Product Overview
ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored at -40ºC. Additionally, its low outgassing properties help minimize contamination, supporting high-quality and reliable performance.
Product Features
High Reliability
Achieves MSL-1 performance and zero delamination on leadframe packages.
Flexible Manufacturability
Box oven- and snap-cure capable
High Throughput Automated Dispensing
Optimum rheology* maximizes throughput with minimal machine downtime.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | ATROX ® CD 560-1 |
| Product Name | Advanced Conductive Die Attach for Semiconductors |
| Cure / Technology | Thermoset |
