One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | DM-6303 |
| Product Name | Underfill Epoxy |
| Cure / Technology | Heat curing |
