MacDermid Alpha Electronics Solutions Datasheets for Hot Melt Adhesives
Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly.
Hot Melt Adhesives: Learn more
| Product Name | Notes |
|---|---|
| Product Overview A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed for temporary bonding applications, most typically associated with... | |
| Product Overview STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000... | |
| Product Overview STAYSTIK 482 Thermoplastic Adhesive Film is designed for a range of electronic applications and delivers excellent bonding performance. Suitable for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety of electronic applications. It provides excellent bonding at low process temperatures and features a very low elastic modulus... | |
| Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring resistance to high-temperature excursions. It is suitable for die attach in solder-sealed, hermetic packages and delivers low Residual... | |
| Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of electronic applications, offering excellent bonding at low process temperatures and a very low elastic modulus of 60,000... |