MacDermid Alpha Electronics Solutions Panel Level Packaging Metallization Solutions PackageBond

Product Overview PackageBond is the proven adhesion promotion system specifically designed for the demands of panel level packaging, delivering reliability at today’s high reflow temperatures. Production proven in high volume at premier semiconductor manufacturing facilities, PackageBond ensures that large, reconstituted panels withstand thermal and moisture stress without delamination, blistering, or warpage. PackageBond is based on patented chemistry that preserves the long-term integrity of polymer and copper interfaces, ensuring robust performance through reflow, thermal cycling, and reliability testing. Product Features Proven Reliability at MSL-1 PackageBond enables proven reliability at MSL-1 with no delamination, blistering, or warpage in large reconstituted panels . Improved Adhesion Performance Significantly improves adhesion performance in advanced chip packages . Prevents Cracking or Delamination PackageBond features chemistry that stabilizes copper polymer interfaces, preventing cracks or delamination during thermal cycling and reflow . Global Technical Expertise Backed by MacDermid Alpha’s global technical expertise and validated in high-volume panel level packaging manufacturing.