to encapsulate the chip component to protect the device and strengthen the solder joints. Product Overview ALPHA HiTech EN21-4210F has a high hardness property, making... | |
| A one-component, fast-curing surface mount adhesive, specifically designed for screen printing. Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product... | |
| A one-component, low-temperature cure epoxy system, designed for bonding heat-sensitive devices and camera module applications. Product Overview ALPHA HiTech AD13-9692B exhibits high adhesion strength between LCP and magnet surfaces, resulting... | |
| A silver sinter paste, providing high thermal and electrical conductivity. Product Overview The ALPHA® Argomax® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal... | |
| A single-component epoxy cures at low temperatures, offering water resistance and bonding FPCB to various plastic materials. Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics... | |
| A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications. Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal... | |
| A thermoplastic adhesive film that bonds at low temps with a low modulus (60,000 psi). Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications,... | |
| A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages. Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching... | |
| A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow... | |
| A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally... | |
| A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing. Product Overview A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. | |
| Adhesion promoter that enables superior bonding for solder mask, dry film, and liquid photoresist on copper. Product Overview The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask,... | |
| Advanced leadframe adhesion technology designed to overcome delamination problems to achieve MSL-1 reliability. Product Overview PackageBond is the no-risk adhesion promotion system specifically engineered for optimal adhesion at today’s intense... | |
| Aluminum nitride-filled adhesive film for electronics bonds well at low temps, handles different TCEs, and is reworkable. Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of... | |
| Aluminum nitride-filled film resists high temps, ideal for die attach in hermetic packages, with low RGA and reworkability. Product Overview STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring... | |
| An ultra-low stress Hybrid Silver sintered die attach paste with high thermal conductivity set for high power exposed pad semiconductors. Product Overview ATROX® 800HT7A: High-performance conductive paste formulated for... | |
| Conductive die attach pastes offer excellent performance to meet today's high reliability standards. Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed... | |
| High-performance peroxide-sulfuric etchant system that ensures maximum circuit densities, trace profile and excellent adhesion. Product Overview CircuEtch 300 is a high-performance flash etching process for circuit formation in Semi-Additive (SAP)... | |
| Innovative low-etch alternative oxide for improved laser direct drilling of vias and optimized topography. Product Overview MultiBond 500 is a first-generation, low-etch oxide alternative designed for laser direct drill pretreatment... | |
| Low-etch alternative oxide provides low surface profiles and reliable adhesion for high frequency applications. Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. | |
| Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out. | |
| Next-generation, high reliability, reworkable edgebond. Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Tg and low CTE, purposefully engineered for high-temperature automotive applications that require exceptional board-level... | |
| One-component UV cure system designed for fast curing and bonding in various applications, including coating and component fixing. Product Overview ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger... | |
| PFAS-free, conductive die attach products deliver a cost-effective, high-performance solution, leading the way in advanced materials. Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages... | |
| Premium adhesive for garment and textile screen printing, used to secure the substrate onto the platen when printing. Product Overview Low Tack Platen Adhesive is a premium water-based adhesive for... | |
| Screen printable conductive adhesive for secure connection of components to flexible and formable circuit tracks. Product Overview XtraForm E7000 is a silver electrically conductive adhesive (ECA) designed for low-temperature substrates... | |
| Silver-filled conductive film bonds well at low temps (60,000 psi modulus), handles different CTEs, and is easily reworked. Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety... | |
| Silver-filled conductive film offers strong bonding for MCMs and superior reworkability compared to thermosets. Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering... | |
| Silver-filled thermoplastic paste offers strong bonding for electronics, ideal for MCMs, and superior reworkability. Product Overview STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and... | |
| Solvent-based adhesive for temporary bonding, ideal for GaAs/silicon wafer thinning. Debonds with IPA, no residue. Product Overview A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive... | |
| Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate... | |
| The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. Product Overview ATROX conductive die attach products provide a... | |
| Thermoplastic adhesive film excels in electronics, offering strong bonding for MCMs and better reworkability than thermosets. Product Overview STAYSTIK 482 Thermoplastic Adhesive Film is designed for a range of electronic... | |
| Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications. Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility... | |
| Uniquely formulated copper conversion coating for multilayer PCBs, combining micro-roughening with an embedded organic coating. Product Overview MultiBond MP is a uniquely formulated copper conversion coating for multilayer printed circuit... |