MacDermid Alpha Electronics Solutions Datasheets for Solder
Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
Solder: Learn more
| Product Name | Notes |
|---|---|
| Product Overview ALPHA 856 is formulated for defect-free soldering in processes that use water cleaning. It features a buffered activation system with no free acid and a neutral pH. Its... | |
| Product Overview ALPHA 857 is a low-smoking, efficient foam water-soluble flux. With moderate air flow rates, its fine-bubble foam head breaks quickly and recovers rapidly, providing effective coverage at high... | |
| Product Overview ALPHA 870-25 is a neutral pH, intermediate activity flux formulated with a water-soluble resin and without organic acid activators. It is recommended for mass soldering applications where traditional... | |
| Product Overview ALPHA Accuflux Preforms for power electronics are an ideal solution for applications that require low voiding in large area solder joints and low flux residue. The flux application... | |
| Product Overview ALPHA Accuflux Preforms for power electronics offer a reliable solution for applications requiring low voiding in large-area solder joints and minimal flux residue. The unique flux application process... | |
| Product Overview ALPHA CVP-390V Innolot MXE Solder Paste is a lead-free, zero-halogen, no-clean solder paste rigorously engineered to deliver advanced thermomechanical performance for the increasingly demanding reliability standards of contemporary... | |
| Product Overview ALPHA CVP-390V is a zero-halogen solder paste that offers best-in-class electrochemical reliability, even down to 0.100mm comb spacing, against the most challenging Surface Insulation Resistance (SIR) profiles. Its... | |
| Product Overview ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux residue is clear, colorless, and provides excellent... | |
| Product Overview ALPHA EF-2100 is a non-toxic, Volatile Organic Compound (VOC) free, halide-free, rosin/resin-free, low-solids, no-clean liquid flux designed for defect-free soldering. It serves as a drop-in replacement for users... | |
| Product Overview ALPHA EF-5601 contains over 30% less Volatile Organic Compounds (VOCs) than similar alcohol-based fluxes, making it a more environmentally friendly and safer option. Benchmarked against ALPHA RF-800, an... | |
| Product Overview ALPHA EF-6000 is an active, rosin-free, low solid, low residue no-clean flux. With a wide thermal process window, it delivers good hole-fill across varying preheat temperatures and dwell... | |
| Product Overview ALPHA EF-6103 is a high-performing, low-solid, no-clean alcohol-based flux, developed with a combination of activators and solvents. It is highly effective in cleaning all surfaces, especially reflowed Organic... | |
| Product Overview ALPHA EF-6808HF is a halogen-free, low-solids, alcohol-based, no-clean flux designed for use in a variety of automated and manual soldering applications. While effective on many types of assemblies,... | |
| Product Overview ALPHA EF-8800HF is a mid-solids, alcohol-based flux designed for both standard and thicker, high-density Printed Circuit Boards (PCBs) in leaded and lead-free processes. With special thermally stable activators... | |
| Product Overview ALPHA EF-9301 is a rosin-bearing, alcohol-based, dulling flux developed to meet both productivity requirements and environmental considerations. It delivers best-in-class performance with high yields and throughput for the... | |
| Product Overview ALPHA Energized Plus is suitable for use in any electronic hand-soldering application requiring compliance with Military Specifications for Rosin Activated (RA) class fluxes, meeting the full requirements of... | |
| Product Overview ALPHA Exactalloy Solder Preforms offer increased solder volume for joint reliability, reduced flux residue for improved electrical reliability, and void reduction under component thermal pads. The convenience of... | |
| Product Overview ALPHA HiFlo Sn63Pb37 solder is manufactured using the highest purity metals and a proprietary process that includes viscosity and dross-lowering treatments. This results in the purest, lowest drossing,... | |
| Product Overview ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, and PbSb alloys. To minimize oxidation during storage and shipping, these products are packaged... | |
| Product Overview ALPHA HRL3 Solid Solder is designed to enable low-temperature processes in selective and dip soldering applications. This alloy exhibits improved thermomechanical reliability compared to existing low-temperature alloys on... | |
| Product Overview ALPHA HRL3 Solid Solder is designed to enable low-temperature processes in selective and dip soldering. This alloy exhibits improved thermomechanical reliability compared to existing low-temperature alloys on the... | |
| Product Overview ALPHA industrial solder preforms come in various shapes, sizes, and alloys to suit diverse assembly needs. They are available with or without integrated flux to address assembly challenges. | |
| Product Overview ALPHA JP-500 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA JP-500 features a rheology capable of standard dispensing or jetting. | |
| Product Overview ALPHA NCP-390 is designed to enable consistent fine-pitch printing capability down to a 70μm stencil opening, with a wide range of solder powder sizes ranging from T4 to... | |
| Product Overview ALPHA NCP-LR002 is a lead-free, no-clean solder paste developed for applications requiring high soldering activity, low voiding, and very low flux residues. It enables consistent fine-pitch printing and... | |
| Product Overview ALPHA NCX-402-M3 is a highly active, halogen-free, ultra-low-residue no clean flux, engineered for flip chip attach applications. It is designed to achieve high yields with excellent Surface Insulation... | |
| Product Overview ALPHA NR205 has been specifically formulated to resist degradation in surface insulation resistance and electromigration, even when the flux is not exposed to soldering temperatures or is applied... | |
| Product Overview ALPHA OM-100 SnCX 07 is a silver-free solder paste engineered to deliver Tin-Silver-Copper (SAC) comparable reliability with improved total cost of ownership. Ideal for cost-sensitive applications, this solution... | |
| Product Overview ALPHA OM-353 is a zero-halogen solder paste engineered to provide superior electrochemical performance and minimize residue spread. This results in superior electrochemical performance down to 0.200 mm spacing... | |
| Product Overview ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is specifically designed to deliver ultra-low voiding performance across all component types, with a... | |
| Product Overview ALPHA OM-377 is a lead-free, no-clean solder paste engineered for superior electrochemical reliability in fine-pitch, low-standoff SMT assemblies. Optimized for high-density PCB applications and ultra-miniaturized components down to... | |
| Product Overview ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste designed to maximize first-pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and minimize... | |
| Product Overview ALPHA OM-5300 is a zero halogen, no clean solder paste developed to meet the demands of tin lead soldering when lead-free components are present in the circuit assembly. | |
| Product Overview ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitiv e chip-scale packages. This solder paste enables peak reflow temperatures of 175°C and... | |
| Product Overview ALPHA Powerbond Solder Preforms are a family of lead-free, high-temperature, high-reliability alloys with antimony content ranging from 5-10%. The SnSb alloy system is an important addition to solder... | |
| Product Overview ALPHA SAC305, SAC387, and SAC405, along with their replenishment alloys SAC300, SAC350, SAC380, and SAC400, are lead-free options suitable for replacing Sn63Pb37 alloy. The replenishment alloys are often... | |
| Product Overview ALPHA SACX Plus 0307 is a low-silver, lead-free alloy designed as a replacement for SnPb, SAC305, and other low-silver Tin-Silver-Copper (SAC) alloys, including the original SACX 0307, in... | |
| Product Overview ALPHA SACX Plus 0807 is a low-silver, lead-free alloy specially designed with proprietary additives to deliver soldering and reliability performance comparable to higher-silver SAC alloys (e.g., SAC305, SAC405). | |
| Product Overview ALPHA SnCX Plus 07 is a no-silver, lead-free alloy designed as a replacement for SnPb, SAC305, and other low-silver SAC alloys in wave soldering, selective soldering, lead tinning,... | |
| Product Overview ALPHA Telecore HF-850 is suitable for use in any electronic or industrial no-clean soldering application that specifies compliance to the IPC J-STD-004 ROL0 standard. It is ideal for... | |
| Product Overview ALPHA Telecore Plus is suitable for use in any commercial no-clean hand soldering application that must meet Bellcore Specification TR-NWT-000078. Its unique blend of rosin and proprietary activators... | |
| Product Overview ALPHA Telecore XL-825 is suitable for use in any commercial no-clean hand soldering application that specifies compliance to JIS grade AA standard. It offers the balance of high... | |
| Product Overview ALPHA TrueHeight Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability. Multiple bondline control mechanisms can... | |
| Product Overview ALPHA Vaculoy is manufactured using high-purity raw materials, and the alloy is conditioned using our Vaculoy viscosity and dross-lowering treatment. This results in a pure, low-dross, high-fluidity solder... | |
| Product Overview ALPHA WS-608 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. It is highly compatible with Copper Organic Solderability... | |
| Product Overview ALPHA WS-698 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Copper Organic... | |
| Product Overview ALPHA WS-698CPS is a high-activity solder paste formulated for a broad range of stencil printing applications, including surface mount and solder bumping processes. Its outstanding reflow process window... | |
| Product Overview ALPHA WS-945CPS is specifically designed for System-in-Package (SiP) applications involving numerous small components. It is optimized for the smallest solder powders, including Types 6 and 7, and is... | |
| Product Overview ALPHA WS9180-MHV water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto wafer or panel surfaces. The flux is highly compatible with Cu,... | |
| Product Overview As semiconductor packages increase in performance and functionality, the demand for advanced Thermal Interface Materials (TIMs) rises. With decreasing junction resistance, traditional organic-based TIMs are approaching their limits... | |
| Product Overview Innolot MXE is a next-generation solder alloy engineered for superior reliability in demanding electronic assemblies. It offers exceptional thermomechanical performance, including enhanced thermal cycling, vibration, and drop shock... | |
| Product Overview K100LD is a eutectic tin/copper alloy with controlled metallic dopants that control the grain structure within the solder joint and minimize copper dissolution into the solder pot. K100LD... | |
| Product Overview Kester 285 consists of high-quality, purified rosin combined with a synergistic blend of activating agents. This flux was formerly classified as Type RMA per QQ-S-571. Its fluxing ability... | |
| Product Overview Kester 331 is the flux cored solder wire version of the popular Kester 2331-ZX Liquid Flux and is more effective than rosin fluxes when soldering difficult metals. This... | |
| Product Overview Kester OR-421 is more heat stable, exhibits better wetting capabilities, and has less odor than competitive products. The residues left by OR-421 are near neutral pH and therefore... | |
| Product Overview Kester Tin-Lead (SnPb) is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity... | |
| Product Overview Kester TSF-6522RH is a rosin-based, no-clean tacky soldering flux formulated to meet the IEC 61249-2-21 definition for halide-free materials. It can be applied using a doctor blade, drum... | |
| Product Overview Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for a range of interconnect applications, including flip chip attach, sphere or ball attach, and rework... | |
| Product Overview NOVAFAB® Pd Acid Strike is a high-performance palladium acid pre-plate specifically designed for Fan-Out Wafer Level Packaging (FOWLP) solder surface applications. It delivers thin, uniform palladium deposits across... | |
| Product Overview Our Low and No-Silver Alloys are designed to deliver cost-effective, high-reliability soldering solutions for demanding electronic applications. These alloys offer excellent thermal and mechanical performance while significantly reducing... | |
| Product Overview Rapid soldering can be accomplished on all common metals except aluminum and manganese. Kester AW Flux Cored Solder Wire is particularly useful for soldering excessively oxidized metals. It... | |
| Product Overview SAC305 alloy is a proven, industry-standard lead-free solder composed of tin, silver, and copper, offering excellent thermal fatigue resistance and reliable joint integrity. It is widely used across... | |
| Product Overview SACX Plus 0307 and SACX Plus 0807 are low-silver, lead-free alloys that provide low copper dissolution and reduced dross rates. They offer fast wetting and a wide process... | |
| Product Overview The ALPHA Fluitin 1532 unique activator system offers good thermal stability at pre-soldering temperatures, ensuring strong performance on parts and surfaces that present poor or difficult soldering conditions. | |
| Product Overview The Innolot alloy offers creep resistance properties that significantly improve reliability over standard Tin-Silver-Copper (SAC) and SnAg alloys. These preforms are available in a wide range of sizes,... | |
| Product Overview The low-temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux... | |
| Product Overview The material is cured by thermal processing in IR, convection, conduction, or vapor phase equipment. A combination of short cure time, low-temperature cure, and excellent thermal stability results... | |
| Product Overview Thermal Interface Material (TIM) development is increasingly important as semiconductor packages advance in performance and functional integration. With junction resistance values steadily decreasing, traditional organic-based TIMs are nearing... | |
| Product Overview With its unique chemistry system, Kester 268 provides consistent workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/ halide-based... |