MacDermid Alpha Electronics Solutions Datasheets for Soldering Irons, Stations, and Accessories
Soldering irons, stations and accessories bond two or more metallic surfaces together with a low melting alloy solder such as tin/lead or Sn/Cu/Ni/Ge alloys, which is melted, wets the surface and resolidifies forming a soldered joint.
Soldering Irons, Stations, and Accessories: Learn more
| Product Name | Notes |
|---|---|
| Argomax 2141 Paste is a silver sinter paste for large package sinter attachment, specifically for marginalized component surfaces that are designed for component placement on wet paste with high tack. | |
| A lead-free, no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in the most challenging applications. Product Overview ALPHA CVP-390V is a zero-halogen solder paste... | |
| A low residue, no-clean solder paste designed to maximize first pass yields. The rheologically formulated flux vehicle provides excellent repeatability and resistance to environmental conditions. Product Overview ALPHA OM-5100 Solder... | |
| A low silver lead-free alloy specially designed with proprietary additives to deliver SAC305 like soldering and reliability performance Product Overview ALPHA SACX Plus 0807 is a low silver lead-free alloy... | |
| A no-clean solder paste that meets the demands of tin-lead soldering when lead free components are present in the circuit assembly. Product Overview ALPHA OM-5300 is a zero halogen, no... | |
| A suite of final finishes for IC substrates that provides solderability, gold wire bondability, and OEM acceptance. Our finishes meet requirements for reliability during assembly and beyond. Product Overview Which... | |
| A tin-lead, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required. Product Overview ALPHA WS-809 is a SnPb water soluble... | |
| Affinity™ ENEPIG is the final finish that IC substrate manufacturers choose for critical applications where six-sigma assembly performance and mission-critical reliability are required. Product Overview The Affinity ENEPIG process is... | |
| ALPHA CVP-520 enables low temperature SMT assembly technology to minimize rework in multiple reflow applications. Product Overview ALPHA CVP-520 is designed for near eutetic low temperature alloys such as SnBi0.4Ag... | |
| ALPHA JP-500 is a lead-free, zero halogen, no-clean solder paste designed for use in Jet Printers and approved for use with leading jetting equipment manufacturers. Product Overview ALPHA JP-500 is... | |
| ALPHA JP-501 is a low temperature, lead-free, no-clean solder paste designed for use in Jet Printers. Product Overview The low temperature, lead-free alloy in ALPHA JP-501 has a melting point... | |
| ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer... | |
| ALPHA OM-220 is an ultra-low temperature, no clean, zero halogen solder paste paired with Alpha’s ULT1 alloy intended for soldering temperature sensitive components and substrates. Product Overview ALPHA OM-220 enables... | |
| ALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability. Product Overview ALPHA OM-372 is engineered specifically to... | |
| ALPHA OM-550 is a zero halogen, low temperature chemistry paired with the HRL1 alloy designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys. Product... | |
| ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced... | |
| ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance. Product Overview ALPHA WS-608 water... | |
| ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance. Product Overview ALPHA WS-630 water soluble flux... | |
| ALPHA WS-698 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes and enables low voiding performance. Product Overview ALPHA WS-698 water soluble flux... | |
| ALPHA WS-820, a lead free, halide free, water soluble solder paste, offering the ideal combination of printability and flexibility in reflow profile window with excellent cleanability. Product Overview ALPHA WS-820... | |
| ALPHA WS-826 is a zero-halogen, lead-free, water-soluble solder paste formulated for fine features and exhibits excellent stencil life in ambient and elevated conditions. Product Overview ALPHA WS-826 is a water-soluble,... | |
| ALPHA® OM-362 Solder Paste is an ultra-low voiding, high-reliability, RoHS compliant, & zero-halogen solder paste Product Overview ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4... | |
| Alumina Filled Dielectric Paste Product Overview STAYSTIK 701 is ideal for applications where resistance to high temperature excursions is desired. This paste adhesive can be used for die attach in... | |
| Alumina Filled Dielectric Paste Product Overview STAYSTIK 783 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 783... | |
| Alumina Filled Dielectric Paste Product Overview STAYSTIK 793 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process... | |
| Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 211 is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 211 adhesive paste can be used for die... | |
| Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 272 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 272 is characterized by excellent bonding at... | |
| Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 282 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK... | |
| Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 292 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 292 is characterized by excellent bonding at... | |
| ATROX Brand of die attach pastes are designed to provide you with superior performance for todays stringent reliability requirements. The die attach products (ATROX) offer complete solution with lower total... | |
| Chemical processes for the application of long lasting corrosion resistant coatings for connectors and interconnects. Product Overview Whether you need durability, long lasting corrosion resistance, or functional final finishes, we... | |
| Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device. Product Overview ALPHA TrueHeight Spacer Blocks are burr free,... | |
| High activity water soluble Lead-Free solder paste capable of high soldering yields with low voiding and excellent residue cleaning performance Product Overview High activity, low voiding Water Soluble Solder Paste... | |
| High lead, Zero-halogen, No clean Solder Paste Product Overview ALPHA NCP-1213 is a high lead, zero-halogen no clean solder paste designed for high power, high performance, die attach applications. This... | |
| Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula that offers flexibility across a broad range of print and reflow conditions. Product Overview Kester NP505-HR is formulated to offer... | |
| Lead-Free Hot Air Solder Level Alloy Product Overview ALPHA SACX Plus HASL is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the hot air solder... | |
| Lead-free, zero-halogen solder paste designed for broad latitude, high reliability applications, requiring process flexibility and residue containment. Product Overview ALPHA OM-353 is a zero-halogen solder paste engineered to provide superior... | |
| Leading immersion silver offerings that enable excellent general assembly performance on a wide range of circuit board types Product Overview Our immersion silver final finishes are trusted by hundreds of... | |
| Low Silver, Lead-Free Alloy for Wave, Selective and Rework Applications Product Overview ALPHA SACX Plus 0307 is a low silver lead-free alloy suitable for use as a replacement for SnPb,... | |
| No clean low residue liquid flux for indium solder preform thermal interface lid attach. Product Overview Kester SE-CURE 9665 is no clean liquid flux formulated with a heat stabilized system... | |
| No clean paste flux which enables low residue post reflow with low voiding and excellent soldering performance. Product Overview ALPHA NCX-402-M3 is a highly active, halogen-free, ultra low residue no... | |
| No clean paste flux with high activity and clear residues. Product Overview Kester TSF-6592HF is a no clean paste flux designed as a lead-free solution for an array of lead... | |
| No clean paste flux with high activity for a wide range of soldering applications. Product Overview ALPHA NCX-390 is a highly active, no clean flux, engineered for multiple semiconductor applications. | |
| No clean paste flux with low residue post reflow and low voiding performance. Product Overview Kester TSF-ULR18 is a no clean ultra low residue tacky flux. TSF-ULR18 is highly recommended... | |
| No clean rosin-based paste flux with high tackiness and long pot life. Product Overview KESTER TSF-6522RH is a no clean rosin-based paste flux, designed to meet IPC halogen-free requirements. TSF-6522RH... | |
| No clean, lead-free solder paste which meets zero-halogen requirements with low voiding, fine feature printing performance. Product Overview ALPHA NCP-390 is a lead-free, zero-halogen, no-clean solder paste designed for applications... | |
| No-clean, lead-free solder paste that enables low residue post reflow with low voiding and excellent soldering performance. Product Overview ALPHA NCP-LR002 is a lead-free, no-clean solder paste designed for applications... | |
| Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 371 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 371 is characterized by excellent bonding at low... | |
| Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 383 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 383... | |
| Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 393 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process... | |
| Silver Free Lead Free Alloy for Wave, Selective and Rework Applications Product Overview ALPHA SnCX Plus 07 is a no-silver, lead-free alloy suitable for use as a replacement for SnPb,... | |
| Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach Product Overview ALPHA Argomax 8035 Film is a low-pressure silver sintering die attach film from... | |
| Sinter Silver Film for Die Attachment – Wafer Level Processing Product Overview ALPHA Argomax 8031 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed... | |
| Sinter Silver Film for Die Attachment Product Overview ALPHA Argomax 8020 Film is specifically designed for die and spacer lamination on silver surfaces using existing pick and place equipment. ALPHA... | |
| Sinter Silver Film for Die Attachment Product Overview ALPHA Argomax 8021 Film is specifically designed for die and spacer lamination on a wide variety of surfaces using existing pick and... | |
| Sinter Silver Film for Large Area Lamination Product Overview ALPHA Argomax 8010 Film is specifically designed for large area lamination followed by a low pressure sintering process capable of high... | |
| Sinter Silver Paste for Die Attachment (Print and Dispense) with Wet Die Placement Product Overview ALPHA Argomax 2040 is a silver sintering die attach paste specifically designed for die placement... | |
| Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement Product Overview ALPHA Argomax 5040 Paste is a silver sintering paste specifically designed for die placement on... | |
| Sinter Silver Paste for Die Attachment on Copper Surface Product Overview ALPHA Argomax 5022 Paste is a silver sintering die attach paste specifically designed for low pressure sintering die attachment... | |
| Sinter Silver Paste for Package Sinter Attachment Product Overview ALPHA Argomax 2047 is a nano-Silver sintering paste developed to meet the increasing demand of large area attach applications (module to... | |
| Sinter Silver Paste for Package Sinter Attachment Product Overview ALPHA Argomax 2048 Paste is a dispensable paste specifically developed for pressure sintering of large packages (or components) on gold and... | |
| Sinter Silver Sintering Paste for Die Attachment Product Overview ALPHA Argomax 2010C is a specifically designed sintering film for high-volume, low-pressure sintering die attachment with a design that promotes ease... | |
| Thermoplastic Adhesive Paste STAYSTIK 181AK is characterized by its excellent bonding properties. The paste can be used for die, lid seal and/or substrate attach in hybrid, multi-chip modules (MCMs) or... | |
| Water soluble liquid flux for wafer level electroplated bump reform. Product Overview ALPHA OA1303 water soluble spray flux is engineered to be used in the wafer bump reform process for... | |
| Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications. Product Overview ALPHA WS9160-M7 water soluble flux is engineered to be used in the attachment... | |
| Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications. Product Overview ALPHA WS9180-MHV water soluble halide-free flux is engineered to be used in the... | |
| Water soluble, lead-free solder paste capable of 50um aperture printing performance with low voiding and excellent soldering and residue cleaning performance. Product Overview ALPHA WS-699CPS is a next generation water... | |
| Water soluble, lead-free solder paste which meets zero-halogen requirements with low voiding and excellent residue cleaning performance. Product Overview ALPHA WS-693CPS is a lead-free, water soluble solder paste designed for... | |
| We provide safe and efficient recycling services which help companies to meet their environmental and legislative requirements and at the same time, maximize the value of their waste streams. MacDermid... | |
| We provide safe and efficient recycling services which help companies to meet their environmental and legislative requirements and at the same time, maximize the value of their waste streams. Product... |