MacDermid Alpha Electronics Solutions Datasheets for Solder

Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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Product Name Notes
Non-Eutectic & Low Temperature Solder Paste for Assemblies with Temperature Sensitive Substrates, Components & High Warpage Chips ALPHA® OM-550 is a new low temperature chemistry paired with the ALPHA® HRL1...
ALPHA® OM-347 is designed as a cleanable, no-clean material. It can print and reflow with Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications. ALPHA®
ALPHA® PowerBond® 2050 preforms expand upon industry standard 95Sn5Sb alloy to provide improved wetting characteristics. The superior soldering characteristics combined with good thermal conductivity make it a viable option for...
ALPHA® PowerBond® 2100 preforms provide highest creep resistance and tensile strength for high operating temperature applications. Alloy material properties result in superior thermal fatigue performance than traditional SAC and SnAg...
ALPHA® PowerBond® 2110 preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for the power semiconductor devices operating at high junction temperatures (150-175°C). The alloy composition...
ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste designed for applications where ultra low voiding performance, excellent ICT pin testing first pass yield, and the ability to pass...
ALPHA® OM-353 is designed to meet market segments requiring ultra-fine feature applications. It has been tested to give excellent printing performance down to 180μm pad size. ALPHA® OM-353is a...
ALPHA® OM-353 is designed to meet market segments requiring ultra-fine feature applications. It has been tested to give excellent printing performance down to 180μm pad size. Type 4 &
ALPHA® OM-355 is a lead-free, zero-halogen, no-clean solder paste designed specifically for vacuum soldering applications. In-line vacuum soldering capabilities are becoming more common as power density increases on Ball...
ALPHA® OM-358 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components. Alpha OM-358 achieves IPC7095...
ALPHA® OM-535 was developed with the aim to improve the solder joint performance, both for drop shock and thermal cycling, versus the existing low temperature products on the market.
ALPHA® SAC305 Ultrafine Cored Wire is developed for fine pitch component attachment and manual rework by robotic soldering or manual soldering. It is available with different diameter size and...
ALPHA® TrueHeight® Preforms have the advantage of flexible spacer positioning. Strategic locations can be chosen to ensure consistent bondline thickness. The architecture of the design not only addresses...
Preforms in Tape and Reel: ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The...
Solder Ribbon: Alpha’s high purity (99.99% and 99.9%) solder ribbon product offering provides the flexibility to integrate custom solder preforms into your product with your specialized material cutting and handling...
ALPHA CL-78 is a no-clean, dispensable solder paste compatible with the Alpha UP-78 series of modern, no-clean pastes. It is designed for high speed automated or manual dispensing through a...
Alpha has recently introduced its no-silver cored solder wire solution for highest wetting speed performance. The ALPHA® SnCX™ Plus 07 Ag-Free Cored Solder Wire is a fast-wetting solution with clear...
ALPHA JP510 solder paste is a lead-free, Zero-halogen no-clean solder paste designed for use in Jet Printers. The paste has clear, colorless flux residue, which is ideal for assemblies with...
ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as...
ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-PT's broad processing window is designed to minimize transition concerns from tin/lead to lead...
ALPHA PV-61 is a flux designed to provide the attributes of excellent solderability and high reliability for solar applications in both Lead-Free and tin/lead processes. Additionally, it provides outstanding solder...
ALPHA RS7MI has an activated rosin flux core. The halide activator system provides extremely good tarnish removing properties. RS7MI has good soldering performance even on very difficult soldering surfaces. ALPHA...
ALPHA® AccuFlux™ BTC-578 Preform System is a proven method for solving voiding issues under bottom terminated components (BTC). As power requirements for BTCs are increasing, component manufacturers are designing device...
ALPHA® CVP-360 is a lead-free, halogen free no-clean solder paste designed for a broad range of applications. ALPHA® CVP-360 is designed to enable the use of ALPHA SACX® alloys, while...
ALPHA® CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This...
ALPHA® CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA® CVP-520 has a melting point below 140°C, and has been successfully used with...
ALPHA® Exactalloy® Preforms are placed directly into the solder paste prior to assembly reflow. ALPHA® Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving your solder...
ALPHA® has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies. The range includes no-clean, water-soluble and activated rosin...
ALPHA® JP-500 is a lead-free, no-clean solder paste designed for use in Jet Printers. ALPHA JP-500 features a rheology capable of standard dispensing or jetting. ALPHA JP-500 is formulated to...
ALPHA® LUMET® FC39 is a lead-free, no-clean solder paste designed for fine feature applications including Chip Scale, Flip-Chip LED package assembly and wafer bumping of LED wafers. ALPHA® LUMET® FC39...
ALPHA® LUMET® HTP82 is a lead free, halide free,water soluble solder paste based on tin antimony alloy compositions. This paste provides ideal combination of printability and reflow window, with excellent...
ALPHA® LUMET® P30 is a lead-free, Zero-halogen no-clean solder paste designed for applications including LED assembly. ALPHA® LUMET® P30 is designed to provide low flux residue and lower voiding performance...
ALPHA® LUMET® P82 is a lead free, halide free water soluble solder paste that provides ideal combination of printability and reflow window, with excellent water-based cleanability. It is an excellent...
ALPHA® OM-338-CSP is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead...
ALPHA® OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead...
ALPHA® OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-340'S broad processing window is designed to minimize transition concerns from tin/lead to lead...
ALPHA® OM-5300 no clean solder paste was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. Like all ALPHA solder...
ALPHA® SnCX Plus™ 07 is No-silver lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other low silver SAC alloys in wave solder, selective soldering, lead tinning...
ALPHA® WS-809 is a SnPb, water-soluble which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required. ALPHA® WS-809 is formulated for both standard...
ALPHA® WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead...
ALPHA® WS-852 is a SnBiAg low temperature, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required. The low temperature, lead-free...
Alpha's ALPHA® OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux vehicle is rheologically formulated to provide excellent repeatability and resistance to environmental...
ALPHA® JP-501 is a lead-free, no-clean solder paste designed for use in Jet Printers. ALPHA JP-501 features a rheology capable of standard dispensing or jetting. The low temperature, lead-free...
ALPHA® LUMET® HTP-61 Solder Paste with Sn10Sb alloy, is a high melting point off-eutectic solder (with solidus of 245°C and liquidus of ~251°C) designed for SMT and Die Attach...
ALPHA® LUMET® JP510 is a lead-free, Zero-halogen no-clean solder paste designed for use in Jet Printers. The paste has clear, colorless flux residue, which is ideal for LED package-on-board...
ALPHA® LUMET® P39 is a lead-free, Zero-halogen no-clean solder paste designed for applications including LED assembly, where residue with excellent pin testing property and ability to pass JIS...
ALPHA® LUMET® P53 is a low temperature solder paste technology designed to enable a LED package-on-flex reflow application, especially for PET flexible substrates. ALPHA® LUMET® P53...
ALPHA® OM-350 is a lead-free, no-clean solder paste suitable for fine feature printing and reflow using most demanding soak reflow profiles in air and nitrogen atmospheres. The outstanding reflow...
ALPHA® OM-363 is a lead-free, halogen-free, no-clean solder paste designed for minimizing BGA non-wet opens and head in pillow defects. This paste chemistry continues Alpha’s tradition of being an...
ALPHA® OM-6106, is a low residue, no-clean solder paste designed to maximize SMT line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and...
ALPHA® Sn42 Bi57.6 Ag.4 Solid Solder Wire is primarily used for rework operations and touch up soldering of SnBiAg based electronics assemblies.
ALPHA® Vaculoy SACX Plus® 0107 is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX Plus® 0100...
ALPHA® WSX-FD water soluble flux is engineered for use in the placement and reflow of high lead, eutectic gold-tin and lead free solders for direct chip attach. It is...
ALPHA® Telecore XL-825 is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications. It...
EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed...
For soldering of Lead-Free assemblies, there are ALPHA cored wires available in the following alloy specifications: SACX, SAC305, SAC405 and Sn96.5/Ag3.5
Innovative solder paste enabling next generation high density assembly designs. ALPHA OM-372 provides best-in-class electrochemical reliability on fine pitch, low standoff components, requiring excellent stencil transfer efficiency and high electrical...
interconnects. ALPHA® LUMET® P23 is designed to enable the use of ALPHA® SAC305 and SnCu0.7 alloys with Type 6 solder powder. ALPHA® LUMET® P23 flux system has long work life...
K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot.
Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely...
Kester 268 Flux-Cored Wire is a zero-halogen wire optimized for robotic soldering applications. With its unique chemistry system, 268 provides consistent workability performance for both robotic and manual soldering in...
Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the...
Kester 278 Flux-Cored Wire with Innolot Alloy is a halogen-free wire optimized for high performance applications, such as under-the-hood automotive. 278, with its fast wetting and low spattering, performs admirably...
Kester 331 Organic Flux is a water-soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more...
Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. 44 has virtually dominated the field of activated rosin core solders for well over four...
Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. 48 has performance characteristics far exceeding standard RA fluxes.
Kester brings over 50 years of experience in preform manufacturing and can provide preforms in a variety of shapes, sizes, and flux types. Preforms can provide a precise volume of...
Kester HM531 is a halide-free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hours of stable stencil...
Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR...
Kester NP545 is a zero-halogen, lead-free, no-clean solder paste formula designed for consistency and repeatability. NP545 is extremely stable and has an unrefrigerated shelf life of 12 months with no...
Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of...
Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting characteristics in a wide...
Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic...
NP505-LT is a no-clean, Pb-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the...
NP510-LT HRL1 low temperature chemistry is designed to be applicable with MacDermid Alpha's low temperature HRL1 alloy. NP510-LT HRL1 enables peak reflow of 190 ┬░C while delivering comparable performance to...
NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even...
Part of the ALPHA® 7 Series Low Residue Fluxes, ALPHA® PV-71 was specifically designed so that minimal flux deposits inside tabbing and stringing equipment and spray nozzles, with practically...
Preform washers are used in PCB assembly, the integration of PCBs into higher level assemblies, as well as the primary solder material for the construction of numerous electronic and electrical...
The ALPHA PV-READY-Exactalloy family of resilient flux coated preforms for Photovoltaic (PV) applications provide a unique solution to the challenges of providing an exact volume of solder and flux for...
This NO-CLEAN flux is engineered for use as a dip flux for BGA packages. It delivers even, reproducible volumes of flux onto spheres that have been dipped into the flux.
To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per...
WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability...