It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling performance, with excellent chemical resistance.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | DM-6309 |
| Product Name | Casting Resins |
| Cure / Technology | Heat Curing |
