Henkel Corporation - Industrial Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver 2.5 cc/5 cc Syringe 1199945

Description
Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver is used to bond difficult-to-wet surfaces. It offers a long work life, electric conductivity, and reduces capacitor shorting problems caused by resin bleed. 2.5 cc/5 cc Syringe.
Request a Quote Datasheet
Description
Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver is used to bond difficult-to-wet surfaces. It offers a long work life, electric conductivity, and reduces capacitor shorting problems caused by resin bleed. 2.5 cc/5 cc Syringe.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver 2.5 cc/5 cc Syringe - 1199945 - Ellsworth Adhesives
Germantown, WI, USA
Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver 2.5 cc/5 cc Syringe
1199945
Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver 2.5 cc/5 cc Syringe 1199945
Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver is used to bond difficult-to-wet surfaces. It offers a long work life, electric conductivity, and reduces capacitor shorting problems caused by resin bleed. 2.5 cc/5 cc Syringe.

Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver is used to bond difficult-to-wet surfaces. It offers a long work life, electric conductivity, and reduces capacitor shorting problems caused by resin bleed. 2.5 cc/5 cc Syringe.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 1199945
Product Name Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver 2.5 cc/5 cc Syringe
Cure / Technology Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Dymax Light-Weld® 401 UV Curing Adhesive Clear 30 mL MR Syringe - 401 30ML MR SYRINGE - Ellsworth Adhesives
Specs
Cure / Technology Single Component
Viscosity 70 cP
Tensile (Break) 4600 psi (31716 KPa)
View Details
Tough Epoxy Polysulfide Adhesive Resists High Temperatures - EP21TPHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Polyphenylene Sulfide; Epoxy
Composition Unfilled
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details