MacDermid Alpha Electronics Solutions Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
| Product Name | Notes |
|---|---|
| ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with... | |
| ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. | |
| ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow... | |
| ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each... | |
| ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend,... | |
| ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU11-3127... | |
| ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill. It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed... | |
| ALPHA® HiTech™ CU31-3100 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® | |
| ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. | |
| ALPHA® HiTech™ EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. These encapsulants prevent chip... | |
| ALPHA® HiTech™ EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products... | |
| Product Description APL Acrylic Protective Laquer is a flexible, fast drying acrylic conformal coating used for the protection of electronic circuitry. It has been formulated for professional use only and... | |
| Product Description DCB SCC3 Black conformal coating is a specialist modified alkyd coating which has been specifically designed to meet the highest defence standards in both Europe and the United... | |
| Product Description Electrolube LTC low temperature conformal coating is a modified synthetic rubber, designed specifically for the protection of high-performance electronic circuitry. LTC is fast-drying, tough and highly flexible. Due... | |
| Product Description ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold... | |
| Product Description ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It’s a very low viscosity resin system ideal for... | |
| Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke... | |
| Product Description ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It’s a good all round resin offering a cost... | |
| Product Description ER2218 very low viscosity, flame retardant epoxy which has been formulated for use as a potting compound / encapsulation resin. Boasting excellent thermal stability ER2218 has been specifically... | |
| Product Description ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent... | |
| Product Description ER2223 highly chemical resistant epoxy potting compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It has excellent chemical... | |
| Product Description ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components. The resin has good... | |
| Product Description ER6007 is a two-part modified silicone potting compound / encapsulating resin designed for the protection of electronic devices or components. It has been formulated as a soft silicone... | |
| Product Description FPC fluorinated polymer conformal coating is a specialist ultra-thin coating. It repels hydrocarbon and silicone oils as well as synthetic fluids and aqueous solutions due to its very... | |
| Product Description HFS High Performance Fluorinated Solvent is a non-flammable, fluorinated solvent designed for use with Electrolube FPC, Fluorinated Polymer Coating. HFS is used to dilute FPC in order to... | |
| Product Description HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between... | |
| Product Description HTS Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive interface material which will operate over a wide... | |
| Product Description PUC polyurethane conformal coating is a clear amber modified polyurethane specifically designed for the protection of electronic circuitry. It is a toughand abrasive resistant coating which has excellent... | |
| Product Description RRS cured resin remover solvent is a special blend of solvents designed to swell, soften and in some cases dissolve cured coatings and resins, including epoxy and polyurethane... | |
| Product Description SC4004 is a thixotropic silicone potting compound which has been developed for the Indian electronics market. Due to its thixotropic nature it has good flow characteristics to aid... | |
| Product Description SC4010 is a very low viscosity silicone potting and encapsulation compound for the protection of electronic components. Please note: This product has been developed for a specific territory... | |
| Product Description SCPH Silver Conductive Adhesive has been designed for use during the manufacture of display modules for mobile/smart phones, tablets and many other electronic products. It exhibits excellent electrical... | |
| Product Description TCOR RTV Thermally Conductive Oxime is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of... | |
| Product Description UR5041 water resistant polyurethane potting compound is a two-part black encapsulation and potting compound formulated to perform to the highest levels. This resin system provides exceptional resistance to... | |
| Product Description UR5044 flame retardant polyurethane resin is a UL94 approved two part system has been developed for potting and encapsulation of electronics. Once cured it has a dark blue... | |
| Product Description UR5048 soft / digoutable polyurethane potting compound is a flexible encapsulation resin with a soft finish. It’s soft ‘digoutable’ properties making it a good choice for potting units... | |
| Product Description UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide... | |
| Product Description UR5118 highly water resistant, RF polyurethane resin has been developed as an ultra high performance encapsulation and potting compound offering a high level of protection in a range... | |
| Product Description UR5528 chemically resistant polyurethane resin is a two part potting and encapsulation compound with excellent chemical resistance suitable for a wide variety of applications. Its excellent water resistance... | |
| Product Description UR5547 general purpose electrical potting compound is a black polyurethane resin ideally suited to electronics with small or delicate components. The cured resin is semi-rigid, exhibiting very little... | |
| Product Description UR5604 general purpose polyurethane potting compound is a two part, potting and encapsulation resin. It’s a good all round resin suitable for a huge range of electronic applications... | |
| Product Description UR5608 hard polyurethane potting compound is a tough resin ideal for applications where thermal shock or temperature cycling is present. It’s a good all round resin with good... | |
| Product Description UR5645 high performance polyurethane resin has been specially developed for the encapsulation and potting of electronics such as the next generation of automotive electronics. It exhibits excellent chemical... | |
| Product Description UVCL UV cure conformal coating is a single-part coating which cures within seconds of exposure to the correct dose of UV light. It has been specifically designed to... |