ATROX 558-2C31 is a thermosetting, electrically and thermally conductive die attach material for semiconductor packaging. It is supplied in 5 or 10 cc EFD or Musashi syringes. The cured material has a glass transition temperature of 140 °C, a thermal conductivity of 4.1 W/mK, and a volume resistivity of 0.0002 Ω-cm. Die shear strength is 69 kg on copper and 68 kg on pre-plated frames at 25 °C, dropping to 8 kg and 13 kg respectively at 260 °C. It cures in 60 minutes at 175 °C with a coefficient of thermal expansion of 45 ppm below Tg and 225 ppm above Tg. Storage is required at -40 °C for a shelf life of 12 months.
Product Overview
ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials.
Product Features
Thermal Conductivity
The ATROX 558-2C31 offers good thermal conductivity, greater than 5 W/m-K, making it ideal for applications that require efficient heat dissipation.
Compatibility with Multi Leadframe Surfaces
This adhesive is compatible with various leadframe surfaces, including Copper (Cu) and pre-plated frames (NiPdAu), offering versatility in packaging.
Low Outgassing and Moisture Resistance
It features low outgassing properties and excellent moisture resistance, enhancing its performance and longevity in high-reliability environments.
Featured Applications
Power Semiconductors
It is commonly used in power semiconductor and power discrete device packaging, where efficient thermal management and mechanical stability are critical.
Medical / Aerospace
Its reliability and low outgassing make it ideal for sensitive applications, such as medical devices and aerospace components.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | ATROX ® 558-2C31 |
| Product Name | Advanced Conductive Die Attach for Semiconductors |
| Cure / Technology | Thermoset |
