High-speed copper plating process for copper pillars in flip chip packages, microbumps in 3D interconnects, and RDL.
Product Overview
The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The process delivers accurate bump height uniformity and bump shape control. The product is formulated, packaged, and quality controlled according to the needs of the semiconductor industry.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MICROFAB ® CU1000 |
