The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has a higher glass transition temperature and higher fracture toughness, and can provide good protection for solder joints during thermal cycling.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | DM-6320 |
| Product Name | Underfill Epoxy |
| Cure / Technology | Heat curing |
