It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | DM-6307 |
| Product Name | Sealers and Seal Coatings |
| Cure / Technology | Thermoset; Single Component; Heat Curing |
