MacDermid Alpha Electronics Solutions Datasheets for Thermoset Adhesives
Thermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions.
Thermoset Adhesives: Learn more
| Product Name | Notes |
|---|---|
| Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable... | |
| Product Overview ATROX CD 590-HT2 is a thermosetting electrically conductive die attach designed for substrate based as well as metal lead frame semiconductor packages. This solution combines high thermal conductivity... | |
| Product Overview ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features Thermal Conductivity... | |
| Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot... | |
| Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow characteristics in automated die attach systems. | |
| Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally demanding semiconductor die attach with good printability. | |
| Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach... | |
| Product Overview STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000... | |
| Product Overview STAYSTIK 482 Thermoplastic Adhesive Film is designed for a range of electronic applications and delivers excellent bonding performance. Suitable for die and/or substrate attach in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 571 is a thermoplastic adhesive designed for a variety of electronic applications. It provides excellent bonding at low process temperatures and features a very low elastic modulus... | |
| Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or Multi-Chip... | |
| Product Overview STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring resistance to high-temperature excursions. It is suitable for die attach in solder-sealed, hermetic packages and delivers low Residual... | |
| Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of electronic applications, offering excellent bonding at low process temperatures and a very low elastic modulus of 60,000... |