MacDermid Alpha Electronics Solutions Datasheets for Plating Chemicals and Anodizing Chemicals
Plating chemical and anodizing chemicals include metal salts, formula additives, and other consumables for the electrodeposition, electroless plating, electroplating and anodized layer formation.
Plating Chemicals and Anodizing Chemicals: Learn more
| Product Name | Notes |
|---|---|
| 2-in-1 RDL via fill solution for fine feature plating of blind microvias, X-vias, and fine lines and pads in a single bath. Product Overview Redistribution layers in IC substrate manufacturing... | |
| A high-purity copper electroplating process formulated for fabricating pillars or pads for hybrid bonding applications. Product Overview NOVAFAB NANOTWIN Cu is a high-purity copper electroplating process which produces a <111> | |
| A versatile, cost-efficient, and environmentally friendly carbon-based direct metallization alternative to electroless copper. Product Overview Blackhole is the lowest cost through hole metallization process available on the market. Trusted by... | |
| Acid copper plating process engineered to produce low-stress, pure copper deposits. Product Overview The MICROFAB GSW-100 Copper process has been engineered to produce a low-stress copper deposit in compound semiconductor,... | |
| Acid copper plating process fills Through-Silicon Vias (TSVs) without voids or defects at high plating speeds. Product Overview MICROFAB DVF-200 is an acid copper plating process designed to fill Through-Silicon... | |
| Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits. Product Overview The MICROFAB SC-32 acid copper plating process is designed for copper pillars in... | |
| Acid copper plating system designed for simultaneous plating of RDL lines and via filling across a wide range of geometries. Product Overview The MICROFAB RDLV 50, 60, and 70 processes... | |
| Advanced DC acid copper pattern plating specifically formulated to plate fine lines and pads in embedded trace substrates. Product Overview Systek ETS features: Fine line pattern plating down to 5/5... | |
| Advanced DC acid copper plating system that provides pulse-like performance for thicker mid-range through-hole metallization. Product Overview MacuSpec HT 300 is a high-throw DC acid copper plating process that delivers... | |
| Advanced via fill copper metallization processes for high-density interconnects. Product Overview The MacuSpec AVF series is an advanced family of via-fill copper metallization processes designed for high-density interconnects. AVF technology... | |
| Alkaline zincating solution designed for electroless nickel plating of aluminum alloys used in memory disk manufacturing. Product Overview Conventional zincate solutions are ineffective in meeting the demands of increased production... | |
| Alkaline, non-cyanide, thallium-based gold electroplating process for filters, opto-semi and power management. Product Overview NEUTRONEX 309 is a historic cyanide-free BKM for filters, opto-semiconductors, and power management applications. A thallium-free... | |
| Anode and acid-based replenishers that deliver improved reliability and supply chain assurance with locally sourced Low Alpha Tin. Product Overview The Low Alpha Tin product portfolio includes high-purity, sustainably sourced... | |
| Bright, ductile deposit for use in reel-to-reel or rack-and-barrel applications. Product Overview Our portfolio of palladium products includes: Pure A bright, ductile deposit suitable for reel-to-reel or rack-and-barrel applications. Palladium... | |
| CircuEtch 100 is a high-speed peroxide-sulfuric copper etch suitable for various printed circuit manufacturing applications. Product Overview CircuEtch 100 is the product of choice for controlled copper thickness reduction in... | |
| Coating process designed to enhance fine line plating performance on laser direct structured substrates. Product Overview As the applications for molded interconnect devices have expanded from simple, large antenna constructions... | |
| Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication. Product Overview ViaForm copper damascene chemistries deliver superior filling performance for wafer fabrication. Each chemistry... | |
| Copper plating baths that can simultaneously fill copper microvias and plate through holes with aspect ratios of up to 8:1. Product Overview The MacuSpec VF-TH Series consists of copper plating... | |
| Copper through hole filling process that enables improved thermal and structural designs for IC substrates. Product Overview Systek THF Series is a copper through hole filling process that enables improved... | |
| CoreClean is a flexible surface preparation process for innerlayers before applying either dry film or liquid resist. Product Overview CoreClean is a flexible surface preparation process for innerlayers prior to... | |
| Cost-effective periodic pulse reverse process that provides higher throwing power, reduced surface copper, and increased plating rates. Product Overview MacuSpec MPR 100 is a pulse plating process designed as a... | |
| Cyanide-based copper strike. Product Overview Our high-speed plating and cyanide-based copper strike solutions include: Bright, Matte High-speed copper plating for mid to high current densities, available in either sulfuric acid... | |
| Cyanide-free electroplating process designed to deliver superior deposits for wafer plating applications. Product Overview NOVAFAB AG-340 is a cyanide-free electroplating process that delivers deposits with superior physical characteristics, such as... | |
| DC acid copper pattern plating process specifically designed for consistent void-free filling of vias for 2-in-1 RDL applications. Product Overview Systek MV 400 is a DC acid copper pattern plating... | |
| Deposits a semi-bright, slightly tensile stressed and ductile layer. Ideal undercoat for precious and non-precious metal deposits. Product Overview Semi-Bright Matte Pure Nickel deposits a semi-bright, slightly tensile-stressed, and ductile... | |
| Direct Current (DC) acid copper plating system that delivers High-Throwing (HT) power for high aspect ratio through holes. Product Overview MacuSpec HT 200 is specifically formulated to deliver high microdistribution... | |
| Eco-friendly graphite based direct metallization process makes through holes conductive prior to copper electroplating. Product Overview Shadow is an eco-friendly, graphite-based direct metallization process that makes through holes and blind... | |
| Electroless copper chemistry enables selective metallization of plastics activated through laser and 2x molding methods. Product Overview As an industry-leading electroless copper chemistry, MID Copper 100 enables manufacturers and designers... | |
| Electroless copper plating process that deposits electroless copper with stellar physical properties. Product Overview The Systek SAP copper metallization process is a high-performance semi-additive primary metallization for IC substrates, featuring... | |
| Electroless copper system for difficult-to-plate substrates, offering superior adhesion while maintaining structural integrity. Product Overview Via Dep® 4550 electroless copper system is specially designed for difficult-to-plate substrates. The 4550 process... | |
| Electroless nickel systems for memory disk provide superior corrosion resistance and excellent thermal magnetic stability. Product Overview Our electroless nickel chemistries for memory disks produce high percentages of phosphorous deposits... | |
| Electrolytic, high-speed, and water-based organic solutions. Product Overview Our silver and gold electrolytic, immersion, and solvent-based organic post treatment solutions include: Silver Post Treatments Electrolytic, high-speed, water-based organic solution. Electrolytic,... | |
| Electrolytic, high-speed, water-based, and Pd-based solutions; immersion solutions; and solvent-based organic solutions. Product Overview Our range of silver and gold electrolytic, immersion, and solvent-based organic post treatment solutions include: Silver... | |
| Electroplating process for Palladium Cobalt alloy delivers exceptional durability and corrosion resistance. Product Overview The Palladex PC-1 Palladium Cobalt process is specifically designed for the electroplating of the palladium cobalt... | |
| Full range of tin eliminator products used in outer layer tin stripping. Product Overview Our Eliminator products, used for outerlayer tin stripping, are recognized for their ability to uniformly remove... | |
| Full range of UltraStrip photoresist strippers and eliminator products used in outer-layer tin stripping. Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. These formulas are... | |
| General purpose bath for both nickel- and cobalt-hardened applications. Product Overview Our Cobalt or Nickel process is a general-purpose bath suitable for both nickel and cobalt-hardened applications. | |
| Gold electroplating process provides an arsenic-free bright plating solution with superior surface roughness for fine pitch bumping. Product Overview MICROFAB AU310-T is a mild alkaline non-cyanide gold electroplating process that... | |
| Gold strike plating process designed to improve adhesion and prevent unwanted contamination from entering the main gold plating solution. Product Overview NEUTRONEX STRIKE is a non-cyanide, weakly alkaline gold strike... | |
| High- and low-speed options with reduced consumption. Bright, ductile deposits, exceptional contact stability, and wear resistance. Product Overview Our portfolio of palladium products includes: Pure A bright, ductile deposit suitable... | |
| High-dep metallization process combining a patented activation sequence with a statistically designed electroless copper bath. Product Overview The M-Copper Omega is a high-deposition metallization process that combines a unique, patented... | |
| High-performance, simultaneous via filling and through hole plating acid copper metallization process for high density interconnects. Product Overview MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH series... | |
| High-purity electroplating process produces equiaxed-grained matte copper deposits for bump/pillar fabrication. Product Overview MICROFAB CUMSA100 enables high plating rates for high throughput, leading to a lower cost of ownership. This... | |
| High-reliability, cost-competitive electroless copper system formulated from decades of experience in electroless copper plating. Product Overview M-Copper EF is the only electroless copper system on the market, sold by an... | |
| High-speed copper plating process delivers accurate bump height uniformity and bump shape control. Product Overview The MICROFAB SC-50 is a high-speed copper plating process designed for copper pillars in flip... | |
| High-speed copper plating process enables flat bump shape, engineered for high-speed pillar, copper stud, and UBM applications. Product Overview The MICROFAB SC-40 is a high-speed copper plating process designed for... | |
| High-speed copper plating process for copper pillars in flip chip packages, copper microbumps in 3D interconnects, and RDL. Product Overview The MICROFAB SC acid copper plating process is designed for... | |
| High-speed copper plating process for copper pillars in flip chip packages, microbumps in 3D interconnects, and RDL. Product Overview The MICROFAB CU1000 process is engineered for high-speed bump and pillar... | |
| High-speed copper plating process provides exceptional within-die and within-feature uniformity for mega pillar applications. Product Overview MICROFAB MP-2500 is a high-speed copper plating process engineered for mega pillar applications, delivering... | |
| High-speed low-alpha pure tin plating process produces compact grain structures and uniform surface morphology. Product Overview The MICROFAB SN-300/302 process is a high-speed, MSA-based pure tin plating solution. It produces... | |
| High-speed silver plating for reel-to-reel plating with inert anodes. Product Overview Our silver plating portfolio includes: Low Speed A low-speed silver plating process designed for rack-and-barrel applications. High Speed A... | |
| High-speed, reel-to-reel or rack and barrel plating solutions with wide current density ranges. Product Overview Our high-speed plating and cyanide-based copper strike solutions include: Bright, Matte High-speed copper plating for... | |
| High-speed, reel-to-reel, or rack and barrel plating solutions with wide current density ranges. Product Overview Our matte and bright high-speed tin solutions (MSA-based) include: Matte (MSA) High-speed, high-efficiency, low-foam electrolytes... | |
| Highly concentrated photoresist solutions, making feed-and-bleed control of the developer solution simple and consistent. Product Overview Our photoresist developers are highly concentrated aqueous solutions, enabling simple and consistent feed-and-bleed control. | |
| Highly stable electroless nickel process deposits a smooth, pure, dense, and uniform coating on copper plated LDS substrates. Product Overview This highly stable electroless nickel process is designed to deposit... | |
| Integrated desmear–electroless copper system designed to plate pure, smooth, dense and uniform copper deposits. Product Overview M-System integrated desmear-electroless copper was developed using design-for-six-sigma techniques to provide a proven primary... | |
| Kolon dry film photoresists offer high reliability for all commonly used substrates at the lowest possible cost (Europe only). Product Overview Kolon series dry film photoresists deliver high first-pass yields... | |
| Low, medium, and high-phosphorus nickel systems with exceptional stability that provide best-in-class thickness uniformity. Product Overview Our MID LT Nickel 100 is designed for low, medium, and high-phosphorus nickel systems,... | |
| Low-speed silver plating process for rack-and-barrel applications. Product Overview Our silver plating portfolio includes: Low Speed A low-speed silver plating process designed for rack-and-barrel applications. High Speed A high-speed silver... | |
| MICROFAB® NiFe 1000 and NOVAFAB® NiFe 2000 electrolytic nickel/iron alloy plating processes, designed for MEMs and WLP applications. Product Overview MICROFAB NiFe 1000 and NOVAFAB NiFe 2000 are innovative electrolytic... | |
| MID specific process designed to operate at low metal concentrations, enabling lower operating costs and exceptional solderability. Product Overview Delivering consistent selectivity on a wide variety of materials and catalysts,... | |
| Mild alkaline non-cyanide gold electroplating process for backside interconnects (via liners) and fine pitch pattern gold bumping. Product Overview MICROFAB AU660 is a high-purity (99.99%) gold electroplating process frequently used... | |
| Mild alkaline non-cyanide high-purity hardness gold electroplating process with proven reliability and bondability. Product Overview MICROFAB Au3151 enables high-hardness gold bumping through the use of an organic hardness adjuster—something not... | |
| Mildly acidic gold strike for enhanced adhesion of subsequent plated deposits. Product Overview Our portfolio of alloys, baths, and mildly acidic strikes for a range of applications includes: Cobalt Alloy... | |
| Next-generation high-speed copper plating process delivers high-purity deposits with cutting-edge uniformity. Product Overview MICROFAB SC-40 PLUS, a next-generation acid copper plating process, represents a leap forward in semiconductor manufacturing. It... | |
| Nickel sulfamate processes, including boric acid-free options, produce pure, ductile, fine-grained, matte, low-stress deposits. Product Overview Our MICROFAB® Nickel solutions include sulfamate nickel, barrier electroplating processes designed to provide pure,... | |
| Non-cyanide gold seed deplate reduces costs by selectively stripping gold seed metallization. Product Overview Gold plating solutions have advanced significantly to support fine line features, step coverage, and bump plating. | |
| Organic solderability preservative (OSP) for IC substrate fabrication with industry leading OSP coating thickness capability. Product Overview ENTEK® PLUS IC Organic Solderability Preservative’s (OSP) industry leading thickness capability allows unrivalled... | |
| Pulse plating process that delivers precise thickness uniformity and productivity unattainable by conventional acid copper plating. Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide... | |
| Pulse plating process with excellent control of throwing power within through-holes, surface copper thickness and variation. Product Overview PC 610 is an industry-leading pulse plating process designed to provide excellent... | |
| Pulse plating processes that enable precise thickness uniformity, reliable thermal cycle performance, and superior throwing power. Product Overview MacuSpec PPR 100 and 200 are industry-leading pulse plating processes trusted by... | |
| Pure copper process with high KV resistance, engineered for copper pillar, copper stud and UBM applications. Product Overview MICROFAB Pure BP is a high-KV resistance pure copper process designed for... | |
| Resist stripping system designed to strip fully aqueous and tough-to-strip LDI dry films and conventional dry film photoresists. Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist... | |
| Selective, high-speed, mirror-bright deposits with consistent and uniform coverage over a wide range of current densities. Product Overview Our portfolio of alloys, baths, and mildly acidic strikes for a range... | |
| Stable process with high efficiency and speed at high current densities; minimal over-plate at low current densities. Product Overview Our Cobalt Alloy process has a bright yellow deposit with low... | |
| State-of-the-art DC acid copper plating process that enables high-throw, high-volume production with no need for pulse plating. Product Overview MacuSpec HT 360 is a state-of-the-art direct current acid copper plating... | |
| Sulfamate-based nickel-phosphorus (3-12% wt% P) deposit for improved corrosion resistance and non-magnetic properties. Product Overview Nickel-Phosphorus Alloy is a sulfamate-based nickel-phosphorus deposit (3–12 wt% P) providing improved corrosion resistance and... | |
| Sulfamate-based nickel-tungsten (35-45 wt% W) deposit for improved wear and corrosion resistance. Product Overview Our nickel alloy and pure nickel solutions for improved corrosion resistance include: Nickel-Tungsten Alloy is a... | |
| Super throwing power solution that enables increased throwing power in high aspect through-hole plating. Product Overview CUPROSTAR ST-2000 is a direct current acid copper plating process that delivers high throwing... | |
| The benchmark in Plated Through Hole (PTH) direct metallization processes, engineered to provide high performance, reliability, and durability. Product Overview Eclipse is engineered for fabricators and OEMs that require consistently... | |
| The latest graphite-based, wet-etch direct metallization technology designed to enhance reliability in high-density applications. Product Overview Shadow Plus is a graphite-based, patented wet-etch direct metallization technology designed to provide enhanced... | |
| This alternative to nickel/gold final finishes provides significant cost reductions and exceptional electrical performance. Product Overview Delivering consistent selectivity on a wide variety of materials and catalysts, our final finish... | |
| Three step desmear process that can be calibrated to optimally prepare multiple substrate materials. Product Overview Systek SAP begins with a three-step desmear process that can be calibrated to optimally... | |
| Tin-silver bump metallization bath allows high-speed electro-deposition of smooth, fine-grained, uniform tin silver alloy bumps. Product Overview MICROFAB TS-650 NXG is the tin-silver bump, pillar, and capping metallization process for... | |
| Trusted alkaline non-cyanide electroplating system known for its bright appearance and ease of use. Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The... | |
| Unique acid copper plating system designed for filling blind vias across various geometries. Product Overview MICROFAB GSW-200 is a mid-purity plating system that works with or without a Ni barrier. | |
| Via filling copper metallization solutions that provide the most stable and consistent via filling available on the market today. Product Overview The MacuSpec VF Series via-fill copper metallization solutions have... |