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MacDermid Alpha Electronics Solutions Datasheets for Leveling and Filling Compounds

Leveling and filling compounds are used to level surfaces, fill cavities, and shim or set machinery. They often have filling and sealing properties.
Leveling and Filling Compounds: Learn more

Product Name Notes
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability. Product Overview...
A one-component capillary underfill for protecting assembled chip packages on printed circuit boards. Its high Tg, low CTE properties protects the solder joints from mechanical stresses. Product Overview ALPHA HiTech...
A one-component, low temp thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled on printed circuit boards. Product Overview ALPHA HiTech CU13-3150...
ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages on printed circuit boards. Product Overview ALPHA HiTech CU31-2030's low viscosity characteristic enables...
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow...
ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each...
ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend,...
NOVAFAB VIAFILL AU is designed for low aspect ratio vias seen in Micro-LED manufacturing using a conformal seed. Seem voids are eliminated, and smooth surface roughness is achieved. NOVAFAB VIAFILL...
Solder preform washers are used in PCB assembly, the integration of PCBs into higher level assemblies, as well as the primary solder material for the construction of numerous electronic devices.
The Systek™ THF Series high performance copper plating technology that bridges and fills through holes. Product Overview Manufacturers of advanced printed circuit boards struggle to overcome the challenge of core...
Via filling solutions for any metallization challenge. Product Overview The MacuSpec™ VF, AVF, and VF-TH series are production-proven processes that are specifically engineered to fill blind micro vias. The VF-TH...