Henkel Corporation - Electronics Liqui-Form 2000 8806383419393

Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000 is a highly conformable shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term performance. Liqui-Form® 2000 is thixotropic and has a natural tack ensuring it forms around the component and stays in place in the application. Your benefits Thermal Conductivity: 2.0 W/m-K Applies very low force on components during assembly Low volumetric expansion Excellent chemical and mechanical stability even at higher temperatures No curing required Stable viscosity in storage and in the application Applications Bare die to heat spreader lid Filling various gaps between heat-generating devices to heat sinks and housings Devices requiring low assembly pressure BGA, PGA, PPGA Liqui-Form 2000 Downloads RoHS Certificate Halogen Testing Report SDS 简体中文 SDS English EU SDS Deutsch SDS Tagalog