MacDermid Alpha Electronics Solutions Datasheets for Solder

Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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Product Name Notes
Cored Solder Wire LEAD-FREE -- Alpha® FT 2002 Rosin Free Cored Wire LEAD-FREE For soldering of Lead-Free assemblies, there are ALPHA cored wires available in the following alloy specifications: SACX, SAC305, SAC405 and Sn96.5/Ag3.5 Alpha FT 2002 Rosin Free Fully...
Cored Wire LEAD-FREE -- Alpha® Pure Core Cored Wire LEAD-FREE For soldering of Lead-Free assemblies, there are ALPHA cored wires available in the following alloy specifications: SACX, SAC305, SAC405 and Sn96.5/Ag3.5 Alpha Pure Core Organic activated water...
Solder Paste -- ALPHA® OM-550 Non-Eutectic & Low Temperature Solder Paste for Assemblies with Temperature Sensitive Substrates, Components & High Warpage Chips ALPHA® OM-550 is a new low temperature chemistry paired with the ALPHA® HRL1...
Halide-Free, Water Soluble Flux Cored Solder -- Alpha® Aqualine 6000 ALPHA® Aqualine 6000 is a QPL-approved (Type WSF-0 polyglycol-free flux), halide-free, water soluble flux cored solder. Its post soldering residues are extremely water soluble and can be easily cleaned with...
Very Low Residue Flux Core Wire -- Alpha® Cleanline 7000 ALPHA® Cleanline 7000 is a very low residue flux core wire solder designed for no-clean hand soldering applications. The flux core provides sufficient activity to solder successfully to bare copper...
RA MIL-SPEC Rosin Core Solder -- Alpha® Energized Plus ALPHA® Energized-Plus is the most effective RA MIL-SPEC rosin core solder yet developed for hand soldering. Similar in design to Energized core solder, Energized-Plus is more active still. It meets...
Solder Paste -- ALPHA® OM 347
Solder Paste -- ALPHA® OM-347
ALPHA® OM-347 is designed as a cleanable, no-clean material. It can print and reflow with Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications. ALPHA®
Solder Preform -- ALPHA® PowerBond® 2050 ALPHA® PowerBond® 2050 preforms expand upon industry standard 95Sn5Sb alloy to provide improved wetting characteristics. The superior soldering characteristics combined with good thermal conductivity make it a viable option for...
Solder Preform -- ALPHA® PowerBond® 2100 ALPHA® PowerBond® 2100 preforms provide highest creep resistance and tensile strength for high operating temperature applications. Alloy material properties result in superior thermal fatigue performance than traditional SAC and SnAg...
Solder Preform -- ALPHA® PowerBond® 2110 ALPHA® PowerBond® 2110 preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for the power semiconductor devices operating at high junction temperatures (150-175°C). The alloy composition...
RMA Rosin Core Solder -- Alpha® Reliacore 15 ALPHA® Reliacore 15 is the most effective RMA rosin core solder yet developed for hand soldering. The unique and powerful activation system of this core solder makes the flux exceptionally...
Halogen Free and Halide Free Cored Solder Wire -- Alpha® Telecore HF-850 ALPHA® Telecore HF-850 is the fastest wetting and lowest spattering, Halogen Free and Halide Free cored wire offering from ALPHA®. It performs admirably when benchmarked against Halogen and Halide containing...
Cored Solder Wire -- Alpha® Telecore XL-825 ALPHA® Telecore XL-825 is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications. It offers...
Solder Paste -- ALPHA® OM-351 ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste designed for applications where ultra low voiding performance, excellent ICT pin testing first pass yield, and the ability to pass...
Solder Paste -- ALPHA® OM-353 ALPHA® OM-353 is designed to meet market segments requiring ultra-fine feature applications. It has been tested to give excellent printing performance down to 180μm pad size. ALPHA® OM-353is a...
Solder Paste -- ALPHA® OM-335 ALPHA® OM-353 is designed to meet market segments requiring ultra-fine feature applications. It has been tested to give excellent printing performance down to 180μm pad size. Type 4 &
Solder Paste -- ALPHA® OM-355 ALPHA® OM-355 is a lead-free, zero-halogen, no-clean solder paste designed specifically for vacuum soldering applications. In-line vacuum soldering capabilities are becoming more common as power density increases on Ball...
Solder Paste -- ALPHA® OM-358 ALPHA® OM-358 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components. Alpha OM-358 achieves IPC7095...
Solder Paste -- ALPHA® OM-535 ALPHA® OM-535 was developed with the aim to improve the solder joint performance, both for drop shock and thermal cycling, versus the existing low temperature products on the market.
Ultrafine Cored Solder Wire -- Alpha® SAC305 ALPHA® SAC305 Ultrafine Cored Wire is developed for fine pitch component attachment and manual rework by robotic soldering or manual soldering. It is available with different diameter size and...
ALPHA® TrueHeight® Preforms ALPHA® TrueHeight® Preforms have the advantage of flexible spacer positioning. Strategic locations can be chosen to ensure consistent bondline thickness. The architecture of the design not only addresses...
Solder Preforms in Tape and Reel Preforms in Tape and Reel: ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The...
Solder Ribbons
Solder-Copper Laminates
Solder Ribbon: Alpha’s high purity (99.99% and 99.9%) solder ribbon product offering provides the flexibility to integrate custom solder preforms into your product with your specialized material cutting and handling...
Solder Paste -- ALPHA® CL-78 ALPHA CL-78 is a no-clean, dispensable solder paste compatible with the Alpha UP-78 series of modern, no-clean pastes. It is designed for high speed automated or manual dispensing through a...
Ag-Free Cored Solder Wire -- ALPHA® SnCX™ Plus 07 Alpha has recently introduced its no-silver cored solder wire solution for highest wetting speed performance. The ALPHA® SnCX™ Plus 07 Ag-Free Cored Solder Wire is a fast-wetting solution with clear...
Solder Paste -- ALPHA® JP510 ALPHA JP510 solder paste is a lead-free, Zero-halogen no-clean solder paste designed for use in Jet Printers. The paste has clear, colorless flux residue, which is ideal for assemblies with...
Solder Paste -- ALPHA® OM-338-PT ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-PT's broad processing window is designed to minimize transition concerns from tin/lead to lead...
Photovoltaic Flux -- Alpha® PV 61 ALPHA PV-61 is a flux designed to provide the attributes of excellent solderability and high reliability for solar applications in both Lead-Free and tin/lead processes. Additionally, it provides outstanding solder...
Cored Solder Wire -- ALPHA® RS7MI ALPHA RS7MI has an activated rosin flux core. The halide activator system provides extremely good tarnish removing properties. RS7MI has good soldering performance even on very difficult soldering surfaces. ALPHA...
Wave Solder Bar -- ALPHA® Bar Vaculoy SACX0307 ALPHA Vaculoy SACX0307 is a patented (US Patent No 4,929,423) lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX0300 variant is...
Solder Preform -- ALPHA® AccuFlux™ BTC-578 ALPHA® AccuFlux™ BTC-578 Preform System is a proven method for solving voiding issues under bottom terminated components (BTC). As power requirements for BTCs are increasing, component manufacturers are designing device...
Solder Paste -- ALPHA® CVP-360 ALPHA® CVP-360 is a lead-free, halogen free no-clean solder paste designed for a broad range of applications. ALPHA® CVP-360 is designed to enable the use of ALPHA SACX® alloys, while...
Solder Paste -- ALPHA® CVP-390 ALPHA® CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This...
Solder Paste -- ALPHA® CVP-520 ALPHA® CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA® CVP-520 has a melting point below 140°C, and has been successfully used with...
Tape and Reel Solder Preform ALPHA® Exactalloy® Preforms are placed directly into the solder paste prior to assembly reflow. ALPHA® Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving your solder...
Rosin-Free Water Soluble Solder Wire -- ALPHA® AS2 ALPHA® has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies. The range includes no-clean, water-soluble and activated rosin...
Solder Paste -- ALPHA® JP-500 ALPHA® JP-500 is a lead-free, no-clean solder paste designed for use in Jet Printers. ALPHA JP-500 features a rheology capable of standard dispensing or jetting. ALPHA JP-500 is formulated to...
Solder Paste -- ALPHA® LUMET® FC39 ALPHA® LUMET® FC39 is a lead-free, no-clean solder paste designed for fine feature applications including Chip Scale, Flip-Chip LED package assembly and wafer bumping of LED wafers. ALPHA® LUMET® FC39...
Solder Paste -- ALPHA® LUMET® HTP82 ALPHA® LUMET® HTP82 is a lead free, halide free,water soluble solder paste based on tin antimony alloy compositions. This paste provides ideal combination of printability and reflow window, with excellent...
Solder Paste -- ALPHA® LUMET® P30 ALPHA® LUMET® P30 is a lead-free, Zero-halogen no-clean solder paste designed for applications including LED assembly. ALPHA® LUMET® P30 is designed to provide low flux residue and lower voiding performance...
Solder Paste -- ALPHA® LUMET® P82 ALPHA® LUMET® P82 is a lead free, halide free water soluble solder paste that provides ideal combination of printability and reflow window, with excellent water-based cleanability. It is an excellent...
Solder Paste -- ALPHA® OM-338-CSP ALPHA® OM-338-CSP is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead...
Solder Paste -- ALPHA® OM-338-T ALPHA® OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead...
Solder Paste -- ALPHA® OM-340 ALPHA® OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-340'S broad processing window is designed to minimize transition concerns from tin/lead to lead...
Solder Paste -- ALPHA® OM-5300 ALPHA® OM-5300 no clean solder paste was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. Like all ALPHA solder...
Wave Solder Bar -- ALPHA® SnCX Plus™ 07 ALPHA® SnCX Plus™ 07 is No-silver lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other low silver SAC alloys in wave solder, selective soldering, lead tinning...
Solder Paste -- ALPHA® WS-809 ALPHA® WS-809 is a SnPb, water-soluble which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required. ALPHA® WS-809 is formulated for both standard...
Solder Paste -- ALPHA® WS-820 ALPHA® WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead...
Solder Paste -- ALPHA® WS-852 ALPHA® WS-852 is a SnBiAg low temperature, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required. The low temperature, lead-free...
Solder Paste -- ALPHA® OM-5100 Alpha's ALPHA® OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux vehicle is rheologically formulated to provide excellent repeatability and resistance to environmental...
Wave Solder Bar -- ALPHA® SACX Plus® 0307 HASL ALPHA® SACX Plus® 0307 HASL is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the hot air solder level process. The SACX0300 HASL...
Solder Paste -- ALPHA® JP 501 ALPHA® JP-501 is a lead-free, no-clean solder paste designed for use in Jet Printers. ALPHA JP-501 features a rheology capable of standard dispensing or jetting. The low temperature, lead-free...
Solder Paste -- ALPHA® LUMET® HTP-61 ALPHA® LUMET® HTP-61 Solder Paste with Sn10Sb alloy, is a high melting point off-eutectic solder (with solidus of 245°C and liquidus of ~251°C) designed for SMT and Die Attach...
Solder Paste -- ALPHA®LUMET® JP510 ALPHA® LUMET® JP510 is a lead-free, Zero-halogen no-clean solder paste designed for use in Jet Printers. The paste has clear, colorless flux residue, which is ideal for LED package-on-board...
Solder Paste -- ALPHA® LUMET® P39 ALPHA® LUMET® P39 is a lead-free, Zero-halogen no-clean solder paste designed for applications including LED assembly, where residue with excellent pin testing property and ability to pass JIS...
Solder Paste -- ALPHA® LUMET® P53 ALPHA® LUMET® P53 is a low temperature solder paste technology designed to enable a LED package-on-flex reflow application, especially for PET flexible substrates. ALPHA® LUMET® P53...
Solder Paste -- ALPHA® OM-350 ALPHA® OM-350 is a lead-free, no-clean solder paste suitable for fine feature printing and reflow using most demanding soak reflow profiles in air and nitrogen atmospheres. The outstanding reflow...
Solder Paste -- ALPHA®OM-363 ALPHA® OM-363 is a lead-free, halogen-free, no-clean solder paste designed for minimizing BGA non-wet opens and head in pillow defects. This paste chemistry continues Alpha’s tradition of being an...
Solder Paste -- ALPHA® OM-6106 ALPHA® OM-6106, is a low residue, no-clean solder paste designed to maximize SMT line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and...
Wave Solder Bar -- ALPHA® Bar Vaculoy SACX Plus® 0807 ALPHA® SACX Plus® 0807 is a low silver lead-free alloy specially designed with proprietary additives to deliver soldering and reliability performance similar to higher silver SAC alloys (ie,...
Solid Solder Wire -- ALPHA® Sn42 Bi57.6 Ag.4 ALPHA® Sn42 Bi57.6 Ag.4 Solid Solder Wire is primarily used for rework operations and touch up soldering of SnBiAg based electronics assemblies.
Wave Solder Bar -- ALPHA®Vaculoy SACX Plus® 0107 ALPHA® Vaculoy SACX Plus® 0107 is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX Plus® 0100...
Water Soluble Flux -- ALPHA® WSX-FD ALPHA® WSX-FD water soluble flux is engineered for use in the placement and reflow of high lead, eutectic gold-tin and lead free solders for direct chip attach. It is...
Cored Wire -- ALPHA®Telecore XL-825 ALPHA® Telecore XL-825 is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications. It...
Wave Solder Bar -- Alpha® Vaculoy SACX Plus® 0307 Based on the popular ALPHA® SACX 0307 platform, ALPHA® SACX Plus® 0307 is optimized for use in wave and rework operations. Special additives minimize copper erosion during long, hot...
Wave Solder Bar -- Alpha® Cleanwave 63/37 CLEANWAVE is manufactured using high purity raw materials and is treated using proprietary dross reducing technology to give a solder alloy that has Low Dross Characteristics.
Cored Wire -- Alpha® Telecore Plus For soldering of Lead-Free assemblies, there are ALPHA cored wires available in the following alloy specifications: SACX, SAC305, SAC405 and Sn96.5/Ag3.5
Wave Solder Bar -- ALPHA® Bar HiFlo 63/37 HiFlo solder is manufactured with virgin metals process through Alpha's proprietary viscosity and dross lowering treatments which create the purest, lowest drossing, highest fluidity solder. HiFlo is then alloyed and...
Wave Solder Bar -- ALPHA® Bar HiFlo SMG 63/37 HiFlo® is manufactured using ultra high purity raw materials and the alloy is conditioned using Alpha's proprietary viscosity and dross lowering treatments. This results in a pure, low drossing, high...
Solder Paste -- ALPHA® OM-372 Innovative solder paste enabling next generation high density assembly designs. ALPHA OM-372 provides best-in-class electrochemical reliability on fine pitch, low standoff components, requiring excellent stencil transfer efficiency and high electrical...
Solder Paste -- ALPHA® LUMET® P23 interconnects. ALPHA® LUMET® P23 is designed to enable the use of ALPHA® SAC305 and SnCu0.7 alloys with Type 6 solder powder. ALPHA® LUMET® P23 flux system has long work life...
Tabbing and Stringing Flux -- Alpha® PV-71
Tabbing and Stringing Flux -- Alpha® PV-72
Part of the ALPHA® 7 Series Low Residue Fluxes, ALPHA® PV-71 was specifically designed so that minimal flux deposits inside tabbing and stringing equipment and spray nozzles, with practically...
ALPHA® Preform Washer Preform washers are used in PCB assembly, the integration of PCBs into higher level assemblies, as well as the primary solder material for the construction of numerous electronic and electrical...
Wave Solder Bar -- ALPHA® Bar Vaculoy SAC 305 Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5 are lead-free alloys suitable for use as a replacement for Sn63 alloy. The Sn97Ag3 and Sn96Ag4 variants are used to stabilize / reduce the copper content in...
ALPHA® PV Ready Exactalloy® Preforms The ALPHA PV-READY-Exactalloy family of resilient flux coated preforms for Photovoltaic (PV) applications provide a unique solution to the challenges of providing an exact volume of solder and flux for...
Solder Paste -- ALPHA® PoP-707 This NO-CLEAN flux is engineered for use as a dip flux for BGA packages. It delivers even, reproducible volumes of flux onto spheres that have been dipped into the flux.
Solder Paste -- ALPHA® PoP-33 To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per...
Wave Solder Bar -- ALPHA® Bar Vaculoy
Wave Solder Bar -- ALPHA® Bar Vaculoy SMG
VACULOY® is manufactured using high purity raw materials and the alloy is conditioned using Alpha’s VACULOY® viscosity and dross lowering treatment. This results in a pure low dross high fluidity...