MacDermid Alpha Electronics Solutions Datasheets for Plating Chemicals and Anodizing Chemicals
Plating chemical and anodizing chemicals include metal salts, formula additives, and other consumables for the electrodeposition, electroless plating, electroplating and anodized layer formation.
Plating Chemicals and Anodizing Chemicals: Learn more
| Product Name | Notes |
|---|---|
| High-speed, high-efficiency, low-foam electrolytes for the deposition of pure tin over a wide current density range. | |
| Product Overview Semi-Bright Matte Pure Nickel deposits a semi-bright, slightly tensile-stressed, and ductile layer. Ideal as an undercoat for both precious and non-precious metal finishes. | |
| Product Overview As an industry-leading electroless copper chemistry, MID Copper 100 enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding... | |
| Product Overview As the applications for molded interconnect devices have expanded from simple, large antenna constructions to advanced electronic devices, conductor line sizes have become an issue due to laser... | |
| Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3... | |
| Product Overview Blackhole is the lowest cost through hole metallization process available on the market. Trusted by over 250 of the world’s leading manufacturers, our Blackhole process is the choice... | |
| Product Overview CircuEtch 100 is the product of choice for controlled copper thickness reduction in CO₂ LDD, Light-Emitting Diode (LED), and Printed Circuit Board (PCB) applications. During etching, the copper... | |
| Product Overview Conventional zincate solutions are ineffective in meeting the demands of increased production volumes, as well as the variability of aluminum substrates currently plated. The Enklad Zincate 100/100R overcomes... | |
| Product Overview CoreClean is a flexible surface preparation process for innerlayers prior to the application of either dry film or liquid resist. The process includes cleaners designed to remove even... | |
| Product Overview CUPROSTAR ST-2000 is a direct current acid copper plating process that delivers high throwing power at current densities up to 30 ASF in through holes with aspect ratios... | |
| Product Overview Delivering consistent selectivity on a wide variety of materials and catalysts, our final finish solutions enable more complex designs on low-cost molding composites. This easy-to-control process offers steady... | |
| Product Overview Eclipse is engineered for fabricators and OEMs that require consistently high performance, reliability, and durability. Simpler to use and considerably more cost-efficient than electroless copper, Eclipse delivers advanced... | |
| Product Overview Gold plating solutions have advanced significantly to support fine line features, step coverage, and bump plating. To help reduce operating costs, we’ve developed a non-cyanide deplate system to... | |
| Product Overview Kolon series dry film photoresists deliver high first-pass yields through fine-line resolution, strong adhesion, excellent tenting properties, and superior substrate conformance. These resists are easy to strip, with... | |
| Product Overview M-Copper EF is the only electroless copper system on the market, sold by an international plating supplier, that can outperform local suppliers at a competitive price in both... | |
| Product Overview M-System integrated desmear-electroless copper was developed using design-for-six-sigma techniques to provide a proven primary metallization system that fits the needs of the industry. The first stage of the... | |
| Product Overview MacuSpec HT 200 is specifically formulated to deliver high microdistribution at higher current densities, enabling increased throughput. This makes it an excellent choice for continuous vertical plating systems. | |
| Product Overview MacuSpec HT 300 is a high-throw Direct Current (DC) acid copper plating process that delivers pulse plating–like performance on thicker boards using standard DC equipment. It produces deposits... | |
| Product Overview MacuSpec HT 360 is a state-of-the-art Direct Current (DC) acid copper plating process that offers greater throwing power at current densities up to 35 ASF in through holes... | |
| Product Overview MacuSpec MPR 100 is a pulse plating process designed as a cost-effective option for mid-aspect ratio technologies, supporting aspect ratios up to 15:1. When used with basic, lower-cost... | |
| Product Overview MacuSpec PPR 100 and 200 are industry-leading pulse plating processes trusted by fabricators worldwide who demand precise thickness uniformity and overall productivity that conventional acid copper plating cannot... | |
| Product Overview MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH series of plating processes. The technology is designed for High-Density Interconnect (HDI) boards that require simultaneous via... | |
| Product Overview MICROFAB AU310-T is a mild alkaline non-cyanide gold electroplating process that produces deposits of 99.99% purity. It enables an arsenic-free bright plating solution with superior surface roughness for... | |
| Product Overview MICROFAB Au3151 enables high-hardness gold bumping through the use of an organic hardness adjuster—something not achievable with conventional gold processes. It is ideal for semiconductor wafer applications requiring... | |
| Product Overview MICROFAB AU660 is a high-purity (99.99%) gold electroplating process frequently used in bump plating on metallized silicon wafers. Designed for backside interconnect (via liner) and fine-pitch pattern gold... | |
| Product Overview MICROFAB CUMSA100 enables high plating rates for high throughput, leading to a lower cost of ownership. This is achieved through a low consumption additive and simple, easy bath... | |
| Product Overview MICROFAB DVF-200 is an acid copper plating process designed to fill TSVs without voids or other defects at high plating speeds. The process is specially formulated for vias... | |
| Product Overview MICROFAB GSW-200 is a mid-purity plating system that works with or without a Ni barrier. Its ability to level pads reduces solder usage, lowering the cost of ownership. | |
| Product Overview MICROFAB MP-2500 is a high-speed copper plating process engineered for mega pillar applications, delivering exceptional Within-Die (WID) and Within-Feature (WIF, TIR) uniformity. Product Features Excellent Uniformity for Thermal... | |
| Product Overview MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It... | |
| Product Overview MICROFAB SC-40 PLUS, a next-generation acid copper plating process, represents a leap forward in semiconductor manufacturing. It provides fabricators with a transformative solution that combines precision, efficiency, and... | |
| Product Overview NEUTRONEX 309 is an alkaline, non-cyanide gold electroplating process specifically optimized for Redistribution Layer (RDL) applications in Wafer-Level Packaging (WLP). Designed for advanced semiconductor manufacturing, it delivers high-purity,... | |
| Product Overview NEUTRONEX STRIKE is a non-cyanide, weakly alkaline gold strike plating process especially suitable for use in non-cyanide gold plating systems. | |
| Product Overview Nickel-Phosphorus Alloy is a sulfamate-based nickel-phosphorus deposit (3–12 wt% P) providing improved corrosion resistance and non-magnetic properties. High-speed capability and a wide plating window enable tight control of... | |
| Product Overview NOVAFAB NANOTWIN Cu is a high-purity copper electroplating process which produces a <111> oriented deposit with a high fraction of nano-twinning. It is specially formulated for the fabrication... | |
| Product Overview NOVAFAB® AG-340 is a cyanide-free electroplating solution specifically engineered for Micro-Electromechani cal Systems (MEMS) and advanced semiconductor wafer plating. This high-performance process provides superior silver deposits with excellent... | |
| Product Overview Our Cobalt Alloy process has a bright yellow deposit with low porosity and high purity. This stable process offers high efficiency and speed at high current densities, with... | |
| Product Overview Our Cobalt or Nickel process is a general-purpose bath suitable for both nickel and cobalt-hardened applications. | |
| Product Overview Our electroless nickel chemistries for memory disks produce high percentages of phosphorous deposits with superior corrosion resistance and excellent thermal magnetic stability. All of our electroless nickel products... | |
| Product Overview Our Eliminator products, used for outerlayer tin stripping, are recognized for their ability to uniformly remove tin while minimizing attack on copper traces. | |
| Product Overview Our high-speed plating and cyanide-based copper strike solutions include: Bright, Matte High-speed copper plating for mid to high current densities, available in either sulfuric acid or Methanesulfonate (MSA)-based... | |
| Product Overview Our matte and bright high-speed tin solutions (Methanesulfonate(MS A)-based) include: Matte (MSA) High-speed, high-efficiency, low-foam electrolytes for the deposition of pure tin across a wide current density range. | |
| Product Overview Our MID LT Nickel 100 is designed for low, medium, and high-phosphorus nickel systems, all offering exceptional stability. Each process delivers excellent thickness uniformity along with corrosion and... | |
| Product Overview Our nickel alloy and pure nickel solutions for improved corrosion resistance include: Nickel-Tungsten Alloy is a sulfamate-based nickel-tungsten deposit (35–45 wt% W) offering enhanced wear and corrosion resistance. | |
| Product Overview Our photoresist developers are highly concentrated aqueous solutions, enabling simple and consistent feed-and-bleed control. Developer 45 Plus includes effective descaling and anti-scumming additives, along with the convenience of... | |
| Product Overview Our portfolio of alloys, baths, and mildly acidic strikes for a range of applications includes: Cobalt Alloy A bright yellow deposit with low porosity and high purity. This... | |
| Product Overview Our portfolio of palladium products includes: Pure A bright, ductile deposit suitable for reel-to-reel or rack-and-barrel applications. Palladium Alloy Available in High Speed (HS), Low Speed (LS), and... | |
| Product Overview Our range of silver and gold electrolytic, immersion, and solvent-based organic post treatment solutions include: Silver Post Treatments Electrolytic, high-speed, water-based organic solution. Electrolytic, high speed, Pd base,... | |
| Product Overview Our silver and gold electrolytic, immersion, and solvent-based organic post treatment solutions include: Silver Post Treatments Electrolytic, high-speed, water-based organic solution. Electrolytic, high speed, Pd base, high heat... | |
| Product Overview Our silver plating portfolio includes: Low Speed A low-speed silver plating process designed for rack-and-barrel applications. High Speed A high-speed silver plating process for reel-to-reel plating using inert... | |
| Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. | |
| Product Overview PC 610 is an industry-leading pulse plating process designed to provide excellent throwing power within through-holes, surface copper thickness, and surface copper variation. The process enhances the reliability... | |
| Product Overview Redistribution layers in Integrated Circuit (IC) substrate manufacturing require metallization of fine structures, such as blind microvias, X-vias, and fine lines and pads. The Systek UVF Series enables... | |
| Product Overview Shadow is an eco-friendly, graphite-based direct metallization process that makes through holes and blind vias extraordinarily conductive for copper electroplating. Its exceptional coating ability is well recognized in... | |
| Product Overview Shadow Plus is a graphite-based, patented wet-etch direct metallization technology designed to provide enhanced reliability for high-density applications. It enables the plating of microvias and through holes using... | |
| Product Overview Systek ETS features: Fine line pattern plating down to 5/5 µm line/space High coplanarity of traces and pads with R-Values < 2 µm Excellent trace profile for controlled... | |
| Product Overview Systek MV 400 is a Direct Current (DC) acid copper pattern plating process specifically designed for 2-in-1 Redistribution Layer (RDL) applications. It consistently fills vias without voids and... | |
| Product Overview Systek SAP begins with a three-step Semi-Additive Process (SAP) desmear process that can be calibrated to optimally prepare multiple substrate materials, depending on the fabricator’s design requirements. First,... | |
| Product Overview Systek THF Series is a copper through hole filling process that enables improved thermal and structural designs for IC substrates. It provides a solid copper-filled through hole in... | |
| Product Overview The award-winning NOVAFAB Fine Grain Copper electroplating process produces a unique film that supports the mechanical and electrical requirements of advanced semiconductor packaging. Engineered for various wafer-level packaging... | |
| Product Overview The Enklad Cleaner-Etch 100 incorporates chemistry that combines both substrate cleaning and etching in one step. Compared to the industry standard equivalent, it produces less pitting in the... | |
| Product Overview The Low Alpha Tin product portfolio includes high-purity, sustainably sourced tin solutions designed for the semiconductor industry. It features tin methanesulfonate and soluble tin anodes, leveraging our vertically... | |
| Product Overview The M-Copper Omega is a high-deposition metallization process that combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional... | |
| Product Overview The MacuSpec AVF series is an advanced family of via-fill copper metallization processes designed for high-density interconnects. AVF technology enables minimal surface copper across a wide range of... | |
| Product Overview The MacuSpec VF Series via-fill copper metallization solutions have been the production-proven standard for more than 20 years, supporting electronic devices used worldwide. With tailored options to suit... | |
| Product Overview The MacuSpec VF-TH Series consists of copper plating baths that can simultaneously fill copper microvias and plate through-holes with aspect ratios up to 5:1 across a wide range... | |
| Product Overview The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The process delivers accurate bump height uniformity and bump shape control. The product is formulated, packaged,... | |
| Product Overview The MICROFAB GSW-100 Copper process has been engineered to produce a low-stress copper deposit in compound semiconductor, backside, and via conformal plating applications. It provides good throwing power... | |
| Product Overview The MICROFAB RDLV 50, 60, and 70 processes are acid copper plating systems designed for simultaneous plating of Redistribution Layer (RDL) lines and filling of vias across a... | |
| Product Overview The MICROFAB SC acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and... | |
| Product Overview The MICROFAB SC-32 acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and... | |
| Product Overview The MICROFAB SC-40 is a high-speed copper plating process designed for copper pillars in flip chip packages, copper microbumps in 3D interconnect packages, and redistribution layers. It ensures... | |
| Product Overview The MICROFAB SC-50 is a high-speed copper plating process designed for copper pillars in flip chip packages, copper microbumps in 3D interconnect packages, and redistribution layers. This low-stress... | |
| Product Overview The MICROFAB SN-300/302 process is a high-speed, Methanesulfonate (MSA)-based pure tin plating solution. It produces fine-grained, matte to semi-bright pure tin deposits. The formulation is designed to provide... | |
| Product Overview The Palladex PC-1 Palladium Cobalt process is specifically designed for the electroplating of the palladium cobalt alloy. The chemistry is formulated to produce bright, ductile deposits that offer... | |
| Product Overview The Systek SAP copper metallization process is a high-performance Semi-Additive Process (SAP) primary metallization for Integrated Circuit (IC) substrates, featuring multiple process improvements. The system is specifically designed... | |
| Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that... | |
| Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. These formulas are optimized for market-leading dry films and are uniquely designed to deliver a high strip... | |
| Product Overview This highly stable electroless nickel process is designed to deposit a smooth, semi-bright, adherent nickel coating. The process delivers consistent deposit brightness throughout the bath life, excellent high-temperature... | |
| Product Overview Via Dep® 4550 electroless copper system is specially designed for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural... | |
| Product Overview ViaForm copper damascene chemistries deliver superior filling performance for wafer fabrication. Each chemistry is specifically designed for manufacturing advanced copper interconnects and provides a high degree of process... |