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MacDermid Alpha Electronics Solutions Datasheets for Plating Chemicals and Anodizing Chemicals

Plating chemical and anodizing chemicals include metal salts, formula additives, and other consumables for the electrodeposition, electroless plating, electroplating and anodized layer formation.
Plating Chemicals and Anodizing Chemicals: Learn more

Product Name Notes
As Wafer Level Packing technology continues to expand, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by heterogeneous packages. MICROFAB MP-2500 allows interconnection of 2.5D and 3D wafer...
BDT-200 is a historical workhorse known for its bright appearance and ease-of-use. BDT-200 BDT 200 is an alkaline, non-cyanide electroplating formulation which produces a bright, ductile deposit. In comparison with...
BDT-510 is a historical workhorse known for its bright appearance and ease-of-use. Product Overview BDT-510 is an alkaline, non-cyanide electroplating system which produces a bright, ductile deposit. Specific gravity measurements...
Copper electrodeposited with a nano-twinned crystal orientation demonstrates superior mechanical and electrical properties and has drawn a lot of attention in the wafer-level packaging (WLP) field for Cu to Cu...
Copper plating process for copper pillar in flip chip package, copper microbump as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control with higher...
Copper plating process for copper pillar in flip chip package, copper microbump as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control. Product Overview...
For the highest performing and most reliable graphite based direct metallization process, start with Shadow. Product Overview Shadow is an advanced direct metallization for HDI and flex type constructions which...
From advanced via filling to high density embedded trace substrates, Systek™ copper electroplating technology pushes the limits of what is possible with electroplated copper. Product Overview Making through holes and...
From specialty applications to technology-enabling solutions allowing for thinner, faster devices, we have everything you need to bridge the performance gap to your next-generation product. Product Overview Our integrated leadframe...
Gold plating solutions have evolved dramatically over the years to achieve fine line, step coverage and bump plating. To further reduce operating costs MacDermid Alpha has developed a non-cyanide deplate...
High speed copper plating process for copper pillar in flip chip package, copper microbump in 3D interconnect package as well as redistribution layer. The process delivers accurate bump height uniformity...
Higher speed copper plating process for copper pillar in flip chip package, copper microbump in 3D interconnect package as well as redistribution layer. The process delivers accurate bump height uniformity...
MICROFAB AU310-T enables an arsenic free bright plating solution with superior surface roughness for fine pitch pattern gold bumping. Product Overview MICROFAB AU310-T is a mild alkaline non-cyanide, gold electroplating...
MICROFAB Au3151B creates 'high hardness' gold bumping with a hardness adjuster. This process is not possible with a conventional gold process. MICROFAB Au3151B is best suited for semiconductor wafers for...
MICROFAB AU660 enables a single solution for backside interconnect (via liner) and fine pitch pattern gold bumping. It excels at high plating rates (> 0.5µm /min) and step coverage (~2X...
MICROFAB CUMSA100 enables high plating rates for high throughput leading to a lower cost of ownership. This is enabled through a low consumption additive and simple and easy bath maintenance.
MICROFAB DVF-200 excels at bottom up fill and versatility. Created for a variety of aspect ratios for TSV and interposer applications, this solution can be used in combination with our...
MICROFAB GSW-200 is a mid-purity plating system that can be used with or without a Ni barrier. The solutions ability to level the pad reduces the amount of solder needed...
MICROFAB Pure BP is MacDermid Alpha’s pure copper offering with high KV resistance designed for copper pillars without the need for a Ni barrier between the copper pillar and solder...
MICROFAB SC-40 PLUS next-generation, high- speed, copper plating process delivers a high purity deposit with exceptional within-wafer, within-die and within-feature uniformity. The versatile chemistry is suitable for bump, pillar and...
MICROFAB SN-300 / 302 is a high-speed low alpha pure tin plating process that produces compact grain structures and uniform surface morphology which is used for flip chip bumping and...
MICROFAB SN-350 is a high-speed, low alpha pure tin plating process that produces compact grain structures and smooth surface morphology, which is used for flip chip bumping and microbump applications.
MICROFAB SPM-1100 copper plating solution demonstrates superior high-speed plating and coplanarity in a KV low system which provides exceptional within-wafer, within-die, and within-feature uniformity. Product Overview The MICROFAB SPM-1100 process...
MICROFAB SPM-1200 copper plating solution demonstrates superior coplanarity in a KV low system which provides exceptional within-wafer, within-die, and within-feature uniformity. Product Overview The MICROFAB SPM-1200 process is engineered for...
MICROFAB TS-650 NXG tin silver bump metallization bath is an organic sulfonate-based electrolyte designed for use in semiconductor wafer plating. It is suited for high-speed electrodeposition producing smooth surface morphology,...
MID plating solutions specifically optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. Product Overview MacDermid Enthone's molded interconnect...
NEUTRONEX 309 is a historic cyanide free BKM for filters, opto-semi and power management. Product Overview NEUTRONEX 309 is an alkaline, non-cyanide, thallium-based gold electroplating process. It is also available...
Niche specialty processes for high reliability bonding, copper adhesion, etching, and high speed signal integrity. Product Overview MacDermid Alpha understands the challenges of providing conductor shapes that exceed your customers’-controlle...
NOVAFAB HPM-500 copper plating solution demonstrates superior coplanarity in a KV low system which provides exceptional within-die, and within-feature uniformity. Product Overview The NOVAFAB HPM-500 is a high-performance copper process...
Optimizing solar cells one chemical at a time. Product Overview As the photovoltaics (PV) industry gravitates toward grid parity, chemical processing will deliver the cost, processing, and efficiency advantages needed...
Organic Solderability Preservative (OSP) for Integrated Circuit (IC) substrate applications. Product Overview The ENTEK Organic Solderability Preservative (OSP) brand is the industry’s most trusted and widely used on the market...
Our high throw DC and pulse plating coppers can metallize through holes of nearly any aspect ratio with excellent microdistribution and minimal copper surface plating. Product Overview MacDermid Alpha Electronics...
PCB manufacturers have chosen Shadow®, Blackhole®, Eclipse™, and ENVISION® direct metallization systems over electroless copper for lower cost of ownership and easier-to-maintain equipment. Product Overview...
Printing and plating process utilizing proven technology that can satisfy the demand for high volume advanced circuitry. Product Overview As the use of RFID/Smart Card technology becomes more ubiquitous, we...
Specifically designed to aid adhesion and rid unwanted contamination from entering the main gold plating solution. Product Overview NEUTRONEX STRIKE is a non-cyanide, weakly alkaline gold strike plating process. NEUTRONEX...
Superior Filling Performance for Wafer Fabrication Product Overview ViaForm chemistry is produced in our high volume manufacturing (HVM) and advanced research facilities based in West Haven, Connecticut, USA. The HVM...
Systek™ SAP is a family of high-performance build-up processes for IC substrate RDL that provides multiple process flows for different materials. Product Overview The Systek SAP copper metallization process is...
The lowest variation electroless nickel immersion gold means reduced costs and high reliability. Product Overview Each process step of Affinity™ ENIG 2.0 is optimized to work together to create an...
The M-Series Desmear process is finely tuned to create the optimal surface for application of electroless copper or direct metallization. Product Overview Our line of desmear chemistries provide the optimal...
The MacDermid Enthone brand of electroless copper processes have long been a market leader in high-reliability and performance for demanding PCB applications. Our electroless coppers are ideally suited for performance...
The MICROFAB RDLV Series offers three solutions to have best-in-class performance for the simultaneous plating of RDL lines and filling of vias across a wide range of line, space and...
The world's largest manufacturer of electroless nickel chemistry for memory disk applications. Product Overview Over the past 30 years, we delivered cutting-edge electroless nickel chemistry to the memory disk industry.
Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by green initiatives while building on industry leading...
Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by requests for viafill Ni and stress tunable...
Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha's barrier technology is leading the way. Product Overview MICROFAB NI-100 is a nickel sulfamate electroplating process...
Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha's barrier technology is leading the way. Product Overview MICROFAB NI-200 is a sulfamate nickel electroplating process...
Widely specified immersion tin final finishes for consistent reliability. Product Overview Our immersion tin processes represent the pinnacle of trusted reliability for tin metal final finishes in the automotive electronics...