Henkel Corporation - Electronics Hysol GR9810-1 8799373819905

Description
Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low warpage. Hysol® GR9810-1 is a “green” (non Antimony/ Bromine/Phosphorous) molding compound and is capable of achieving JEDEC Level 2 requirements (substrate dependent), at 260ºC reflow temperature.
  • Hysol GR9810-1 - 8799373819905 - Henkel Corporation - Electronics
    Henkel Corporation - Electronics
Description
Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low warpage. Hysol® GR9810-1 is a “green” (non Antimony/ Bromine/Phosphorous) molding compound and is capable of achieving JEDEC Level 2 requirements (substrate dependent), at 260ºC reflow temperature.

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Hysol GR9810-1 - 8799373819905 - Henkel Corporation - Electronics
Henkel Corporation - Electronics
Irvine, CA, USA
Hysol GR9810-1
8799373819905
Hysol GR9810-1 8799373819905
Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low warpage. Hysol® GR9810-1 is a “green” (non Antimony/ Bromine/Phosphorous) molding compound and is capable of achieving JEDEC Level 2 requirements (substrate dependent), at 260ºC reflow temperature.

Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low warpage. Hysol® GR9810-1 is a “green” (non Antimony/ Bromine/Phosphorous) molding compound and is capable of achieving JEDEC Level 2 requirements (substrate dependent), at 260ºC reflow temperature.

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Technical Specifications

  Henkel Corporation - Electronics
Product Category Molding Compounds and Resins
Product Number 8799373819905
Product Name Hysol GR9810-1
Chemical System Epoxy
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