MacDermid Alpha Electronics Solutions Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with...
ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow...
ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend,...
ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU11-3127...
ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill. It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed...
ALPHA® HiTech™ CU31-3100 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA®
ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
ALPHA® HiTech™ EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. These encapsulants prevent chip...
ALPHA® HiTech™ EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products...