Hysol GR725LS is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.
| Henkel Corporation - Electronics | |
|---|---|
| Product Category | Molding Compounds and Resins |
| Product Number | 8799550406657 |
| Product Name | Hysol GR725LS |
| Industry | Electronics |
