MacDermid Alpha Electronics Solutions Datasheets for Leveling and Filling Compounds
Leveling and filling compounds are used to level surfaces, fill cavities, and shim or set machinery. They often have filling and sealing properties.
Leveling and Filling Compounds: Learn more
| Product Name | Notes |
|---|---|
| A one-component capillary underfill protects chip packages on PCBs, with high Tg and low CTE to shield solder joints from stress. Product Overview ALPHA HiTech CU11-3127 is a high filler... | |
| Industry-leading cyanide-, arsenic-, thallium- and lead-free gold process capable of via filling with low surface roughness. Product Overview NOVAFAB VIA FILL AU is a mild alkaline, non-cyanide gold electroplating process... | |
| One-component capillary underfill with high Tg and low CTE for reliable protection of assembled chip packages on PCBs. Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to... | |
| Used in PCB assembly and integration into higher-level assemblies, serving as the primary solder for a range of electronic devices. Product Overview ALPHA Exactalloy Washers in tape and reel packaging... |