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MacDermid Alpha Electronics Solutions Datasheets for Industrial Adhesives

Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more

Product Name Notes
A one component, heat curable material to be dispensed on the corners of the BGA. The cured edgebond will help to strengthen the soldered assembled components. Product Overview ALPHA HiTech...
A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates. Product Overview Adhesion between the innerlayer copper circuits...
ALPHA HiTech AD13-9521B is a one-component low temperature cure epoxy system. It is suitable for bonding heat sensitive devices. Product Overview ALPHA HiTech AD13-9521B is specially designed for use in...
ALPHA HiTech AD13-9620B is a one-component, low temperature cure epoxy system. It is developed for the bonding of heat sensitive devices. Product Overview ALPHA HiTech AD13-9620B is engineered for use...
ALPHA HiTech AD13-9692B is a one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices and is specially designed for camera module application. Product Overview ALPHA...
ALPHA HiTech AD13-9910B is a one-component, ultra-low temperature cure epoxy system that can be cured at temperatures as low as 60°C. Product Overview ALPHA HiTech AD13-9910B is a one-component, ultra-low...
ALPHA HiTech AD43-9600W is a one-component, low temperature cure epoxy system. It is specially designed to bond the lens onto a PCB bar for BLU (Back Light Unit) application. Product...
ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices. Product...
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow...
ALPHA HiTech SM42-120P is a one component, fast curable surface mount adhesive, specially designed for screen printing. Product Overview ALPHA HiTech SM42-120P is applicable to both screen printing and dispensing...
ALPHA HiTech SM42-1311 is a one component, fast curable surface mount adhesive designed for dispensing applications. Product Overview ALPHA HiTech SM42-1311 is ideal for high-speed dispensing processes given its non-sagging...
ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each...
ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend,...
ALPHA HiTech UP44-5566T is a one-component UV cure system. It is suitable for fast curing and bonding in various applications such as coating and fixing of components. Product Overview ALPHA...
ALPHA HT-130DHF-3 Adhesive is a one component, fast curable surface mount adhesive designed for both dispensing & printing applications. Product Overview ALPHA HT-130DHF-3 Adhesive is the leading surface mount adhesive...
Frameless Stencil Foils Taking "Frameless" Stencil Technology to a New Level. Product Overview ALPHA Tetrabond is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the...
Non-conductive and Electrically Insulating Adhesive Product Overview STAYCHIP F614-2 possesses the ability to attach a metal can or lid onto the package. STAYCHIP F614-2 was specifically developed for superior adhesion...
Non-conductive and Electrically Insulating Adhesive Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high reliability semiconductor packages/electronic assemblies and...
Product Description Electrolubes ER6003 epoxy potting compound has been specially developed for the LED Industry in India to protect the drivers from the varying environments found on the Indian subcontinent.
Product Description ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold...
Product Description ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It’s a very low viscosity resin system ideal for...
Product Description ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes...
Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke...
Product Description ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It’s a good all round resin offering a cost...
Product Description ER2218 very low viscosity, flame retardant epoxy which has been formulated for use as a potting compound / encapsulation resin. Boasting excellent thermal stability ER2218 has been specifically...
Product Description ER2219 single component epoxy resin is a versatile resin suitable for use as a glob-top resin, or for dipping hybrid circuits and individual components which require discrete concealment.
Product Description ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of...
Product Description ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent...
Product Description ER2223 highly chemical resistant epoxy potting compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It has excellent chemical...
Product Description ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components. The resin has good...
Product Description ER6002LV is a thermally conductive epoxy potting and encapsulation resin designed primarily for use in LED Driver units. ER6002LV has good flow characteristics which allows potting of small...
Product Description GPA is a two part, fast curing epoxy adhesive which was designed for general purpose bonding. The product is suitable for a wide variety of applications due to...
Product Description SCPH Silver Conductive Adhesive has been designed for use during the manufacture of display modules for mobile/smart phones, tablets and many other electronic products. It exhibits excellent electrical...
Product Description TCOR RTV Thermally Conductive Oxime is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of...
Silver-filled Electrically Conductive Film Product Overview STAYSTIK 501 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 501 adhesive film can be used...
Silver-filled Electrically Conductive Film Product Overview STAYSTIK 571 is designed for use in a variety of electronic applications. STAYSTIK 571 exhibits excellent bonding at low process temperatures and has an...
Silver-filled Electrically Conductive Film Product Overview STAYSTIK 581 is designed for use in a variety of electronic applications, and exhibits excellent bonding properties. STAYSTIK 581 film can be used for...
Silver-filled Electrically Conductive Film Product Overview STAYSTIK 591 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process...
Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 101 is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 101 paste adhesive can be used for die attach...
Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 171 thermoplastic adhesive silver filled paste is designed for use in a variety of electronic applications. STAYSTIK 171 is characterized by excellent bonding...
Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 181 thermoplastic silver filled paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK...
Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 191 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 191 is characterized by its excellent bonding at...
Solvent-based Polymer Specially Developed for Temporary Bonding Applications Product Overview STAYSTIK 336T thermoplastic adhesive paste is a low modulus polymer specially developed for temporary bonding applications most typically associated with...
The ATROX brand of conductive die attach films are designed to provide you with superior performance for today's stringent reliability requirements. Conductive Die Attach Products ATROX conductive die attach products...
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. ATROX conductive die attach products offer a complete solution...
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. Conductive Die Attach Products ATROX conductive die attach products...