MacDermid Alpha Electronics Solutions Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
| Product Name | Notes |
|---|---|
| Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it... | |
| Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages with metallized dies. It features exceptional thermal conductivity, low resin bleed-out, and minimal condensable organics, ensuring... | |
| Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical,... | |
| Product Overview A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed for temporary bonding applications, most typically associated with... | |
| Product Overview A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and... | |
| Product Overview Acrylic Protective Lacquer (APL) is a cost-effective coating formulated for professional use only and engineered to meet a range of international standards, including MIL-I-46058C and IPC-CC-830. Its excellent... | |
| Product Overview ALPHA Exactalloy Washers in tape and reel packaging support Surace Mount Technology (SMT) soldering operations for through hole components. These washers feature integrated flux, enabling a secondary paste-free... | |
| Product Overview ALPHA HiTech AD13-9692B exhibits high adhesion strength between Liquid Crystal Polymer (LCP) and magnet surfaces, resulting in excellent drop impact performance when tested on camera module housing and... | |
| Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), purposefully engineered for high-temperature automotive applications that require... | |
| Product Overview ALPHA HiTech CU11-3127 is a high filler content product designed to provide enhanced mechanical strength for Chip Scale Packaging (CSP) and Flip Chip packages. With its unique low-viscosity... | |
| Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards. It features a high Glass Transition Temperature (Tg) and low... | |
| Product Overview ALPHA HiTech CU31-3300 is a one-component reworkable underfill that balances a moderately high Glass Transition Temperature (111 °C) with excellent reworkability to help manufacturers protect assemblies while maintaining... | |
| Product Overview ALPHA HiTech EN21-4210F has a high hardness property, making it ideal for assembling components that require excellent reinforcement strength. The ALPHA HiTech EN21-4210 is a non-reworkable encapsulant product... | |
| Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product recommended for customers requiring a screen-printable adhesive. | |
| Product Overview ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger chip coating. It is halogen-free and complies with the Restriction of Hazardous Substances (RoHS) Directive 2015/863/EU. | |
| Product Overview ALPHA Tetrabond is the culmination of "frameless" stencil development, offering an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting easier. | |
| Product Overview Aromatic Free Acrylic (AFA) optically clear acrylic conformal coating is ideally suited for use as a Light Emitting Diode (LED) coating or in other commercial applications to protect... | |
| Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable... | |
| Product Overview ATROX CD 590-HT2 is a thermosetting electrically conductive die attach designed for substrate based as well as metal lead frame semiconductor packages. This solution combines high thermal conductivity... | |
| Product Overview ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features Thermal Conductivity... | |
| Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot... | |
| Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out. | |
| Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow characteristics in automated die attach systems. | |
| Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally demanding semiconductor die attach with good printability. | |
| Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility for stress-sensitive components. | |
| Product Overview ATROX® 800HT7A: High-performance conductive paste formulated for enhanced mechanical stability and process robustness under thermal cycling. | |
| Product Overview CircuEtch 300 is a high-performance flash etching process for Semi-Additive Processing (SAP) in Integrated Circuit (IC) substrates and Panel Level Packaging (PLP). Designed for precision, it cleanly etches... | |
| Product Overview DCA SCC3 Conformal Coating is a unique, modified alkyd coating specifically formulated to meet the highest defence standards in both Europe and the United States. Highly flexible, it... | |
| Product Overview Electrolube® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced edge coverage, and excellent flexibility, effectively minimizing stress... | |
| Product Overview Electrolube® LGF200 is a thermally conductive, silicone-based liquid gap filler featuring a two-component, cure-in-place formulation for easy processing. With a thermal conductivity of 2 W/m-K, it delivers excellent... | |
| Product Overview Electrolube® LGF400 is a thermal interface material engineered for easy processing. This silicone-based liquid gap filler features a two-component, cure-in-place formulation. With a high thermal conductivity of 4... | |
| Product Overview Electrolube® PUC Polyurethane Conformal Coating is a tough, abrasion-resistant coating with excellent mechanical and dielectric properties, while maintaining the flexibility needed to protect delicate components. It can be... | |
| Product Overview Electrolube® UVFlex is a next-generation, solvent-free, UV-curable conformal coating engineered for demanding electronics applications. Its unique elasticity helps maintain coating integrity through extreme thermal cycling and harsh environmental... | |
| Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry. It offers a cost-effective solution for a wide range... | |
| Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics industry. It offers a cost-effective solution for a wide range... | |
| Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed to meet the increasing demands for efficient thermal dissipation. This compound combines ease... | |
| Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It offers excellent chemical... | |
| Product Overview High Performance Acrylic (HPA) Conformal Coating is specifically designed to meet the demanding requirements of applications such as those in the defense and aerospace industries. It can be... | |
| Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic components, or between any surfaces where thermal... | |
| Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful HTC, offering ultimate thermal conductivity along with the benefits of a non-silicone base oil. The exceptional... | |
| Product Overview HTS Silicone Heat Transfer Compound is a metal oxide-filled silicone oil, providing an extremely efficient and thermally conductive interface material that operates over a wide temperature range. Electrolube... | |
| Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube’s successful HTS, offering superior thermal conductivity and a wide temperature range through the use of... | |
| Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. The unique low-etch process provides a low-profile surface topography to optimize maximum signal integrity... | |
| Product Overview MultiBond 500 is a first-generation, low-etch oxide alternative designed for laser direct drill pretreatment and reliable innerlayer adhesion in multilayer circuit boards, specifically for Semi-Additive Process (SAP) and... | |
| Product Overview MultiBond MP is a uniquely formulated copper conversion coating for multilayer Printed Circuit Boards (PCBs), combining micro-roughening with an embedded organic coating. Designed for use in high-throughput, automated... | |
| Product Overview NOVAFAB VIA FILL AU is a mild alkaline, non-cyanide gold electroplating process that produces deposits of 99.9% purity. NOVAFAB VIA FILL AU is specifically designed to fill vias... | |
| Product Overview PackageBond is the proven adhesion promotion system specifically designed for the demands of panel level packaging, delivering reliability at today’s high reflow temperatures. Production proven in high volume... | |
| Product Overview Peelable Coating Mask (PCM) is a flexible, solvent-resistant latex designed for masking components, connectors, and other items during the conformal coating process. It ensures that sensitive items and... | |
| Product Overview SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the protection of Light-Emitted Diode (LED) drivers, its properties also... | |
| Product Overview SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides excellent flow characteristics, making it ideal for potting tight units or... | |
| Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach... | |
| Product Overview STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000... | |
| Product Overview STAYSTIK 482 Thermoplastic Adhesive Film is designed for a range of electronic applications and delivers excellent bonding performance. Suitable for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety of electronic applications. It provides excellent bonding at low process temperatures and features a very low elastic modulus... | |
| Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring resistance to high-temperature excursions. It is suitable for die attach in solder-sealed, hermetic packages and delivers low Residual... | |
| Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of electronic applications, offering excellent bonding at low process temperatures and a very low elastic modulus of 60,000... | |
| Product Overview Systek™ BAF Ni is an easy to control nickel barrier layer electroplating process. It delivers pure, ductile, fine-grained, low stress nickel deposits with excellent coplanarity, meeting the requirements... | |
| Product Overview Systek™ HCP 100 copper pillar bath chemistry achieves high-speed plating rates of 8 μm/min, delivering high-purity bumps with excellent coplanarity for enhanced reliability. Part of our Panel Level... | |
| Product Overview Systek™ SCP 100 high-speed copper pillar electroplating process provides manufacturers with excellent uniformity, coplanarity and precision. This helps them meet the requirements of next-generation high-performance computing and Artificial... | |
| Product Overview The ENVISION polymer-based system is unlike any other direct metallization process on the market today. It delivers increased board capacity along with significantly enhanced performance. | |
| Product Overview The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask, dry film, and liquid photoresist adhesion on copper. By eliminating pumice and brush scrubbing, MultiPrep 200... | |
| Product Overview The Systek™ VTP 100 acid copper plating system offers unmatched precision for Redistribution Layer (RDL) plating and via filling across a wide range of line, space, and via... | |
| Product Overview UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed for potting and encapsulation of electronics. Once cured, it has a dark blue finish and is soft... | |
| Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide... | |
| Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performan ce encapsulation and potting compound, offering a high level of protection in various operating environments while... | |
| Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This versatile resin offers high-performance protection against environmental factors, making it suitable for a wide... | |
| Product Overview UR5634 Optically Clear Polyurethane Light-Emitting Diode (LED) Potting Compound is a two-part, semi-rigid polyurethane resin. It is formulated with a carefully selected blend of components specifically to be... | |
| Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as the next generation of automotive electronics. It exhibits excellent chemical... | |
| Product Overview UVCL Ultraviolet (UV) cure conformal coating is a single-part solution that cures in seconds when exposed to the correct dose of UV light. It is specifically designed to... |