MacDermid Alpha Electronics Solutions Precision Camera Module Adhesive Solutions ALPHA ® HiTech ® AD13-9521B

Description
Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This adhesive cures quickly at low temperatures, minimizing thermal stress on sensitive components and enabling efficient production processes. Product Features Fast, Low-Temperature Cure It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal stress during assembly. Halogen-Free and RoHS Compliant This product meets environmental safety standards, providing a compliant solution for industries requiring eco-friendly materials. High Adhesion Suitable for a range of materials, it delivers strong bonding capabilities, even on challenging surfaces like Liquid Crystal Polymer (LCP) and metals. Featured Applications Heat-Sensitive Perfect for electronic components that are sensitive to high-temperature processing, such as those found in computing and communication devices. Automotive Used for sensors and modules that require reliable bonding and compliance with automotive-grade standards. Industrial Ideal for devices in harsh environments, thanks to its high adhesion and thermal stability.
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Description
Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This adhesive cures quickly at low temperatures, minimizing thermal stress on sensitive components and enabling efficient production processes. Product Features Fast, Low-Temperature Cure It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal stress during assembly. Halogen-Free and RoHS Compliant This product meets environmental safety standards, providing a compliant solution for industries requiring eco-friendly materials. High Adhesion Suitable for a range of materials, it delivers strong bonding capabilities, even on challenging surfaces like Liquid Crystal Polymer (LCP) and metals. Featured Applications Heat-Sensitive Perfect for electronic components that are sensitive to high-temperature processing, such as those found in computing and communication devices. Automotive Used for sensors and modules that require reliable bonding and compliance with automotive-grade standards. Industrial Ideal for devices in harsh environments, thanks to its high adhesion and thermal stability.
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Datasheet
Datasheet Summary
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ALPHA HiTech AD13-9521B is a one-component low-temperature cure epoxy adhesive designed for bonding heat-sensitive electronic devices. It is supplied in 10cc and 30cc syringes, with a viscosity of 8,000 to 12,000 cP at 25 °C and a glass transition temperature of 55 ± 5 °C. The cured adhesive exhibits a Shore D hardness of 75 to 85, a coefficient of thermal expansion of 60 ± 10 ppm below Tg and 180 ± 20 ppm above Tg, and exhibits excellent adhesion to Nylon (PA9T), Liquid Crystal Polymer (LCP), and metals. It is halogen-free and complies with RoHS Directive 2011/65/EU.

Datasheet Summary
Powered by GS/AI

ALPHA HiTech AD13-9521B is a one-component low-temperature cure epoxy adhesive designed for bonding heat-sensitive electronic devices. It is supplied in 10cc and 30cc syringes, with a viscosity of 8,000 to 12,000 cP at 25 °C and a glass transition temperature of 55 ± 5 °C. The cured adhesive exhibits a Shore D hardness of 75 to 85, a coefficient of thermal expansion of 60 ± 10 ppm below Tg and 180 ± 20 ppm above Tg, and exhibits excellent adhesion to Nylon (PA9T), Liquid Crystal Polymer (LCP), and metals. It is halogen-free and complies with RoHS Directive 2011/65/EU.

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Precision Camera Module Adhesive Solutions - ALPHA ® HiTech ® AD13-9521B - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Precision Camera Module Adhesive Solutions
ALPHA ® HiTech ® AD13-9521B
Precision Camera Module Adhesive Solutions ALPHA ® HiTech ® AD13-9521B
Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This adhesive cures quickly at low temperatures, minimizing thermal stress on sensitive components and enabling efficient production processes. Product Features Fast, Low-Temperature Cure It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal stress during assembly. Halogen-Free and RoHS Compliant This product meets environmental safety standards, providing a compliant solution for industries requiring eco-friendly materials. High Adhesion Suitable for a range of materials, it delivers strong bonding capabilities, even on challenging surfaces like Liquid Crystal Polymer (LCP) and metals. Featured Applications Heat-Sensitive Perfect for electronic components that are sensitive to high-temperature processing, such as those found in computing and communication devices. Automotive Used for sensors and modules that require reliable bonding and compliance with automotive-grade standards. Industrial Ideal for devices in harsh environments, thanks to its high adhesion and thermal stability.

Product Overview

A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This adhesive cures quickly at low temperatures, minimizing thermal stress on sensitive components and enabling efficient production processes.

Product Features

Fast, Low-Temperature Cure

It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal stress during assembly.


Halogen-Free and RoHS Compliant

This product meets environmental safety standards, providing a compliant solution for industries requiring eco-friendly materials.


High Adhesion

Suitable for a range of materials, it delivers strong bonding capabilities, even on challenging surfaces like Liquid Crystal Polymer (LCP) and metals.

Featured Applications

Heat-Sensitive

Perfect for electronic components that are sensitive to high-temperature processing, such as those found in computing and communication devices.


Automotive

Used for sensors and modules that require reliable bonding and compliance with automotive-grade standards.


Industrial

Ideal for devices in harsh environments, thanks to its high adhesion and thermal stability.

Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Industrial Adhesives
Product Number ALPHA ® HiTech ® AD13-9521B
Product Name Precision Camera Module Adhesive Solutions
Cure / Technology Single Component
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