MacDermid Alpha Electronics Solutions Datasheets for Leveling and Filling Compounds
Leveling and filling compounds are used to level surfaces, fill cavities, and shim or set machinery. They often have filling and sealing properties.
Leveling and Filling Compounds: Learn more
| Product Name | Notes |
|---|---|
| Product Overview ALPHA Exactalloy Washers in tape and reel packaging support Surace Mount Technology (SMT) soldering operations for through hole components. These washers feature integrated flux, enabling a secondary paste-free... | |
| Product Overview ALPHA HiTech CU11-3127 is a high filler content product designed to provide enhanced mechanical strength for Chip Scale Packaging (CSP) and Flip Chip packages. With its unique low-viscosity... | |
| Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards. It features a high Glass Transition Temperature (Tg) and low... | |
| Product Overview ALPHA HiTech CU31-3300 is a one-component reworkable underfill that balances a moderately high Glass Transition Temperature (111 °C) with excellent reworkability to help manufacturers protect assemblies while maintaining... | |
| Product Overview Electrolube® LGF200 is a thermally conductive, silicone-based liquid gap filler featuring a two-component, cure-in-place formulation for easy processing. With a thermal conductivity of 2 W/m-K, it delivers excellent... | |
| Product Overview Electrolube® LGF400 is a thermal interface material engineered for easy processing. This silicone-based liquid gap filler features a two-component, cure-in-place formulation. With a high thermal conductivity of 4... | |
| Product Overview NOVAFAB VIA FILL AU is a mild alkaline, non-cyanide gold electroplating process that produces deposits of 99.9% purity. NOVAFAB VIA FILL AU is specifically designed to fill vias... |