MacDermid Alpha Electronics Solutions Datasheets for Electrical and Electronic Resins

Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more

Product Name Notes
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ALPHA® ATROX®HT900-3 ALPHA® ATROX® HT900-3 is a thermosetting conductive die attach adhesive with moderate thermal conductivity designed for low to mid power High Brightness LED die attach applications which require optimum...
Heat Curable Cornerfill Epoxy -- ALPHA® HiTech CF31-4010 ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable cornerfill designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.
Underfill Epoxy for protecting assembled chip packages -- ALPHA® HiTech CU21-3240 ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with...
Reworkable Underfill Epoxy for protecting assembled chip packages -- ALPHA® HiTech CU31-2030 ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
Capillary Underfill -- ALPHA® HiTech™ CU11-3127 ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU11-3127...
Cornerfill Epoxy System -- ALPHA® HiTech™ CF12-4485B ALPHA® HiTech™ CF12-4485B is a one-component, low temperature cure, cornerfill epoxy system. It is designed to provide protection to the solder joint during mechanical stress.
Capillary Underfill -- ALPHA® HiTech™ CU13-3150 ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill. It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed...
Capillary Underfill -- ALPHA® HiTech™ CU31-3100 ALPHA® HiTech™ CU31-3100 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA®
Capillary Underfill -- ALPHA® HiTech™ CU32-380 ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
Solder Joint Strengthening Encapsulant -- ALPHA® HiTech™ EN21-4210 ALPHA® HiTech™ EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. These encapsulants prevent chip...
Solder Joint Strengthening Encapsulant -- ALPHA® HiTech™ EN31-4007 ALPHA® HiTech™ EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products...
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ALPHA® ATROX® HT900-1 ATROX® HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of the ATROX® HT900-1 allows the material to be cured at lower temperatures...
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ATROX™ HT900-6B ATROXTM HT900-6B is a low stress thermosetting conductive die attach adhesive with high thermal conductivity designed for high power LED packages. ATROXTM HT900-6B has low resin bleed out and low...