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MacDermid Alpha Electronics Solutions Datasheets for Soldering Irons, Stations, and Accessories

Soldering irons, stations and accessories bond two or more metallic surfaces together with a low melting alloy solder such as tin/lead or Sn/Cu/Ni/Ge alloys, which is melted, wets the surface and resolidifies forming a soldered joint.
Soldering Irons, Stations, and Accessories: Learn more

Product Name Notes
Argomax 2141 Paste is a silver sinter paste for large package sinter attachment, specifically for marginalized component surfaces that are designed for component placement on wet paste with high tack.
A lead-free, no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in the most challenging applications. Product Overview ALPHA CVP-390V is a zero-halogen solder paste...
A low residue, no-clean solder paste designed to maximize first pass yields. The rheologically formulated flux vehicle provides excellent repeatability and resistance to environmental conditions. Product Overview ALPHA OM-5100 Solder...
A low silver lead-free alloy specially designed with proprietary additives to deliver SAC305 like soldering and reliability performance Product Overview ALPHA SACX Plus 0807 is a low silver lead-free alloy...
A no-clean solder paste that meets the demands of tin-lead soldering when lead free components are present in the circuit assembly. Product Overview ALPHA OM-5300 is a zero halogen, no...
A suite of final finishes for IC substrates that provides solderability, gold wire bondability, and OEM acceptance. Our finishes meet requirements for reliability during assembly and beyond. Product Overview Which...
A tin-lead, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required. Product Overview ALPHA WS-809 is a SnPb water soluble...
Affinity™ ENEPIG is the final finish that IC substrate manufacturers choose for critical applications where six-sigma assembly performance and mission-critical reliability are required. Product Overview The Affinity ENEPIG process is...
ALPHA CVP-520 enables low temperature SMT assembly technology to minimize rework in multiple reflow applications. Product Overview ALPHA CVP-520 is designed for near eutetic low temperature alloys such as SnBi0.4Ag...
ALPHA JP-500 is a lead-free, zero halogen, no-clean solder paste designed for use in Jet Printers and approved for use with leading jetting equipment manufacturers. Product Overview ALPHA JP-500 is...
ALPHA JP-501 is a low temperature, lead-free, no-clean solder paste designed for use in Jet Printers. Product Overview The low temperature, lead-free alloy in ALPHA JP-501 has a melting point...
ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer...
ALPHA OM-220 is an ultra-low temperature, no clean, zero halogen solder paste paired with Alpha’s ULT1 alloy intended for soldering temperature sensitive components and substrates. Product Overview ALPHA OM-220 enables...
ALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability. Product Overview ALPHA OM-372 is engineered specifically to...
ALPHA OM-550 is a zero halogen, low temperature chemistry paired with the HRL1 alloy designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys. Product...
ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced...
ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance. Product Overview ALPHA WS-608 water...
ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance. Product Overview ALPHA WS-630 water soluble flux...
ALPHA WS-698 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes and enables low voiding performance. Product Overview ALPHA WS-698 water soluble flux...
ALPHA WS-820, a lead free, halide free, water soluble solder paste, offering the ideal combination of printability and flexibility in reflow profile window with excellent cleanability. Product Overview ALPHA WS-820...
ALPHA WS-826 is a zero-halogen, lead-free, water-soluble solder paste formulated for fine features and exhibits excellent stencil life in ambient and elevated conditions. Product Overview ALPHA WS-826 is a water-soluble,...
ALPHA® OM-362 Solder Paste is an ultra-low voiding, high-reliability, RoHS compliant, & zero-halogen solder paste Product Overview ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4...
Alumina Filled Dielectric Paste Product Overview STAYSTIK 701 is ideal for applications where resistance to high temperature excursions is desired. This paste adhesive can be used for die attach in...
Alumina Filled Dielectric Paste Product Overview STAYSTIK 783 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 783...
Alumina Filled Dielectric Paste Product Overview STAYSTIK 793 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process...
Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 211 is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 211 adhesive paste can be used for die...
Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 272 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 272 is characterized by excellent bonding at...
Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 282 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK...
Aluminum Nitride-filled Thermally Enhanced Paste Product Overview STAYSTIK 292 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 292 is characterized by excellent bonding at...
ATROX Brand of die attach pastes are designed to provide you with superior performance for todays stringent reliability requirements. The die attach products (ATROX) offer complete solution with lower total...
Chemical processes for the application of long lasting corrosion resistant coatings for connectors and interconnects. Product Overview Whether you need durability, long lasting corrosion resistance, or functional final finishes, we...
Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device. Product Overview ALPHA TrueHeight Spacer Blocks are burr free,...
High activity water soluble Lead-Free solder paste capable of high soldering yields with low voiding and excellent residue cleaning performance Product Overview High activity, low voiding Water Soluble Solder Paste...
High lead, Zero-halogen, No clean Solder Paste Product Overview ALPHA NCP-1213 is a high lead, zero-halogen no clean solder paste designed for high power, high performance, die attach applications. This...
Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula that offers flexibility across a broad range of print and reflow conditions. Product Overview Kester NP505-HR is formulated to offer...
Lead-Free Hot Air Solder Level Alloy Product Overview ALPHA SACX Plus HASL is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the hot air solder...
Lead-free, zero-halogen solder paste designed for broad latitude, high reliability applications, requiring process flexibility and residue containment. Product Overview ALPHA OM-353 is a zero-halogen solder paste engineered to provide superior...
Leading immersion silver offerings that enable excellent general assembly performance on a wide range of circuit board types Product Overview Our immersion silver final finishes are trusted by hundreds of...
Low Silver, Lead-Free Alloy for Wave, Selective and Rework Applications Product Overview ALPHA SACX Plus 0307 is a low silver lead-free alloy suitable for use as a replacement for SnPb,...
No clean low residue liquid flux for indium solder preform thermal interface lid attach. Product Overview Kester SE-CURE 9665 is no clean liquid flux formulated with a heat stabilized system...
No clean paste flux which enables low residue post reflow with low voiding and excellent soldering performance. Product Overview ALPHA NCX-402-M3 is a highly active, halogen-free, ultra low residue no...
No clean paste flux with high activity and clear residues. Product Overview Kester TSF-6592HF is a no clean paste flux designed as a lead-free solution for an array of lead...
No clean paste flux with high activity for a wide range of soldering applications. Product Overview ALPHA NCX-390 is a highly active, no clean flux, engineered for multiple semiconductor applications.
No clean paste flux with low residue post reflow and low voiding performance. Product Overview Kester TSF-ULR18 is a no clean ultra low residue tacky flux. TSF-ULR18 is highly recommended...
No clean rosin-based paste flux with high tackiness and long pot life. Product Overview KESTER TSF-6522RH is a no clean rosin-based paste flux, designed to meet IPC halogen-free requirements. TSF-6522RH...
No clean, lead-free solder paste which meets zero-halogen requirements with low voiding, fine feature printing performance. Product Overview ALPHA NCP-390 is a lead-free, zero-halogen, no-clean solder paste designed for applications...
No-clean, lead-free solder paste that enables low residue post reflow with low voiding and excellent soldering performance. Product Overview ALPHA NCP-LR002 is a lead-free, no-clean solder paste designed for applications...
Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 371 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 371 is characterized by excellent bonding at low...
Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 383 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 383...
Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 393 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process...
Silver Free Lead Free Alloy for Wave, Selective and Rework Applications Product Overview ALPHA SnCX Plus 07 is a no-silver, lead-free alloy suitable for use as a replacement for SnPb,...
Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach Product Overview ALPHA Argomax 8035 Film is a low-pressure silver sintering die attach film from...
Sinter Silver Film for Die Attachment – Wafer Level Processing Product Overview ALPHA Argomax 8031 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed...
Sinter Silver Film for Die Attachment Product Overview ALPHA Argomax 8020 Film is specifically designed for die and spacer lamination on silver surfaces using existing pick and place equipment. ALPHA...
Sinter Silver Film for Die Attachment Product Overview ALPHA Argomax 8021 Film is specifically designed for die and spacer lamination on a wide variety of surfaces using existing pick and...
Sinter Silver Film for Large Area Lamination Product Overview ALPHA Argomax 8010 Film is specifically designed for large area lamination followed by a low pressure sintering process capable of high...
Sinter Silver Paste for Die Attachment (Print and Dispense) with Wet Die Placement Product Overview ALPHA Argomax 2040 is a silver sintering die attach paste specifically designed for die placement...
Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement Product Overview ALPHA Argomax 5040 Paste is a silver sintering paste specifically designed for die placement on...
Sinter Silver Paste for Die Attachment on Copper Surface Product Overview ALPHA Argomax 5022 Paste is a silver sintering die attach paste specifically designed for low pressure sintering die attachment...
Sinter Silver Paste for Package Sinter Attachment Product Overview ALPHA Argomax 2047 is a nano-Silver sintering paste developed to meet the increasing demand of large area attach applications (module to...
Sinter Silver Paste for Package Sinter Attachment Product Overview ALPHA Argomax 2048 Paste is a dispensable paste specifically developed for pressure sintering of large packages (or components) on gold and...
Sinter Silver Sintering Paste for Die Attachment Product Overview ALPHA Argomax 2010C is a specifically designed sintering film for high-volume, low-pressure sintering die attachment with a design that promotes ease...
Thermoplastic Adhesive Paste STAYSTIK 181AK is characterized by its excellent bonding properties. The paste can be used for die, lid seal and/or substrate attach in hybrid, multi-chip modules (MCMs) or...
Water soluble liquid flux for wafer level electroplated bump reform. Product Overview ALPHA OA1303 water soluble spray flux is engineered to be used in the wafer bump reform process for...
Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications. Product Overview ALPHA WS9160-M7 water soluble flux is engineered to be used in the attachment...
Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications. Product Overview ALPHA WS9180-MHV water soluble halide-free flux is engineered to be used in the...
Water soluble, lead-free solder paste capable of 50um aperture printing performance with low voiding and excellent soldering and residue cleaning performance. Product Overview ALPHA WS-699CPS is a next generation water...
Water soluble, lead-free solder paste which meets zero-halogen requirements with low voiding and excellent residue cleaning performance. Product Overview ALPHA WS-693CPS is a lead-free, water soluble solder paste designed for...
We provide safe and efficient recycling services which help companies to meet their environmental and legislative requirements and at the same time, maximize the value of their waste streams. MacDermid...
We provide safe and efficient recycling services which help companies to meet their environmental and legislative requirements and at the same time, maximize the value of their waste streams. Product...