ALPHA HiTech CU21-3240 is a one-component capillary underfill epoxy for protecting assembled chip packages on printed circuit boards. It is supplied in 10 cc, 30 cc, 50 cc, and 55 cc syringes. The cured material has a glass transition temperature of 165 ± 5 °C, a coefficient of thermal expansion of 31 ± 10 ppm below Tg and 105 ± 20 ppm above Tg, a Shore D hardness of 85 to 95, and a thermal conductivity of 0.745 W/mK. It is halogen-free and complies with RoHS Directive 2015/863/EU. The underfill is not reworkable and exhibits a linear shrinkage of 0.86% and volume shrinkage of 1.57%. It passes DSC compatibility tests with specified flux residues. Storage requires freezing at or below -20 °C, and curing is performed at 140 °C for at least 30 minutes, 150 °C for at least 10 minutes, or 165 °C for at least 5 minutes.
Product Overview
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards.
It features a high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), providing a high-reliability solution.
Product Features
Full Component Coverage
Provides full component coverage when dispensed onto a substrate preheated to 70–100°C.
Stringent Thermal Cycling Test Condition
High Tg and low CTE values drastically improve the ability to pass more stringent thermal cycling test conditions.
Excellent Thermal Cycling Test performance
Halogen-Free
Complies with RoHS Directive 2015/863/EU
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Thermal Compounds and Thermal Interface Materials |
| Product Number | ALPHA ® HiTech ® CU21-3240 Underfill |
| Product Name | Underfill Materials for Printed Circuit Boards (PCBs) |
| Industry | Automotive; Electronics; Semiconductors, IC's |
