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MacDermid Alpha Electronics Solutions Datasheets for Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more

Product Name Notes
Product Description Electrolubes ER6003 epoxy potting compound has been specially developed for the LED Industry in India to protect the drivers from the varying environments found on the Indian subcontinent.
Product Description ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes...
Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke...
Product Description ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It’s a good all round resin offering a cost...
Product Description ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of...
Product Description ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent...
Product Description ER6002LV is a thermally conductive epoxy potting and encapsulation resin designed primarily for use in LED Driver units. ER6002LV has good flow characteristics which allows potting of small...
Product Description ER6007 is a two-part modified silicone potting compound / encapsulating resin designed for the protection of electronic devices or components. It has been formulated as a soft silicone...
Product Description ER6010 X-Ray Shielding Potting Compound is a specialist epoxy resin which has been formulated for applications which require critical protection of the circuit design such as medical or...
Product Description GF400 thermal gap filler is a two part, liquid silicone based thermally conductive material which cures at room temperature or can be accelerated using heat. It has exceptional...
Product Description HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between...
Product Description HTCP Non-Silicone Thermal Interface Material is a ‘Plus’ version of Electrolube’s successful HTC which provides the ultimate in thermal conductivity together with the advantage of using non-silicone base...
Product Description HTCPX Heat Transfer Compound is a variation of the successful HTCX ‘Xtra’ and HTCP ‘Plus’ thermal management materials. It has been designed primarily for use where there is...
Product Description HTS Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive interface material which will operate over a wide...
Product Description HTSP Silicone Heat Transfer Compound Plus is a modified ‘Plus’ version of Electrolube’s successful HTS which provides the ultimate in thermal conductivity together with the very wide temperature...
Product Description SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. It has been primarily developed for the protection of LED Drivers but its...
Product Description SC4004 is a thixotropic silicone potting compound which has been developed for the Indian electronics market. Due to its thixotropic nature it has good flow characteristics to aid...
Product Description SC4010 is a very low viscosity silicone potting and encapsulation compound for the protection of electronic components. Please note: This product has been developed for a specific territory...
Product Description TCOR RTV Thermally Conductive Oxime is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of...
Product Description UR5044 flame retardant polyurethane resin is a UL94 approved two part system has been developed for potting and encapsulation of electronics. Once cured it has a dark blue...
Product Description UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide...
Product Description UR5547 general purpose electrical potting compound is a black polyurethane resin ideally suited to electronics with small or delicate components. The cured resin is semi-rigid, exhibiting very little...
Product Description UR5608 hard polyurethane potting compound is a tough resin ideal for applications where thermal shock or temperature cycling is present. It’s a good all round resin with good...