MacDermid Alpha Electronics Solutions ViaForm ®

Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication. Product Overview ViaForm copper damascene chemistries deliver superior filling performance for wafer fabrication. Each chemistry is specifically designed for manufacturing advanced copper interconnects and provides a high degree of process control. ViaForm enables robust interconnect fill capability, ensuring superior device yield and reliability. Unique Custom Solutions Custom solution packages leveraging the latest ViaForm products, developed through close customer collaboration. Pioneering Advanced Copper Technologies ViaForm delivers fast, void-free fill with a broad operating window, excellent across wafer uniformity, and customized impurity control to meet reliability needs. Best-in-class Manufacturing Capability ViaForm chemistry is produced in our high-volume manufacturing (HVM) and advanced research facilities.