MacDermid Alpha Electronics Solutions Datasheets for Leveling and Filling Compounds

Leveling and filling compounds are used to level surfaces, fill cavities, and shim or set machinery. They often have filling and sealing properties.
Leveling and Filling Compounds: Learn more

Product Name Notes
Heat Curable Cornerfill Epoxy -- ALPHA® HiTech CF31-4010 ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable cornerfill designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.
Underfill Epoxy for protecting assembled chip packages -- ALPHA® HiTech CU21-3240 ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with...
Reworkable Underfill Epoxy for protecting assembled chip packages -- ALPHA® HiTech CU31-2030 ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
Capillary Underfill -- ALPHA® HiTech™ CU11-3127 ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU11-3127...
Cornerfill Epoxy System -- ALPHA® HiTech™ CF12-4485B ALPHA® HiTech™ CF12-4485B is a one-component, low temperature cure, cornerfill epoxy system. It is designed to provide protection to the solder joint during mechanical stress.
Capillary Underfill -- ALPHA® HiTech™ CU13-3150 ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill. It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed...
Capillary Underfill -- ALPHA® HiTech™ CU31-3100 ALPHA® HiTech™ CU31-3100 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA®
Capillary Underfill -- ALPHA® HiTech™ CU32-380 ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.