MacDermid Alpha Electronics Solutions MacuSpec ™ VF-TH Series

Copper plating baths that can simultaneously fill copper microvias and plate through holes with aspect ratios of up to 8:1. Product Overview The MacuSpec VF-TH Series consists of copper plating baths that can simultaneously fill copper microvias and plate through-holes with aspect ratios up to 5:1 across a wide range of structure sizes, delivering excellent physical properties. Designed for use in VCP or pattern plating modes, the VF-TH Series offers all the advantages of our VF Series baths without the need for pre-dip or flash plating process steps. Superior Physical Properties Copper deposits meet IPC 6012D, DS, and 6013D standards, which require a tensile strength of at least 40,000 PSI and elongation of no less than 18%. Excellent Via Filling The MacuSpec VF-TH Series delivers superior via filling with throwing power of 80–90% in 6:1 aspect ratio holes on boards up to 0.8 mm thick, with no knee thinning. Consistent Reliability Performance MacuSpec VF-TH technology reduces process steps without compromising reliability.