Integrated desmear–electroless copper system designed to plate pure, smooth, dense and uniform copper deposits.
Product Overview
M-System integrated desmear-electroless copper was developed using design-for-six-sigma techniques to provide a proven primary metallization system that fits the needs of the industry. The first stage of the process is a chemical desmear process designed for today’s variety of special resin systems. The process can be tailored to run in vertical or horizontal equipment. The second stage is our advanced electroless copper processes, with options from low build to high build thicknesses.
The core of the process is our M-Condition line of conditioners, selected for various materials including FR-4 epoxies, polyimide, flex or high-frequency, low-loss materials, and our M-Activate system. Together with our patented M-Accelerate system, we offer superior backlight coverage and strong interconnects that consistently survive the stresses of thermal expansion and movement in reflow and assembly. M-Copper processes can be chosen for the specific thickness range desired, based on dwell time and whether processing is vertical or horizontal.
Integrated desmear–electroless copper system designed to plate pure, smooth, dense and uniform copper deposits.
Product Overview
M-System integrated desmear-electroless copper was developed using design-for-six-sigma techniques to provide a proven primary metallization system that fits the needs of the industry. The first stage of the process is a chemical desmear process designed for today’s variety of special resin systems. The process can be tailored to run in vertical or horizontal equipment. The second stage is our advanced electroless copper processes, with options from low build to high build thicknesses.
The core of the process is our M-Condition line of conditioners, selected for various materials including FR-4 epoxies, polyimide, flex or high-frequency, low-loss materials, and our M-Activate system. Together with our patented M-Accelerate system, we offer superior backlight coverage and strong interconnects that consistently survive the stresses of thermal expansion and movement in reflow and assembly. M-Copper processes can be chosen for the specific thickness range desired, based on dwell time and whether processing is vertical or horizontal.
