MacDermid Alpha Electronics Solutions Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| A metal oxide-filled silicone oil offers efficient thermal conductivity and operates effectively across a wide temperature range. Product Overview HTS Silicone Heat Transfer Compound is a metal oxide-filled silicone oil,... | |
| A silver sinter paste, providing high thermal and electrical conductivity. Product Overview The ALPHA® Argomax® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal... | |
| A single-component epoxy cures at low temperatures, offering water resistance and bonding FPCB to various plastic materials. Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics... | |
| A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications. Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal... | |
| A thermoplastic adhesive film that bonds at low temps with a low modulus (60,000 psi). Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications,... | |
| A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow... | |
| A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally... | |
| A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed... | |
| Aluminum nitride-filled adhesive film for electronics bonds well at low temps, handles different TCEs, and is reworkable. Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of... | |
| An ultra-low stress Hybrid Silver sintered die attach paste with high thermal conductivity set for high power exposed pad semiconductors. Product Overview ATROX® 800HT7A: High-performance conductive paste formulated for... | |
| Conductive die attach pastes offer excellent performance to meet today's high reliability standards. Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed... | |
| Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance. Product Overview SC4004 is a thixotropic silicone potting compound developed for the... | |
| Flame-retardant polyurethane UL94-approved resin. Soft enough for dig-out work, it remains flexible over a wide temperature range. Product Overview UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed... | |
| Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general... | |
| Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin... | |
| Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and... | |
| High-reliability, two-component polyurethane conformal coating for demanding applications. Product Overview Electrolube® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced... | |
| Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating... | |
| Low-etch alternative oxide provides low surface profiles and reliable adhesion for high frequency applications. Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. | |
| Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out. | |
| Next-generation, high reliability, reworkable edgebond. Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Tg and low CTE, purposefully engineered for high-temperature automotive applications that require exceptional board-level... | |
| Offers the best thermal conductivity performance, combined with the advantage of using a non-silicone base oil. Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful... | |
| One-component capillary underfill with high Tg and low CTE for reliable protection of assembled chip packages on PCBs. Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to... | |
| PFAS-free, conductive die attach products deliver a cost-effective, high-performance solution, leading the way in advanced materials. Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages... | |
| Provides the ultimate in thermal conductivity with a very wide temperature range obtained by using silicone base oils. Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus"... | |
| Silver-filled conductive film bonds well at low temps (60,000 psi modulus), handles different CTEs, and is easily reworked. Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety... | |
| The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. Product Overview ATROX conductive die attach products provide a... | |
| This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it... | |
| Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications. Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility... |