MacDermid Alpha Electronics Solutions Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
| Product Name | Notes |
|---|---|
| A durable two-part polyurethane encapsulation resin developed for electrical components exposed to extreme conditions. Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting... | |
| A high-performance acrylic conformal coating crafted to meet the rigorous demands of industries such as defense and aerospace. Product Overview HPA High Performance Acrylic Conformal Coating is specifically designed to... | |
| A low-viscosity, single-part conformal coating that cures within seconds of exposure to the correct dose of UV light. Product Overview UVCL UV cure conformal coating is a single-part solution that... | |
| A metal oxide-filled silicone oil offers efficient thermal conductivity and operates effectively across a wide temperature range. Product Overview HTS Silicone Heat Transfer Compound is a metal oxide-filled silicone oil,... | |
| A one-component capillary underfill protects chip packages on PCBs, with high Tg and low CTE to shield solder joints from stress. Product Overview ALPHA HiTech CU11-3127 is a high filler... | |
| A one-component epoxy system designed to encapsulate the chip component to protect the device and strengthen the solder joints. Product Overview ALPHA HiTech EN21-4210F has a high hardness property, making... | |
| A one-component, fast-curing surface mount adhesive, specifically designed for screen printing. Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product... | |
| A one-component, low-temperature cure epoxy system, designed for bonding heat-sensitive devices and camera module applications. Product Overview ALPHA HiTech AD13-9692B exhibits high adhesion strength between LCP and magnet surfaces, resulting... | |
| A silver sinter paste, providing high thermal and electrical conductivity. Product Overview The ALPHA® Argomax® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal... | |
| A single-component epoxy cures at low temperatures, offering water resistance and bonding FPCB to various plastic materials. Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics... | |
| A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications. Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal... | |
| A thermoplastic adhesive film that bonds at low temps with a low modulus (60,000 psi). Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications,... | |
| A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages. Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching... | |
| A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow... | |
| A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally... | |
| A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview SC4003 is a thixotropic two-part silicone potting and encapsulating resin... | |
| A unique modified alkyd conformal coating formulated to meet the highest defense standards in Europe and the U.S. Product Overview DCA SCC3 Conformal Coating is a unique, modified alkyd coating... | |
| A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing. Product Overview A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. | |
| A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed... | |
| Adhesion promoter that enables superior bonding for solder mask, dry film, and liquid photoresist on copper. Product Overview The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask,... | |
| Advanced leadframe adhesion technology designed to overcome delamination problems to achieve MSL-1 reliability. Product Overview PackageBond is the no-risk adhesion promotion system specifically engineered for optimal adhesion at today’s intense... | |
| Aluminum nitride-filled adhesive film for electronics bonds well at low temps, handles different TCEs, and is reworkable. Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of... | |
| Aluminum nitride-filled film resists high temps, ideal for die attach in hermetic packages, with low RGA and reworkability. Product Overview STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring... | |
| An optically clear acrylic conformal coating ideal for LED applications and those demanding clarity and UV resistance. Product Overview AFA optically clear acrylic conformal coating is ideally suited for use... | |
| An ultra-low stress Hybrid Silver sintered die attach paste with high thermal conductivity set for high power exposed pad semiconductors. Product Overview ATROX® 800HT7A: High-performance conductive paste formulated for... | |
| Clear amber modified polyurethane conformal coating specifically designed to protect electronic circuitry. Product Overview PUC Polyurethane Conformal Coating is a tough, abrasion-resistant coating with excellent mechanical and dielectric properties, while... | |
| Conductive die attach pastes offer excellent performance to meet today's high reliability standards. Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed... | |
| Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance. Product Overview SC4004 is a thixotropic silicone potting compound developed for the... | |
| Environmentally friendly, polymer-based system that delivers high performance and production capacity. Product Overview The ENVISION polymer-based system is unlike any other direct metallization process on the market today. It delivers... | |
| Flame-retardant polyurethane UL94-approved resin. Soft enough for dig-out work, it remains flexible over a wide temperature range. Product Overview UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed... | |
| Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general... | |
| Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin... | |
| Flexible, fast-drying transparent acrylic coating used for the protection of electronic circuitry. Product Overview APL Acrylic Protective Lacquer is a cost-effective coating formulated for professional use only and engineered to... | |
| Flexible, solvent resistant latex for masking components, connectors, and other items during the conformal coating process. Product Overview PCM Peelable Coating Mask is a flexible, solvent-resistant latex designed for masking... | |
| Frameless stencil foils elevate "frameless" stencil technology to a new level. Product Overview ALPHA Tetrabond is the culmination of "frameless" stencil development, offering an elegantly simple system designed to enhance... | |
| Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and... | |
| High-performance peroxide-sulfuric etchant system that ensures maximum circuit densities, trace profile and excellent adhesion. Product Overview CircuEtch 300 is a high-performance flash etching process for circuit formation in Semi-Additive (SAP)... | |
| High-performance polyurethane potting and encapsulation compound suitable for a wide range of applications. Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This versatile... | |
| High-reliability, two-component polyurethane conformal coating for demanding applications. Product Overview Electrolube® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced... | |
| Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating... | |
| Industry-leading cyanide-, arsenic-, thallium- and lead-free gold process capable of via filling with low surface roughness. Product Overview NOVAFAB VIA FILL AU is a mild alkaline, non-cyanide gold electroplating process... | |
| Innovative low-etch alternative oxide for improved laser direct drilling of vias and optimized topography. Product Overview MultiBond 500 is a first-generation, low-etch oxide alternative designed for laser direct drill pretreatment... | |
| Low-etch alternative oxide provides low surface profiles and reliable adhesion for high frequency applications. Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. | |
| Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out. | |
| Next-generation, high reliability, reworkable edgebond. Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Tg and low CTE, purposefully engineered for high-temperature automotive applications that require exceptional board-level... | |
| Offers the best thermal conductivity performance, combined with the advantage of using a non-silicone base oil. Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful... | |
| One-component capillary underfill with high Tg and low CTE for reliable protection of assembled chip packages on PCBs. Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to... | |
| One-component UV cure system designed for fast curing and bonding in various applications, including coating and component fixing. Product Overview ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger... | |
| PFAS-free, conductive die attach products deliver a cost-effective, high-performance solution, leading the way in advanced materials. Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages... | |
| Premium adhesive for garment and textile screen printing, used to secure the substrate onto the platen when printing. Product Overview Low Tack Platen Adhesive is a premium water-based adhesive for... | |
| Provides the ultimate in thermal conductivity with a very wide temperature range obtained by using silicone base oils. Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus"... | |
| Screen printable conductive adhesive for secure connection of components to flexible and formable circuit tracks. Product Overview XtraForm E7000 is a silver electrically conductive adhesive (ECA) designed for low-temperature substrates... | |
| Silver-filled conductive film bonds well at low temps (60,000 psi modulus), handles different CTEs, and is easily reworked. Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety... | |
| Silver-filled conductive film offers strong bonding for MCMs and superior reworkability compared to thermosets. Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering... | |
| Silver-filled thermoplastic paste offers strong bonding for electronics, ideal for MCMs, and superior reworkability. Product Overview STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and... | |
| Solvent-based adhesive for temporary bonding, ideal for GaAs/silicon wafer thinning. Debonds with IPA, no residue. Product Overview A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive... | |
| Specialist resin with environmental protection for LEDs and PCBs, preserving optical clarity and color after prolonged UV exposure. Product Overview UR5634 Optically Clear Polyurethane LED Potting Compound is a two-part,... | |
| Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate... | |
| The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. Product Overview ATROX conductive die attach products provide a... | |
| Thermoplastic adhesive film excels in electronics, offering strong bonding for MCMs and better reworkability than thermosets. Product Overview STAYSTIK 482 Thermoplastic Adhesive Film is designed for a range of electronic... | |
| This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it... | |
| Ultra high-performance polyurethane offering exceptional protection in various environments with excellent electrical properties. Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performan ce encapsulation and... | |
| Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications. Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility... | |
| Uniquely formulated copper conversion coating for multilayer PCBs, combining micro-roughening with an embedded organic coating. Product Overview MultiBond MP is a uniquely formulated copper conversion coating for multilayer printed circuit... | |
| Used in PCB assembly and integration into higher-level assemblies, serving as the primary solder for a range of electronic devices. Product Overview ALPHA Exactalloy Washers in tape and reel packaging... |