Nickel sulfamate processes, including boric acid-free options, produce pure, ductile, fine-grained, matte, low-stress deposits.
Product Overview
Our MICROFAB® Nickel solutions include sulfamate nickel, barrier electroplating processes designed to provide pure, ductile, fine-grained, low stress, matte nickel deposits. These processes are developed to meet the needs of the semiconductor industry for quality assured chemistry. Our MICROFAB Nickel solutions include MICROFAB EVF NiBAR, MICROFAB Ni-200, and MICROFAB Ni-100.
Barrier Technology for High Performance Packages
MICROFAB Nickel solutions provide high speed deposition with bright, smooth, stress tunable, fine-grained deposits.
Boric Acid-Free Options for Regulatory Compliance
MICROFAB EVF NiBAR is the leading boric acid-free electrolytic nickel for barrier, via fill, bump, UBM and RDL applications.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | Nickel Solutions |
| Chemical / Composition | Hard Nickel Plating |
