Advanced via fill copper metallization processes for high-density interconnects.
Product Overview
The MacuSpec AVF series is an advanced family of via-fill copper metallization processes designed for high-density interconnects. AVF technology enables minimal surface copper across a wide range of plating conditions. Its unique combination of chemical formulation and equipment parameters allows for the plating of a broad range of blind micro via sizes in a single bath—eliminating the need for a flash plate.
The filled micro vias produced by the AVF series offer exceptional repeatability and meet the IPC 6012D 3.2.6.2 standard.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MacuSpec ™ AVF Series |
| Chemical / Composition | Copper Plating |
