MacDermid Alpha Electronics Solutions Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
| Product Name | Notes |
|---|---|
| A one component, heat curable material to be dispensed on the corners of the BGA. The cured edgebond will help to strengthen the soldered assembled components. Product Overview ALPHA HiTech... | |
| A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability. Product Overview... | |
| A one-component capillary underfill for protecting assembled chip packages on printed circuit boards. Its high Tg, low CTE properties protects the solder joints from mechanical stresses. Product Overview ALPHA HiTech... | |
| A one-component, low temp thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled on printed circuit boards. Product Overview ALPHA HiTech CU13-3150... | |
| A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates. Product Overview Adhesion between the innerlayer copper circuits... | |
| ALPHA HiTech AD13-9521B is a one-component low temperature cure epoxy system. It is suitable for bonding heat sensitive devices. Product Overview ALPHA HiTech AD13-9521B is specially designed for use in... | |
| ALPHA HiTech AD13-9620B is a one-component, low temperature cure epoxy system. It is developed for the bonding of heat sensitive devices. Product Overview ALPHA HiTech AD13-9620B is engineered for use... | |
| ALPHA HiTech AD13-9692B is a one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices and is specially designed for camera module application. Product Overview ALPHA... | |
| ALPHA HiTech AD13-9910B is a one-component, ultra-low temperature cure epoxy system that can be cured at temperatures as low as 60°C. Product Overview ALPHA HiTech AD13-9910B is a one-component, ultra-low... | |
| ALPHA HiTech AD43-9600W is a one-component, low temperature cure epoxy system. It is specially designed to bond the lens onto a PCB bar for BLU (Back Light Unit) application. Product... | |
| ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices. Product... | |
| ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages on printed circuit boards. Product Overview ALPHA HiTech CU31-2030's low viscosity characteristic enables... | |
| ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow... | |
| ALPHA HiTech EN21-4210F is a one-component epoxy system designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. Product Overview ALPHA HiTech EN21-4210F has a... | |
| ALPHA HiTech EN31-4007B is a one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. Product Overview ALPHA HiTech EN31-4007B... | |
| ALPHA HiTech SM42-120P is a one component, fast curable surface mount adhesive, specially designed for screen printing. Product Overview ALPHA HiTech SM42-120P is applicable to both screen printing and dispensing... | |
| ALPHA HiTech SM42-1311 is a one component, fast curable surface mount adhesive designed for dispensing applications. Product Overview ALPHA HiTech SM42-1311 is ideal for high-speed dispensing processes given its non-sagging... | |
| ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each... | |
| ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend,... | |
| ALPHA HiTech UP44-5566T is a one-component UV cure system. It is suitable for fast curing and bonding in various applications such as coating and fixing of components. Product Overview ALPHA... | |
| ALPHA HT-130DHF-3 Adhesive is a one component, fast curable surface mount adhesive designed for both dispensing & printing applications. Product Overview ALPHA HT-130DHF-3 Adhesive is the leading surface mount adhesive... | |
| Frameless Stencil Foils Taking "Frameless" Stencil Technology to a New Level. Product Overview ALPHA Tetrabond is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the... | |
| Non-conductive and Electrically Insulating Adhesive Product Overview STAYCHIP F614-2 possesses the ability to attach a metal can or lid onto the package. STAYCHIP F614-2 was specifically developed for superior adhesion... | |
| Non-conductive and Electrically Insulating Adhesive Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high reliability semiconductor packages/electronic assemblies and... | |
| NOVAFAB VIAFILL AU is designed for low aspect ratio vias seen in Micro-LED manufacturing using a conformal seed. Seem voids are eliminated, and smooth surface roughness is achieved. NOVAFAB VIAFILL... | |
| Product Description APL Acrylic Protective Laquer is a flexible, fast drying acrylic conformal coating used for the protection of electronic circuitry. It has been formulated for professional use only and... | |
| Product Description DCB SCC3 Black conformal coating is a specialist modified alkyd coating which has been specifically designed to meet the highest defence standards in both Europe and the United... | |
| Product Description Electrolube LTC low temperature conformal coating is a modified synthetic rubber, designed specifically for the protection of high-performance electronic circuitry. LTC is fast-drying, tough and highly flexible. Due... | |
| Product Description ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold... | |
| Product Description ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It’s a very low viscosity resin system ideal for... | |
| Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke... | |
| Product Description ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It’s a good all round resin offering a cost... | |
| Product Description ER2218 very low viscosity, flame retardant epoxy which has been formulated for use as a potting compound / encapsulation resin. Boasting excellent thermal stability ER2218 has been specifically... | |
| Product Description ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent... | |
| Product Description ER2223 highly chemical resistant epoxy potting compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It has excellent chemical... | |
| Product Description ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components. The resin has good... | |
| Product Description ER6007 is a two-part modified silicone potting compound / encapsulating resin designed for the protection of electronic devices or components. It has been formulated as a soft silicone... | |
| Product Description FPC fluorinated polymer conformal coating is a specialist ultra-thin coating. It repels hydrocarbon and silicone oils as well as synthetic fluids and aqueous solutions due to its very... | |
| Product Description HFS High Performance Fluorinated Solvent is a non-flammable, fluorinated solvent designed for use with Electrolube FPC, Fluorinated Polymer Coating. HFS is used to dilute FPC in order to... | |
| Product Description HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between... | |
| Product Description HTS Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive interface material which will operate over a wide... | |
| Product Description PUC polyurethane conformal coating is a clear amber modified polyurethane specifically designed for the protection of electronic circuitry. It is a toughand abrasive resistant coating which has excellent... | |
| Product Description RRS cured resin remover solvent is a special blend of solvents designed to swell, soften and in some cases dissolve cured coatings and resins, including epoxy and polyurethane... | |
| Product Description SC4004 is a thixotropic silicone potting compound which has been developed for the Indian electronics market. Due to its thixotropic nature it has good flow characteristics to aid... | |
| Product Description SC4010 is a very low viscosity silicone potting and encapsulation compound for the protection of electronic components. Please note: This product has been developed for a specific territory... | |
| Product Description SCPH Silver Conductive Adhesive has been designed for use during the manufacture of display modules for mobile/smart phones, tablets and many other electronic products. It exhibits excellent electrical... | |
| Product Description TCOR RTV Thermally Conductive Oxime is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of... | |
| Product Description UR5041 water resistant polyurethane potting compound is a two-part black encapsulation and potting compound formulated to perform to the highest levels. This resin system provides exceptional resistance to... | |
| Product Description UR5044 flame retardant polyurethane resin is a UL94 approved two part system has been developed for potting and encapsulation of electronics. Once cured it has a dark blue... | |
| Product Description UR5048 soft / digoutable polyurethane potting compound is a flexible encapsulation resin with a soft finish. It’s soft ‘digoutable’ properties making it a good choice for potting units... | |
| Product Description UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide... | |
| Product Description UR5118 highly water resistant, RF polyurethane resin has been developed as an ultra high performance encapsulation and potting compound offering a high level of protection in a range... | |
| Product Description UR5528 chemically resistant polyurethane resin is a two part potting and encapsulation compound with excellent chemical resistance suitable for a wide variety of applications. Its excellent water resistance... | |
| Product Description UR5547 general purpose electrical potting compound is a black polyurethane resin ideally suited to electronics with small or delicate components. The cured resin is semi-rigid, exhibiting very little... | |
| Product Description UR5604 general purpose polyurethane potting compound is a two part, potting and encapsulation resin. It’s a good all round resin suitable for a huge range of electronic applications... | |
| Product Description UR5608 hard polyurethane potting compound is a tough resin ideal for applications where thermal shock or temperature cycling is present. It’s a good all round resin with good... | |
| Product Description UR5645 high performance polyurethane resin has been specially developed for the encapsulation and potting of electronics such as the next generation of automotive electronics. It exhibits excellent chemical... | |
| Product Description UVCL UV cure conformal coating is a single-part coating which cures within seconds of exposure to the correct dose of UV light. It has been specifically designed to... | |
| Silver-filled Electrically Conductive Film Product Overview STAYSTIK 501 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 501 adhesive film can be used... | |
| Silver-filled Electrically Conductive Film Product Overview STAYSTIK 571 is designed for use in a variety of electronic applications. STAYSTIK 571 exhibits excellent bonding at low process temperatures and has an... | |
| Silver-filled Electrically Conductive Film Product Overview STAYSTIK 581 is designed for use in a variety of electronic applications, and exhibits excellent bonding properties. STAYSTIK 581 film can be used for... | |
| Silver-filled Electrically Conductive Film Product Overview STAYSTIK 591 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process... | |
| Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 101 is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 101 paste adhesive can be used for die attach... | |
| Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 171 thermoplastic adhesive silver filled paste is designed for use in a variety of electronic applications. STAYSTIK 171 is characterized by excellent bonding... | |
| Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 181 thermoplastic silver filled paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK... | |
| Silver-filled Electrically Conductive Paste Product Overview STAYSTIK 191 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 191 is characterized by its excellent bonding at... | |
| Solder preform washers are used in PCB assembly, the integration of PCBs into higher level assemblies, as well as the primary solder material for the construction of numerous electronic devices. | |
| Solvent-based Polymer Specially Developed for Temporary Bonding Applications Product Overview STAYSTIK 336T thermoplastic adhesive paste is a low modulus polymer specially developed for temporary bonding applications most typically associated with... | |
| The ATROX brand of conductive die attach films are designed to provide you with superior performance for today's stringent reliability requirements. Conductive Die Attach Products ATROX conductive die attach products... | |
| The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. ATROX conductive die attach products offer a complete solution... | |
| The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. Conductive Die Attach Products ATROX conductive die attach products... | |
| The Systek™ THF Series high performance copper plating technology that bridges and fills through holes. Product Overview Manufacturers of advanced printed circuit boards struggle to overcome the challenge of core... | |
| Via filling solutions for any metallization challenge. Product Overview The MacuSpec™ VF, AVF, and VF-TH series are production-proven processes that are specifically engineered to fill blind micro vias. The VF-TH... |