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MacDermid Alpha Electronics Solutions Datasheets for Thermoset Adhesives

Thermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions.
Thermoset Adhesives: Learn more

Product Name Notes
Product Description Electrolubes ER6003 epoxy potting compound has been specially developed for the LED Industry in India to protect the drivers from the varying environments found on the Indian subcontinent.
Product Description ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold...
Product Description ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It’s a very low viscosity resin system ideal for...
Product Description ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes...
Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke...
Product Description ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It’s a good all round resin offering a cost...
Product Description ER2218 very low viscosity, flame retardant epoxy which has been formulated for use as a potting compound / encapsulation resin. Boasting excellent thermal stability ER2218 has been specifically...
Product Description ER2219 single component epoxy resin is a versatile resin suitable for use as a glob-top resin, or for dipping hybrid circuits and individual components which require discrete concealment.
Product Description ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of...
Product Description ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent...
Product Description ER2223 highly chemical resistant epoxy potting compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It has excellent chemical...
Product Description ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components. The resin has good...
Product Description ER6002LV is a thermally conductive epoxy potting and encapsulation resin designed primarily for use in LED Driver units. ER6002LV has good flow characteristics which allows potting of small...
Product Description GPA is a two part, fast curing epoxy adhesive which was designed for general purpose bonding. The product is suitable for a wide variety of applications due to...