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MacDermid Alpha Electronics Solutions Datasheets for Solder

Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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Product Name Notes
A low temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance versus existing low temperature alloys in the market. Product Overview ALPHA HRL3 Solid Solder is designed...
ALPHA Energized Plus is the most effective RA MIL-SPEC rosin cored solder wire yet developed for hand soldering. Product Overview ALPHA Energized Plus is suitable for use in any electronic...
ALPHA HiFlo SMG Sn63Pb37 solder is alloyed using our proprietary Vaculoy process utilizing materials of the lowest impurity levels available. Product Overview ALPHA HiFlo SMG Sn63Pb37 solder is alloyed using...
ALPHA HRL Series Lead-Free Solder Spheres are patented low temperature melting point lead free alloys for market leading drop-shock and thermal cycling resistance. The spheres are designed for BGA, CSP...
ALPHA Lead Free Solder Spheres are designed for BGA, CSP, and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters. Product Overview ALPHA Tin Silver...
ALPHA Leaded Solder Spheres are designed for BGA, CSP and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters. Product Overview ALPHA Leaded Solder Spheres...
ALPHA MAXREL Series Lead-Free Solder Spheres are patented high silver containing lead-free alloys for market leading thermal cycling reliability and drop-shock resistance. The spheres are designed for BGA, CSP and...
ALPHA SACX0307 Lead-Free Solder Spheres are patented low silver lead-free alloys for market leading drop-shock resistance. The spheres are designed for BGA, CSP, and wafer bumping applications. ALPHA Solder Spheres...
ALPHA TrueHeight Preforms are solder preforms designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance. ALPHA TrueHeight Preforms have the advantage of...
By providing a consistent and precise solder volume, the ALPHA Exactalloy Tape and Reel preforms improve the reliability and performance of components used in PCB assembly. Product Overview ALPHA Exactalloy...
Electrically Conductive Adhesive Product Overview POLYSOLDER SE3001 is cured by thermal processing in IR, convection, conduction or vapor phase equipment. A combination of short cure time, low temperature cure and...
ENTEK® PLUS HT organic solderability preservative (OSP) is the industry’s most widely used and trusted OSP on the market today. Product Overview The ENTEK PLUS HT process provides a...
EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed...
High fluidity SnPb37 bar solder with low drossing characteristics Product Overview ALPHA HiFlo Sn63Pb37 solder is manufactured using highest purity of metals through a process using our proprietary viscosity and...
High lead solder preforms with 4N alloy purity for die attach Product Overview ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, PbSb alloys. In...
High Silver, Lead-Free Alloys for Wave and Selective Soldering Product Overview ALPHA SAC305, SAC387 and SAC405 and their replenishment alloys SAC300, SAC350, SAC380 and SAC400 are lead-free alloys suitable for...
K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot.
Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely...
Kester 268 Flux-Cored Wire is a zero-halogen wire optimized for robotic soldering applications. With its unique chemistry system, 268 provides consistent workability performance for both robotic and manual soldering in...
Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the...
Kester 278 Flux-Cored Wire with Innolot Alloy is a halogen-free wire optimized for high performance applications, such as under-the-hood automotive. 278, with its fast wetting and low spattering, performs admirably...
Kester 331 Organic Flux is a water-soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more...
Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. 44 has virtually dominated the field of activated rosin core solders for well over four...
Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. 48 has performance characteristics far exceeding standard RA fluxes.
Kester Acid-Cored Solder Wire is a highly active, inorganic acid type of flux developed for general-purpose soldering applications where a flux-cored solder wire is desirable. Product Overview Rapid soldering can...
Kester HM531 is a halide-free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hours of stable stencil...
Kester Indium solder thermal interface material (TIM) provides a non-adhesive or non-organic interconnect between the die level interface and the heat spreader to enable uniform thermal dissipation. Product Overview Thermal...
Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR...
Kester NP545 is a zero-halogen, lead-free, no-clean solder paste formula designed for consistency and repeatability. NP545 is extremely stable and has an unrefrigerated shelf life of 12 months with no...
Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of...
Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting characteristics in a wide...
Lead-free, high temperature, high reliability alloys targeting Power Electronics applications Product Overview ALPHA Powerbond Solder Preforms are a family of lead-free, high temperature, high reliability alloys with Antimony content ranging...
Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic...
Next-generation high reliability, no clean solder paste Product Overview ALPHA CVP-390V Innolot MXE Solder Paste is a lead-free, Zero-Halogen, no clean solder paste that is rigorously engineered to deliver advanced...
NP505-LT is a no-clean, Pb-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the...
NP510-LT HRL1 low temperature chemistry is designed to be applicable with MacDermid Alpha's low temperature HRL1 alloy. NP510-LT HRL1 enables peak reflow of 190 ˚C while delivering comparable performance to...
NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even...
Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications. Product Overview ALPHA industrial solder preforms come in various shapes,...
Pure low dross high fluidity solder alloy Product Overview ALPHA Vaculoy is manufactured using high purity raw materials and the alloy is conditioned using our Vaculoy viscosity and dross lowering...
Solder Preforms with Embedded Bond Line Control ALPHA TrueHeight Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability.
Solder preforms with Innolot Alloy Product Overview The Innolot alloy is a SAC based alloy developed with the automotive industry for use in environments exposed to high temperature and vibration.
WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability...