The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material has excellent mechanical properties and can protect solder joints during thermal cycling.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | DM-6310 |
| Product Name | Underfill Epoxy |
| Cure / Technology | Heat curing |
